Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
05/2012
05/30/2012CN102479888A 在两光学透镜及分隔环界定的槽间中填注并密封荧光层的方法 In filling in the partition between the two optical lens and the ring groove defined and sealed fluorescent layer method
05/30/2012CN102479872A Manufacture method of sink mark type luminous module of luminous solar battery
05/30/2012CN102479871A Manufacturing method of light-emitting module of light-emitting solar cell for build facades
05/30/2012CN102479870A Method for manufacturing luminous module in specific position of luminous solar battery
05/30/2012CN102479852A Dent-type light-emitting module of light-emitting solar cell applied to build facade
05/30/2012CN102479851A Luminous module for luminous solar battery applied to building facades
05/30/2012CN102479841A Non-transparent light-emitting solar cell applied to wall surfaces of building
05/30/2012CN102479830A Solar cell unit capable of carrying out programmed luminescence
05/30/2012CN102479829A Programmable luminous full-color display solar cell
05/30/2012CN102479828A Vertical-barred solar cell capable of programmatically emitting light
05/30/2012CN102479786A 发光模块及交流发光装置 Light-emitting device emitting module and communication
05/30/2012CN102479785A 具有沉积式荧光披覆层的发光结构及其制作方法 Light-emitting structure and a method of preparing coated layer deposited fluorescent
05/30/2012CN102479784A 用以形成白光的发光二极管模块 To form a white light emitting diode module
05/30/2012CN102479783A 用以提升发光效率的发光二极管模块 To enhance the luminous efficiency of the light emitting diode module
05/30/2012CN102479782A 具荧光层的发光二极管模块 A phosphor layer emitting diode module
05/30/2012CN102479781A 用以形成白光的发光二极管模块 To form a white light emitting diode module
05/30/2012CN102479780A 用以形成白光的发光二极管模块 To form a white light emitting diode module
05/30/2012CN102479779A 用以形成白光的发光二极管模块 To form a white light emitting diode module
05/30/2012CN102479778A 用以形成白光的发光二极管模块 To form a white light emitting diode module
05/30/2012CN102479777A 用以形成白光的发光二极管模块 To form a white light emitting diode module
05/30/2012CN102479776A 一种基于铕配合物的红色发光器件 Red light emitting device based on europium complexes
05/30/2012CN102479775A Cell module group assembled with two or more solar cells
05/30/2012CN102479763A Stackable semiconductor assembly with bump/flange heat spreader and dual build-up circuitry
05/30/2012CN102102862B Method for packing micro-volume multi-LED (Light-Emitting Diode) integrated unit
05/30/2012CN101911271B Electronic component
05/30/2012CN101826515B 半导体集成电路器件 The semiconductor integrated circuit device
05/30/2012CN101779302B Optical element coupled to low profile side emitting led
05/30/2012CN101714513B Method for producing the semiconductor device
05/30/2012CN101713521B Alternating-current light emitting diode structure
05/30/2012CN101661929B Stacked type chip package structure and stack type chip package structure
05/30/2012CN101635294B Light emission device
05/30/2012CN101582414B Power module by directly bonding power terminal
05/30/2012CN101582413B Power module with lower stray inductance
05/30/2012CN101521198B Electronic device
05/30/2012CN101436589B Semiconductor module and image pickup apparatus
05/30/2012CN101399258B 半导体装置 Semiconductor device
05/30/2012CN101335262B Stack package and method for manufacturing the same
05/30/2012CN101217140B Package structures
05/30/2012CN101000907B Semiconductor device, manufacturing method of semiconductor device
05/29/2012US8191033 In situ clock jitter measurement
05/29/2012US8191025 Redundancy structures and methods in a programmable logic device
05/29/2012CA2393007C Micro-led arrays with enhanced light extraction
05/24/2012WO2012067990A1 Microelectronic package with terminals on dielectric mass
05/24/2012WO2012067679A1 Multichip module for communications
05/24/2012WO2012066833A1 Semiconductor device
05/24/2012WO2012038483A3 Optoelectronic semiconductor device
05/24/2012US20120126900 Semiconductor device
05/24/2012US20120126874 Integrated circuit
05/24/2012US20120126429 Semiconductor Device and Method of Forming Base Substrate with Recesses for Capturing Bumped Semiconductor Die
05/24/2012US20120126389 Enhanced stacked microelectronic assemblies with central contacts and vias connected to the central contacts
05/24/2012US20120126230 Method for manufacturing a semiconductor chip stack device
05/24/2012DE202012003706U1 LED-Leuchtmittelsockel LED Lamp Socket
05/24/2012DE112010000026T5 Halbleitermodul Semiconductor module
05/24/2012DE102011086473A1 Halbleiterpackung und -modul, Herstellungsverfahren und elektronisches Bauelement Semiconductor package and modulus, manufacturing processes and electronic component
05/24/2012DE102011078811B3 Leistungselektronisches System mit einer Kühleinrichtung Power electronic system with a cooling device
05/24/2012DE102010061848A1 LED-Modul mit vorgefertigtem Element LED module with prefabricated element
05/24/2012DE102010061801A1 LED-Modul mit gemeinsamem Farbumwandlungsmodul für wenigstens zwei LED-Chips LED module with common color conversion module for at least two LED chips
05/24/2012DE102010029526B4 Halbleiterbauelement mit einer gestapelten Chipkonfiguration mit einem integrierten Peltier-Element A semiconductor device comprising a stacked chip configuration with an integrated Peltier element
05/23/2012EP2455969A2 Light emitting device
05/23/2012EP2455968A1 Batch fabricated 3d interconnect
05/23/2012EP2455331A2 Systems and methods for a three-layer chip-scale MEMS device
05/23/2012EP2455330A2 Systems and methods for a four-layer chip-scale MEMS device
05/23/2012EP2455329A2 Vibration isolation interposer die
05/23/2012EP2454753A2 Color temperature variable light emitter
05/23/2012CN202231656U Novel MOSFMAT (Metal-Oxide-Semiconductor Field-Effect Transistor) module with test circuit
05/23/2012CN202231655U Novel MOSFMT module
05/23/2012CN202231056U Improved integrally-packaged light-emitting diode (LED) module
05/23/2012CN202231011U Integrated circuit for switch power supply
05/23/2012CN202231010U Novel integrated LED (light emitting diode) package structure
05/23/2012CN202231009U Novel fluorescent powder-free dual wavelength blended white-light LED encapsulation
05/23/2012CN1945822B Semiconductor device, semiconductor module and semiconductor module producing method
05/23/2012CN1692685B Module comprising built-in electronic components
05/23/2012CN102473704A 用于制造发光机构的方法和发光机构 And a method for manufacturing the light emitting mechanism of the light emitting bodies
05/23/2012CN102473703A Lighting device having first, second and third groups of solid state light emitters, and lighting arrangement
05/23/2012CN102473702A 色温可变发光器 Variable color temperature of light emitters
05/23/2012CN102473701A Multicolor light emitting diodes
05/23/2012CN102473700A Resin-sealed semiconductor device and method for manufacturing same
05/23/2012CN102473688A Insulation circuit board, and power semiconductor device or inverter module using the same
05/23/2012CN102473684A System-in packages
05/23/2012CN102473653A Semiconductor device production method and semiconductor device
05/23/2012CN102468409A Light emitting diode components integrated with thermoelectric devices and method of manufacturing the same
05/23/2012CN102468395A 一种陶瓷基板led装置 A ceramic substrate led unit
05/23/2012CN102468375A Light-emitting diode packaging structure and manufacturing method thereof
05/23/2012CN102468295A Semiconductor module having an insert and method for producing a semiconductor module having an insert
05/23/2012CN102468294A 一种集成大功率三极管 An integrated power transistor
05/23/2012CN102468293A 直接电性连接于交流电源的多晶封装结构 Directly electrically connected to the AC power polycrystalline package structure
05/23/2012CN102468292A 一种用于直流-直流转换器的封装体结构 Package structure dc converters - for DC
05/23/2012CN102468291A Light emitting device and manufacturing method of the same
05/23/2012CN102468290A LED device with improved thermal performance
05/23/2012CN102468289A 发光二极管阵列 Light-emitting diode array
05/23/2012CN102468288A 发光二极管模组 Light-emitting diode module
05/23/2012CN102468287A Led模组及其制造方法 Led module and manufacturing method
05/23/2012CN102468286A 一种集成式led光源以及光源的制作方法 Production methods as well as an integrated led light source
05/23/2012CN102468285A Power module using sintering die attach and manufacturing method thereof
05/23/2012CN102468284A Stacked semiconductor device and method for manufacturing same
05/23/2012CN102468283A Memory device and method of manufacturing the same, memory system and multilayer device
05/23/2012CN102468282A 3D semiconductor device and method for fabricating the same
05/23/2012CN102468281A Semiconductor device and method of forming the same
05/23/2012CN102468280A Three-dimensional semiconductor devices
05/23/2012CN102468279A Integrated circuit device and method for preparing the same
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