| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 07/18/2012 | CN102593325A LED light source module packaging structure |
| 07/18/2012 | CN102593321A LED (light emitting diode) packaging method, LED packaging structure and display screen |
| 07/18/2012 | CN102593310A Wafer-type luminous device having wavelength conversion layer coated precisely |
| 07/18/2012 | CN102593167A Semiconductor devices and power conversion systems |
| 07/18/2012 | CN102593116A Thinned image capture module and manufacturing method thereof |
| 07/18/2012 | CN102593115A LED surface-mounted device and manufacturing method thereof |
| 07/18/2012 | CN102593114A SMD (surface mount device) LED (light-emitting diode) of combined type wire frame |
| 07/18/2012 | CN102593113A Light emitting diode packaging structure and light emitting diode crystal grains thereof |
| 07/18/2012 | CN102593112A High frequency voltage doubling rectifier module |
| 07/18/2012 | CN102593111A IGBT (insulated gate bipolar transistor) module and manufacturing method of IGBT module |
| 07/18/2012 | CN102593110A Laminated inverted chip packaging structure of ultra-fine spacing welding plates and bottom filling material preparation method |
| 07/18/2012 | CN102593109A Stack-based organic light emitting diode |
| 07/18/2012 | CN102593108A 功率半导体封装结构及其制造方法 Power semiconductor package structure and method for manufacturing |
| 07/18/2012 | CN102593071A Packaging structure of power tube of welding machine |
| 07/18/2012 | CN102593021A Heat conduction for chip stacks and 3-D circuits |
| 07/18/2012 | CN102148222B Semiconductor structure and semiconductor packaging structure having proximity communication signal input ends |
| 07/18/2012 | CN102088017B LED SMD (surface mount type)packaging module |
| 07/18/2012 | CN101996985B Light-emitting diode (LED) encapsulation structure capable of positioning heat-conducting adhesive material and manufacturing method thereof |
| 07/18/2012 | CN101904006B LED chip with overvoltage protection |
| 07/18/2012 | CN101771026B Multi-die building block for stacked-die package |
| 07/18/2012 | CN101677097B Optical package element, display device, and electronic apparatus |
| 07/18/2012 | CN101669197B Method for bonding semiconductor wafers and method for manufacturing semiconductor device |
| 07/18/2012 | CN101552265B Radiation image device |
| 07/18/2012 | CN101536186B Optical element for a light-emitting diode, light-emitting diode, led arrangement and method for producing an led arrangement |
| 07/18/2012 | CN101510544B Integrated front-end passive equalizer and method thereof |
| 07/18/2012 | CN101399250B Semiconductor chip and semiconductor device having a plurality of semiconductor chips |
| 07/18/2012 | CN101350345B 半导体器件 Semiconductor devices |
| 07/18/2012 | CN101286619B Optical module |
| 07/17/2012 | US8223578 Semiconductor device including multi-chip |
| 07/17/2012 | US8222734 Hybrid integrated circuit device and electronic device |
| 07/12/2012 | WO2012093690A1 Manufacturing method for electronic component module, and electronic component module |
| 07/12/2012 | WO2012093521A1 Semiconductor device and manufacturing method thereof |
| 07/12/2012 | WO2012093509A1 Semiconductor device and method of manufacturing thereof |
| 07/12/2012 | WO2012093065A1 Led arrangement for generating white light |
| 07/12/2012 | US20120176193 Driver for a semiconductor chip |
| 07/12/2012 | US20120176192 Self-Identifying Stacked Die Semiconductor Components |
| 07/12/2012 | US20120176189 Reduced swing signal |
| 07/12/2012 | US20120176144 At-speed scan enable switching circuit |
| 07/12/2012 | US20120175771 Semiconductor Device and Method of Forming No-Flow Underfill Material Around Vertical Interconnect Structure |
| 07/12/2012 | US20120175754 Wiring board |
| 07/12/2012 | US20120175746 Selective Deposition in the Fabrication of Electronic Substrates |
| 07/12/2012 | DE102009002191B4 Leistungshalbleitermodul, Leistungshalbleitermodulanordnung und Verfahren zur Herstellung einer Leistungshalbleitermodulanordnung The power semiconductor module, the power semiconductor module assembly and method of manufacturing a power semiconductor module assembly |
| 07/11/2012 | EP2475006A1 Semiconductor light emitting device, method of manufacturing the same, and lighting apparatus and display apparatus using the same |
| 07/11/2012 | EP2474049A1 Optoelectronic module comprising at least one first semiconductor body having a radiation outlet side and an insulation layer and method for the production thereof |
| 07/11/2012 | EP2474031A1 Potted optoelectronic module having a plurality of semiconductor components and method for producing an optoelectronic module |
| 07/11/2012 | EP2474030A1 Using interrupted through-silicon-vias in integrated circuits adapted for stacking |
| 07/11/2012 | DE202007019433U1 Licht emittierende Vorrichtung mit vertikaler Struktur, und Baugruppe hiervon Light emitting device having a vertical structure, and assembly thereof |
| 07/11/2012 | CN202334419U 电动汽车用低压大功率无刷直流电机控制器 Low-power electric vehicles with brushless DC motor controller |
| 07/11/2012 | CN202332967U 发光二极管封装结构 Light emitting diode package structure |
| 07/11/2012 | CN202332954U Antistatic LED (light emitting diode) packaging structure |
| 07/11/2012 | CN202332950U 一种出光效果均匀的大功率led封装结构 A light effect uniform package structure of power led |
| 07/11/2012 | CN202332848U Surface light-emitting device |
| 07/11/2012 | CN202332847U 电动汽车用电机控制器的mosfet功率驱动部分的结构 Electric vehicle motor controller driver mosfet power moieties |
| 07/11/2012 | CN202332846U Led与散热装置的结合总成 Led combined with the heat sink assembly |
| 07/11/2012 | CN202332845U 高光效led平面光源 High efficiency led flat light source |
| 07/11/2012 | CN202332844U 电力电子模块专用方型整流芯片 Power electronics module dedicated rectangular chip rectifier |
| 07/11/2012 | CN202332843U 矮本体整流桥堆 Low body bridge rectifier |
| 07/11/2012 | CN202332842U 灌封单相扁形整流桥堆 Potting flat single phase bridge rectifier |
| 07/11/2012 | CN202332841U 三相整流桥堆 Three-phase bridge rectifier |
| 07/11/2012 | CN202332840U Single-phase rectification bridge stack |
| 07/11/2012 | CN202332187U 一种图形化led集成封装结构 A graphical led integrated package structure |
| 07/11/2012 | CN202327737U LED lamp |
| 07/11/2012 | CN102577635A Light-source module and light-emitting device |
| 07/11/2012 | CN102576790A Optoelectronic component |
| 07/11/2012 | CN102576707A Optoelectronic module |
| 07/11/2012 | CN102576706A 半导体器件 Semiconductor devices |
| 07/11/2012 | CN102576705A Circuit arrangement and manufacturing method thereof |
| 07/11/2012 | CN102576704A Semiconductor device |
| 07/11/2012 | CN102576564A Vertically stackable dies having chip identifier structures |
| 07/11/2012 | CN102575829A Light source |
| 07/11/2012 | CN102569626A Multichip integrated packaged light emitting diode (LED) |
| 07/11/2012 | CN102569609A Light-emitting Device |
| 07/11/2012 | CN102569602A Graphite light-emitting diode (LED) device |
| 07/11/2012 | CN102569596A Light-emitting diode module |
| 07/11/2012 | CN102569561A Method for producing multi-group and multi-section LED (Light-Emitting Diode) |
| 07/11/2012 | CN102569287A Semiconductor light source module and manufacturing method thereof |
| 07/11/2012 | CN102569286A 3D power module package |
| 07/11/2012 | CN102569285A Solar refrigeration and heating automatic temperature control vacuum glass |
| 07/11/2012 | CN102569284A Novel light-emitting diode (LED) light-emitting chip and LED lamp formed by assembling LED light-emitting chips |
| 07/11/2012 | CN102569283A Light-emitting diode |
| 07/11/2012 | CN102569282A Light and color adjustable light-emitting diode (LED) structure |
| 07/11/2012 | CN102569281A Integratedly-packaged LED bracket |
| 07/11/2012 | CN102569280A Light emitting device and method for manufacturing the same |
| 07/11/2012 | CN102569279A LED (light-emitting diode) with improved color rendering index and light emitting efficiency and method for improving color rendering index and light emitting efficiency of LED |
| 07/11/2012 | CN102569278A Light emitting device and illumination device |
| 07/11/2012 | CN102569277A LED package and manufacturing method thereof |
| 07/11/2012 | CN102569276A Insulated gate bipolar transistor (IGBT) module |
| 07/11/2012 | CN102569275A Stacking type semiconductor packaging structure and manufacturing method thereof |
| 07/11/2012 | CN102569274A Semiconductor package structure and manufacturing method thereof |
| 07/11/2012 | CN102569273A Surface mountable devices and methods for manufacturing the same |
| 07/11/2012 | CN102569272A Multilayer spacer type IC (Integrated Circuit) chip stacked package of substrate and production method of package |
| 07/11/2012 | CN102569271A High-reliability high-power insulated gate bipolar transistor (IGBT) module |
| 07/11/2012 | CN102569270A Stacked Chip Packaging Structure, Synchronous Rectifying Module And Converter Module |
| 07/11/2012 | CN102569269A Semiconductor chip, stacked chip semiconductor package including the same, and fabricating method thereof |
| 07/11/2012 | CN102569268A Semiconductor device and method for manufacturing same |
| 07/11/2012 | CN102569256A Resin sealed semiconductor device and manufacturing method therefor |
| 07/11/2012 | CN102569246A Element carrier and light receiving module |
| 07/11/2012 | CN102569241A Multi-chip module (MCM) power quad flat no-lead (PQFN) semiconductor package utilizing a leadframe for electrical interconnections |
| 07/11/2012 | CN102569224A Circuit carrier with high heat dissipation performance and related circuit modules |
| 07/11/2012 | CN102569208A Semiconductor packages and methods of fabricating the same |