Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
11/2012
11/29/2012US20120299191 Semiconductor Device and Method of Forming EWLB Package Containing Stacked Semiconductor Die Electrically Connected Through Conductive Vias Formed in Encapsulant Around Die
11/29/2012US20120299169 Stacked wafer level package having a reduced size
11/29/2012US20120299168 Integrated circuit packaging system with vertical interconnects and method of manufacture thereof
11/29/2012US20120299145 Apparatus for three-dimensional integrated circuit device fabrication including wafer scale membrane
11/29/2012DE112006002702B4 Lichtemittierende Anordnung für Wechselstrom mit darin gebildeter Brückengleichrichschaltung und gruppierten lichtemittierenden Zellen AC light emitting device having formed therein bridge rectifier circuit and grouped light emitting cells
11/29/2012DE102012208745A1 Elektrisch gekühltes Stromversorgungsmodul Electrically cooled power supply module
11/29/2012DE102012208633A1 Leistungshalbleitermodul mit eingebettetem Chipgehäuse The power semiconductor module with an embedded chip package
11/29/2012DE102011102567A1 Beleuchtungseinrichtung Lighting device
11/29/2012DE102011102350A1 Optisches Element, optoelektronisches Bauelement und Verfahren zur Herstellung dieser Optical element, opto-electronic device and method for producing these
11/29/2012DE102011076425A1 Halbleiter-Leuchtvorrichtung und Verfahren zum Herstellen einer Halbleiter-Leuchtvorrichtung Semiconductor light-emitting device and method for fabricating a semiconductor light-emitting device
11/29/2012DE102011076325A1 Leistungselektronisches System mit Subsystemen und einer Kühleinrichtung Power electronic system comprising subsystems, and a cooling device
11/29/2012DE102011076324A1 Leistungselektronisches System mit Verbindungseinrichtung erster und zweiter Subsysteme Power electronic system with connection means, first and second subsystems
11/29/2012DE102011076323A1 Leistungselektronisches System mit erstem und zweitem Subsystem Electronic power system having first and second subsystem
11/28/2012EP2528122A1 Light emitting device
11/28/2012EP2528095A1 High performance electronic system with first and second subsystem
11/28/2012EP2528094A1 Power semiconductor module, power conversion device, and rail car
11/28/2012EP2528093A1 Semiconductor device, solid-state imaging device, and camera system
11/28/2012EP2528092A1 Semiconductor device
11/28/2012EP2528090A1 Semiconductor component and method for its manufacture
11/28/2012CN202564438U LED packaging structure
11/28/2012CN202564373U Pull-clamping type thin light emitting diode (LED) surface-mount structure
11/28/2012CN202564281U 半导体模块 Semiconductor Modules
11/28/2012CN102804375A Cooling of electrical components
11/28/2012CN102804368A Semiconductor device
11/28/2012CN102800785A Separating dimmable surface-mounted light emitting diode (SMDLED) incandescent lamp
11/28/2012CN102800774A Method of preparing carbon thin film, and electronic device and electrochemical devices each including the carbon thin film
11/28/2012CN102800766A Systems and Methods Providing Semiconductor Light Emitters
11/28/2012CN102800715A Avalanche photodiode and avalanche photodiode array
11/28/2012CN102800664A LED (light-emitting diode) single lamp used for promoting plant growth and production process thereof
11/28/2012CN102800663A Bat-wing lens design with multi-die
11/28/2012CN102800662A Layered semiconductor device and manufacturing method thereof
11/28/2012CN102800661A Solar cell module
11/28/2012CN102800660A Module and method of manufacturing a module
11/28/2012CN102800659A Resin-sealed electronic controller and method of fabricating the same
11/28/2012CN102800641A Semiconductor flip chip combining structure and method
11/28/2012CN102800638A High performance electronic system with first and second subsystem
11/28/2012CN102800637A Power electronics system with connectors between first and second subsystem
11/28/2012CN102798024A Multicolor-integrated LED (Light Emitting Diode) device
11/28/2012CN102798015A Patch type LED (Light-Emitting Diode) luminescent device
11/28/2012CN102157509B Light mixing type light-emitting diode encapsulation structure capable of improving color rendering
11/28/2012CN102110757B White light LED and packaging method thereof
11/28/2012CN102044537B Light-emitting diode packaging structure
11/28/2012CN101826492B Chip-suspension-type packaging heat dissipation improved structure of semiconductor
11/28/2012CN101536185B Adhesive tape and semiconductor device using the same
11/27/2012US8319521 Safe programming of key information into non-volatile memory for a programmable logic device
11/27/2012US8319350 Adhesive tape and semiconductor device using the same
11/27/2012US8318057 Method for replicating optical elements, particularly on a wafer level, and replicas formed thereby
11/22/2012WO2012157584A1 Semiconductor device and manufacturing method thereof
11/22/2012WO2012157583A1 Semiconductor device and manufacturing method thereof
11/22/2012WO2012157373A1 Circuit substrate for large-capacity module periphery circuit, and large-capacity module including periphery circuit employing circuit substrate
11/22/2012WO2012157167A1 Three-dimensional integrated circuit, processor, semiconductor chip, and method for manufacturing three-dimensional integrated circuit
11/22/2012WO2012157069A1 Power module
11/22/2012WO2012156217A1 Mixed light source
11/22/2012WO2012155858A1 Chip stacking
11/22/2012WO2012155799A1 Luminescent pipe with ellipsoidal-surface lens
11/22/2012US20120293210 Semiconductor integrated circuit
11/22/2012US20120293208 Semiconductor Device
11/22/2012US20120293207 Semiconductor integrated circuit
11/22/2012US20120292746 Semiconductor devices including stress relief structures
11/22/2012US20120292745 Semiconductor Device and Method of Forming 3D Semiconductor Package with Semiconductor Die Stacked Over Semiconductor Wafer
11/22/2012US20120292646 Semiconductor light emitting device, method of manufacturing the same, and lighting apparatus and display apparatus using the same
11/22/2012DE202012009416U1 Leuchtvorrichtung Lighting device
11/22/2012DE102011102032A1 Optoelektronisches Halbleitermodul und Display mit einer Mehrzahl derartiger Module An optoelectronic semiconductor module and display with a plurality of such modules
11/22/2012DE102011101645A1 Mischlichtquelle Mixed light source
11/22/2012DE102011075921A1 Leistungshalbleitermodul und Leistungshalbleitermodulsystem The power semiconductor module and power semiconductor module system
11/21/2012EP2525404A1 Power semiconductor module
11/21/2012EP2525403A1 Waterfall wire bonding
11/21/2012CN202549932U High luminous efficiency integrated LED component
11/21/2012CN202549929U Multi chips on board (MCOB) packaging structure being efficient in heat dissipation
11/21/2012CN202549928U MCOB (multichip on board) encapsulation device provided with doped fluorescent powder
11/21/2012CN202549842U 半导体模块 Semiconductor Modules
11/21/2012CN202549841U 半导体模块 Semiconductor Modules
11/21/2012CN202549840U Multi-wafer integration type white-light light emitting diode (LED) packaging structure
11/21/2012CN202549839U Novel LED (Light-Emitting Diode) light-emitting chip and LED lamp formed by assembling same
11/21/2012CN202549838U LED packaging structure containing silver heat exchange layer
11/21/2012CN202549837U White light LED (Light-Emitting Diode)
11/21/2012CN202549836U Light emitting diode
11/21/2012CN202549835U High-color rendering LED (light emitting diode) packaging module
11/21/2012CN202549834U Silicon stack for industrial microwave equipment
11/21/2012CN202549833U Patch high voltage silicon rectifier tack
11/21/2012CN202549832U Cantilever-type stacked integrated circuit (IC) chip packaging piece based on barium titanate (BT) substrate
11/21/2012CN102792789A Module
11/21/2012CN102792439A Reducing susceptibility to electrostatic discharge damage during die-to-die bonding for 3-D packaged integrated circuits
11/21/2012CN102790513A Power supply module and packaging method thereof
11/21/2012CN102790046A Combining template for photovoltaic lamination laying of batteries
11/21/2012CN102790045A Light emitting diode array and manufacturing method thereof
11/21/2012CN102790044A Ultrathin full-wave rectifier
11/21/2012CN102790043A Power semiconductor
11/21/2012CN102790042A Semiconductor chip stacking structure
11/21/2012CN102790041A Stacked semiconductor package
11/21/2012CN102790029A Power semiconductor module and power semiconductor module system
11/21/2012CN102786883A Electrode tape, solar cell module and methods for manufacturing the same
11/21/2012CN102176432B Photodetector with digital three-dimensional package assembly
11/21/2012CN102074559B SiP (Session Initiation Protocol) system integrated-level IC (Integrated Circuit) chip packaging part and manufacturing method thereof
11/21/2012CN102024801B Ultrathin chip perpendicular interconnection packaging structure and manufacture method thereof
11/21/2012CN101740560B Light-emitting apparatus, backlight apparatus, and display apparatus
11/21/2012CN101577270B Semi-conductor luminescence component
11/21/2012CN101504939B 半导体器件 Semiconductor devices
11/21/2012CN101419957B Semiconductor device and fabrication process thereof
11/21/2012CN101355067B Improved electrical connections for multichip modules
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