Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
12/2012
12/26/2012CN102844862A Dual-side interconnected cmos for stacked integrated circuits
12/26/2012CN102843862A Circuit board structure and packaging structure for IGBT (insulated gate bipolar transistor) module
12/26/2012CN102842667A Light-emitting diode packaging structure and method for producing same
12/26/2012CN102842575A Sound-wave coupling magneto-electric effect and sound-wave coupling magneto-electric device
12/26/2012CN102842574A Semiconductor packaging structure for stacking
12/26/2012CN102842573A Alternating current light emitting diode structure
12/26/2012CN102842572A Small double-row bridge rectifier
12/26/2012CN102842571A Wafer level chip scale package (WLCSP) multiple chip stackable packaging piece based on substrate and tin layer and packaging method thereof
12/26/2012CN102842570A Multiple chip packaging piece based on nickel-palladium alloy or nickel-palladium tin layer and packaging method thereof
12/26/2012CN102842565A Intelligent card module with coil as well as realization method thereof
12/26/2012CN102842560A Wafer level chip scale package (WLCSP) multiple chip stackable packaging piece and packaging method thereof
12/26/2012CN102842559A Multi-chip package based on nickel palladium gold (NiPdAu) and packaging method thereof
12/26/2012CN102842558A Wafer level chip scale package (WLCSP) multiple chip stackable packaging piece based on solder paste layers and packaging method thereof
12/26/2012CN102840464A Module, manufacturing method thereof and lighting device equipped with module
12/26/2012CN102130235B Method and device for packaging LED chip
12/26/2012CN102034805B Package integrating thermoelectric component with chip
12/26/2012CN101997063B Surface-mount light-emitting diode (LED) component, LED module and manufacturing methods thereof
12/26/2012CN101971334B Stackable communications system
12/26/2012CN101924091B Circuit apparatus
12/26/2012CN101853828B Chip with convex block and packaging structure of chip with convex block
12/26/2012CN101593709B Module including a sintered joint
12/26/2012CN101276815B Semiconductor device
12/25/2012US8338690 Method for producing photovoltaic device and photovoltaic device
12/25/2012US8338234 Hybrid integrated circuit device and manufacturing method thereof
12/20/2012WO2012173683A1 Stress-aware design for integrated circuits
12/20/2012WO2012173238A1 Semiconductor device manufacturing method and semiconductor device
12/20/2012WO2012172862A1 Power semiconductor module and method of manufacturing same
12/20/2012WO2012172650A1 Cooling structure for semiconductor element
12/20/2012WO2012171721A1 Optoelectronic semiconductor component and use of such a semiconductor component
12/20/2012US20120322500 Contactless integrated circuit having nfc and uhf operating modes
12/20/2012US20120319263 Integrated circuit packaging system with intra substrate die and method of manufacture thereof
12/20/2012US20120319248 Stress-aware design for integrated circuits
12/20/2012DE112010005303T5 Wärmehärtende Kunstharzzusammensetzung, B-Stufen Wärmeleitfähigkeitsschicht und Leistungsmodul The thermosetting resin composition B-stage thermal conductivity layer and power module
12/20/2012DE112005002855B4 LED vom integrierten Typ und Herstellungsverfahren derselben LED integrated type and manufacturing method thereof
12/20/2012DE102011105019A1 Method for manufacturing transverse connector of solar module in photovoltaic plant, involves contacting bypass diode with carrier strip using curable adhesive embedded in longitudinal fixing tab
12/20/2012DE102011104302A1 Optoelektronisches Halbleiterbauelement und Verwendung eines derartigen Halbleiterbauelements An optoelectronic semiconductor device and use of such a semiconductor device
12/20/2012DE102011082454A1 LED lighting device for use in e.g. streetlight, comprises a LED array having two different sets of LEDs which generate lights having two different light qualities, which are emitted to different to-be-illuminated regions
12/20/2012DE102011077687A1 Organische leuchtdiode, verfahren zur herstellung einer organischen leuchtdiode und modul mit mindestens zwei organischen leuchtdioden Organic light emitting device, method for producing an organic light-emitting diode module and with at least two organic light emitting diodes
12/20/2012DE102011077644A1 Illuminating device for e.g. video projector, has bonding wires which are provided between contact surface of n-polarized semiconductor light-emitting chip and front-side surface of metallization region
12/20/2012DE102011077614A1 Verfahren zur Herstellung einer Leuchtvorrichtung und Leuchtvorrichtung A process for producing a light-emitting device and lighting device
12/20/2012DE102011051038A1 LED lighting arrangement e.g. pendulum lamp, for e.g. ceiling, has converting layer arranged between LEDs and aperture, where part of radiation emitted from layer radiates directly and without reflectance outward through aperture
12/19/2012EP2534687A2 Systems and methods providing arrangements of vias
12/19/2012EP2534686A1 Semiconductor die package structure
12/19/2012EP2534659A2 Memory dies, stacked memories, memory devices and methods
12/19/2012EP2534657A1 Rule-based semiconductor die stacking and bonding within a multi-die package
12/19/2012EP2534092A2 Semiconductor component and corresponding production method
12/19/2012CN202616232U Light-emitting diode (LED) packaging structure
12/19/2012CN202616231U COB surface light source
12/19/2012CN202616230U Light emitting diode packaging structure
12/19/2012CN202616229U Liquid-cooling IGBT (Insulated Gate Bipolar Translator) converter device
12/19/2012CN102832319A Disk type integrated LED light source and preparation method thereof
12/19/2012CN102832316A Method and device for improving color temperature consistency of white light LED (Light Emitting Diode) lighting device
12/19/2012CN102832314A Package carrier and package structure
12/19/2012CN102832294A Method for packaging LED light source and LED light source
12/19/2012CN102832210A Multi-surface integrated device on low resistance substrate
12/19/2012CN102832208A Light emitting device and illumination apparatus including same
12/19/2012CN102832207A Block bridge pile
12/19/2012CN102832206A Patch in-line small bridge rectifier
12/19/2012CN102832205A In-line small bridge rectifier
12/19/2012CN102832191A Power module package and system module having the same
12/19/2012CN102832189A Multi-chip packaging structure and multi-chip packaging method
12/19/2012CN102826057A Electronic control unit and method of manufacturing the same
12/13/2012WO2012169521A1 Semiconductor module, upper and lower arm kit and three-level inverter
12/13/2012WO2012169168A1 3d integrated circuit and test method for same
12/13/2012WO2012169044A1 Semiconductor device
12/13/2012WO2012168834A1 Diode lighting arrangement
12/13/2012WO2012168040A1 Method for producing an optoelectronic semiconductor component and such a semiconductor component
12/13/2012US20120313262 Stacked semiconductor device
12/13/2012US20120313228 Impedence controlled packages with metal sheet or 2-layer rdl
12/13/2012DE202012010826U1 Flexible Folien-Leiterplatte Flexible film circuit board
12/13/2012DE10326274B4 Pastenzusammensetzung und Pastenzusammensetzung für eineSolarzelle Paste composition and paste composition for a solar cell
12/13/2012DE10221504B4 Mehrchip-LED-Halbleiteranordnung und Verfahren zu deren Herstellung A multi-chip LED semiconductor device and process for their preparation
12/13/2012DE102011103786A1 Optoelektronischer Halbleiterchip, Display mit einem derartigen Halbleiterchip und Verwendung eines derartigen Halbleiterchips oder eines Displays The optoelectronic semiconductor chip, display with such a semiconductor chip and the use of such a semiconductor chip or a display
12/13/2012DE102011077383A1 Anordnung von zwei oder mehr Halbleiterbauelementen Arrangement of two or more semiconductor devices
12/13/2012DE102008019407B4 Leistungshalbleitermodul The power semiconductor module
12/13/2012DE102008017553B4 Elektronisches System An electronic system
12/12/2012EP2533312A2 Light-emitting diode package
12/12/2012EP2533285A1 Stack of electronic components held in a pressed stack
12/12/2012EP2533284A2 Power semiconductor package with double-sided cooling
12/12/2012EP2533283A1 Semiconductor device and manufacturing method therefor
12/12/2012EP2533280A2 Semiconductor device
12/12/2012EP2533275A1 Method for manufacturing semiconductor device and semiconductor device
12/12/2012EP2532023A1 Surface preparation of die for improved bonding strength
12/12/2012EP2531982A2 Illumination device and sensor for checking valuable documents
12/12/2012EP2531640A1 Method for assembling at least one chip using a fabric, and fabric including a chip device
12/12/2012CN202601726U LED light source module packaging structure
12/12/2012CN202601725U Light-emitting diode with electrostatic protection mechanism
12/12/2012CN202601614U Image sensing encapsulation structure and module set thereof
12/12/2012CN202601613U Novel rectifier bridge for soybean milk makers
12/12/2012CN202601612U LED module group for commercial lighting
12/12/2012CN202601611U High color rendering LED integrated optical source
12/12/2012CN202601610U Semiconductor device
12/12/2012CN202601609U Superposed power module structure
12/12/2012CN102822967A Power module and power conversion device provided with said power module
12/12/2012CN102822965A Thermal vias in an integrated circuit package with an embedded die
12/12/2012CN102822401A Method for assembling at least one chip using fabric, and fabric including chip device
12/12/2012CN102820416A Warm white light-emitting diode (LED) and manufacturing method thereof
12/12/2012CN102820404A Light-emitting diode package
12/12/2012CN102820288A 功率模块及其制造方法 And a method of manufacturing a power module
12/12/2012CN102820287A Solar battery with pn junction array light acceptance structure
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