Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
06/2012
06/07/2012WO2012074636A1 Stackable semiconductor chip with edge features and methods of fabricating and processing same
06/07/2012WO2012074619A1 Multi-die integrated circuit structure with underfill
06/07/2012WO2012074571A1 Microelectronic assembly with plural stacked active chips having through - silicon vias formed in stages
06/07/2012WO2012073572A1 Semiconductor device, and process for manufacture of semiconductor device
06/07/2012WO2012073571A1 Power conversion device
06/07/2012WO2012073570A1 Electrical power convertor apparatus
06/07/2012WO2012073306A1 Power module
06/07/2012WO2012072448A1 Luminous device and process for producing a luminous device
06/07/2012WO2012038869A3 Segmented spotlight having narrow beam size and high lumen output
06/07/2012WO2012037216A3 Staged via formation from both sides of chip
06/07/2012US20120139568 Semiconductor device including integrated circuit
06/07/2012US20120139130 Semiconductor Device
06/07/2012US20120138996 Semiconductor Light Emitting Devices and Submounts
06/06/2012EP2461381A2 Emission device with light source and light flux control member
06/06/2012EP2461380A2 Light emitting device package and manufacturing method thereof
06/06/2012EP2461362A1 Photovoltaic solar panel with thin-layer diodes
06/06/2012EP2460193A1 Solid state lighting devices including light mixtures
06/06/2012EP2460180A1 System-in packages
06/06/2012EP1709693B1 Semiconductor structure comprising light-emitting zones and absorption layer
06/06/2012EP1583147B1 Full-color flexible semiconductor light source device
06/06/2012DE102011086407A1 Leistungshalbleitermodul The power semiconductor module
06/06/2012DE102010053392A1 Tub-shaped power semiconductor module for circuit device utilized in electrical system of e.g. electric vehicle, has multiple power terminals and control and auxiliary terminal arranged on tub walls
06/06/2012CN202268391U Cob面光源封装结构 Cob surface light source package structure
06/06/2012CN202268349U Led支架及led Led bracket and led
06/06/2012CN202268348U 高对比度高光效全彩led器件 High contrast high-efficiency full color led Devices
06/06/2012CN202268347U 兼具整流的发光二极管装置 Light emitting diode means for rectifying both
06/06/2012CN202268346U 匀光型led灯珠 Dodging type led lamp beads
06/06/2012CN202267007U 一种led日光灯cob光源 One kind cob led fluorescent light
06/06/2012CN102487063A LED (Light-Emitting Diode) array packaging structure with microstructure silica-gel lens
06/06/2012CN102487062A Light-emitting diode
06/06/2012CN102487061A Light-emitting diode packaging structure
06/06/2012CN102487060A Light emitting diode
06/06/2012CN102487051A 半导体装置及其制造方法 Semiconductor device and manufacturing method
06/06/2012CN101964383B Method for preventing interference among chips and multi-chip LED encapsulation module
06/06/2012CN101651134B Observing an internal link via a second link
06/06/2012CN101617404B 半导体装置 Semiconductor device
06/06/2012CN101447276B Electric device
06/05/2012US8195857 Coupling devices, system comprising a coupling device and method for use in a system comprising a coupling device
06/05/2012US8193693 Image display device and light emission device
06/05/2012US8193635 Integrated circuit having memory and router disposed thereon and method of making thereof
06/05/2012US8193510 Radiation detector
06/05/2012US8192053 High efficiency solid-state light source and methods of use and manufacture
05/2012
05/31/2012WO2012070261A1 Semiconductor device and method for manufacturing semiconductor device
05/31/2012WO2012069450A1 Led module with common color conversion material for at least two led chips
05/31/2012WO2012068762A1 Ic chip package of sip system integration level and manufacturing method thereof
05/31/2012US20120135569 Stacked microelectronic dies and methods for stacking microelectronic dies
05/31/2012US20120134154 Configuration of Multiple LED Module
05/31/2012DE102011054886A1 Halbleitervorrichtungen und Verfahren zum Steuern der Temperatur davon Semiconductor devices and methods for controlling the temperature thereof
05/31/2012DE102011002005A1 Halbleitermodul und motorisierte Gerätschaft, die dieses verwendet A semiconductor device module and motorized shaft, which uses this
05/31/2012DE102010062158A1 Leuchtvorrichtung und Verfahren zum Herstellen einer Leuchtvorrichtung A lighting apparatus and method for manufacturing a lighting device
05/31/2012DE102010050315B4 Verfahren zur Herstellung von gesinterten, elektrischen Baugruppen und damit hergestellte Leistungshalbleitermodule A process for preparing sintered, electrical subassemblies and power semiconductor modules thus produced
05/30/2012EP2458730A1 Radiofrequency amplifier
05/30/2012EP2458656A2 Light emitting apparatus
05/30/2012EP2458631A2 Multilayer printed wiring board
05/30/2012EP2457254A1 Method for manufacturing a light source and light source
05/30/2012EP2457253A1 A high-bandwidth ramp-stack chip package
05/30/2012CN202261129U Novel metal-oxide-semiconductor field effect transistor (MOSFET) module
05/30/2012CN202259437U Multi-reflection cup integrated type LED (light emitting diode) packaging structure
05/30/2012CN202259431U Light source module and light source module array of light source module
05/30/2012CN202259423U LED lamp adopting fluorescent composite mirror structure
05/30/2012CN202259415U Light-emitting body with large-power LED (Light-Emitting Diode) seamless arc-shaped light source
05/30/2012CN202259414U High-power LED seamless arc-shaped light source
05/30/2012CN202259410U LED with built-in resistor
05/30/2012CN202259395U LED (light-emitting diode) light source
05/30/2012CN202259373U Bypass diode module for photovoltaic component
05/30/2012CN202259300U Integrated electronic triode
05/30/2012CN202259299U Light-emitting diode (LED) copper wire lamp string
05/30/2012CN202259298U Ceramic area light source packaging structure
05/30/2012CN202259297U White light emitting diode (LED) integrated encapsulation structure with high color rendering index
05/30/2012CN202259296U Large-power strawhat-shaped integrated packaging light-emitting diode (LED) light source structure used for headlamp of automobile
05/30/2012CN202259295U High-power integrated type LED light source
05/30/2012CN202259294U Novel outdoor display screen special-purpose LED
05/30/2012CN202259293U An LED light having a plurality of chips connected in parallel
05/30/2012CN202259292U High efficiency heat dissipation type LED lamp
05/30/2012CN202259291U Direct inserting type multi-chip LED lamp bead
05/30/2012CN202259290U Light source module of LED (light-emitting diode) integrated packaging structure
05/30/2012CN202259289U Light source module of light-emitting diode (LED) integrated packaging structure
05/30/2012CN202259288U LED substrate structure
05/30/2012CN202259287U Luminescent device display
05/30/2012CN202259286U LED and LED lamp formed by LEDs
05/30/2012CN202259285U Triode capable of being used as pair diode
05/30/2012CN202259284U Novel high-voltage diode
05/30/2012CN202259283U Chip
05/30/2012CN202259282U Chip provided with carrying device
05/30/2012CN202259281U Electronic triode protected by peripheral components
05/30/2012CN202259280U Chip package structure
05/30/2012CN202259245U Packaging structure for chip
05/30/2012CN202259243U Package with frame subjected to film coating after ball bonding
05/30/2012CN202259234U Photovoltaic by-pass diode module possessing radiator
05/30/2012CN202259232U Framework structure used for integrating wafers
05/30/2012CN202258365U Solid state storage device based on embedded multi-media card grid encapsulation
05/30/2012CN202258364U Multichannel storing device based on semiconductor package
05/30/2012CN202253314U Solar photovoltaic-lighting integrated component
05/30/2012CN1830084B Integrated circuit package and method therefor
05/30/2012CN102484186A Optoelectronic module comprising at least one first semiconductor body having a radiation outlet side and an insulation layer and method for the production thereof
05/30/2012CN102484110A Power semiconductor module
05/30/2012CN102484109A Power Converter
05/30/2012CN102484108A A high-bandwidth ramp-stack chip package
05/30/2012CN102484100A Method for chip to wafer bonding
05/30/2012CN102484099A Semiconductor wafer-to-wafer bonding for dissimilar semiconductor dies and/or wafers
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