Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
08/2012
08/01/2012CN102624446A Structure for infrared communication between three-dimensional stacked silicon chip layers
08/01/2012CN102624225A Power module and the method of packaging the same
08/01/2012CN102623624A Light-emitting device and light-emitting method thereof
08/01/2012CN102623585A Light emitting device
08/01/2012CN102623447A Light-emitting diode module
08/01/2012CN102623446A White-light LED (Light-Emitting Diode) light-emitting module
08/01/2012CN102623445A Rectifier bridge arm
08/01/2012CN102623444A Integrated circuit device and method for preparing the same
08/01/2012CN102623443A Semiconductor package
08/01/2012CN102623442A Electronic package structure
08/01/2012CN102623441A Semiconductor device and method of fabricating the same
08/01/2012CN102623440A Semiconductor device, method of manufacturing semiconductor device, and electronic device
08/01/2012CN102623432A Semiconductor chip and multi-chip package having the same
08/01/2012CN102623362A Three-dimensional packaging method and package
08/01/2012CN102623359A Semiconductor encapsulation structure and manufacturing method thereof
08/01/2012CN102623068A 半导体集成电路及其控制方法 A semiconductor integrated circuit and control method
08/01/2012CN102620822A Brightness and proximity multi-chip integrated sensor and packaging method thereof
08/01/2012CN102620180A LED (Light-Emitting diode) multi-chip module and manufacturing method thereof
08/01/2012CN102064165B Novel LED (Light Emitting Diode) device
08/01/2012CN101886761B LED light source module
07/2012
07/31/2012US8232836 Integrated circuit including a large number of identical elementary circuits powered in parallel
07/31/2012US8232531 Corrosion barrier layer for photoconductive X-ray imagers
07/31/2012US8232192 Process of bonding circuitry components
07/26/2012DE112010000032T5 Elektronische Schaltungsvorrichtung An electronic circuit device
07/26/2012DE10316356B4 Modular aufgebautes Leistungshalbleitermodul Modular power semiconductor module
07/26/2012DE102012100243A1 Anordnung mit zwei Halbleiterchips und Herstellung einer solchen Anordnung Arrangement with two semiconductor chips and the production of a such an arrangement
07/26/2012DE102012001481A1 Lichtsensor mit IR-Interferenz-Sperrfilter und Farbfilter, die auf einem Chip integriert sind IR light sensor with interference rejection filter, and color filters which are integrated on one chip
07/26/2012DE10122705B4 Einrichtung mit funktionalem Bauelement und Verfahren zu seiner Herstellung Means with a functional element and process for its preparation
07/25/2012EP2479812A2 Semiconductor light emitting device and manufacturing method
07/25/2012EP2479410A1 Electronic control device for vehicle
07/25/2012EP2478750A1 Light-source module and light-emitting device
07/25/2012EP2478557A1 Optoelectronic module
07/25/2012EP2478556A1 Electronic device for switching currents and method for producing the same
07/25/2012EP2478290A1 Light emitting, photovoltaic or other electronic apparatus and system and method of making same
07/25/2012CN202352724U Improved high-power LED (light-emitting diode) integrated strip-shaped support
07/25/2012CN202352675U Power type light-emitting diode (LED) support and LED
07/25/2012CN202352674U Light-emitting diode (LED) substrate with U-shaped return circuit
07/25/2012CN202352673U Light-emitting diode module
07/25/2012CN202352672U LED encapsulating structure
07/25/2012CN202352671U Light-emitting diode (LED) packaging structure
07/25/2012CN202352670U Light-emitting diode (LED) lamp
07/25/2012CN202352669U Planar package structure for packaging sheet LED on aluminum baseplate
07/25/2012CN202352668U Light-emitting device and illuminating device with same
07/25/2012CN202352667U High voltage silicon stack
07/25/2012CN202352666U Silicon stack capable of rapidly converting positive and negative polarities
07/25/2012CN202352665U 半导体装置 Semiconductor device
07/25/2012CN202352664U Power module controlled by direct current motor excitation
07/25/2012CN202352663U Installation device for multi-layer solar panel
07/25/2012CN202351465U Optical element and electronic package with optical element
07/25/2012CN102612747A Semiconductor module
07/25/2012CN102611305A Boost converter with integrated high power discrete fet and low voltage controller
07/25/2012CN102610730A Light emitting diode packaging structure and manufacturing method of light emitting diode packaging structure
07/25/2012CN102610603A Luminous device
07/25/2012CN102610602A High-resolution LED (light emitting diode) light source made of single-package-based material and manufacturing process of high-resolution LED light source
07/25/2012CN102610601A Combined solar battery capable of improving solar energy utilization rate
07/25/2012CN102610600A High-power white light emitting diode (LED) module encapsulated by nano silver solder paste and encapsulation method of high-power white light emitting diode module
07/25/2012CN102610599A Light-emitting device package and method of manufacturing the light-emitting device package
07/25/2012CN102610598A Total-outdoor LED (Light-Emitting Diode) lamp with high brightness, high density and high contrast ratio
07/25/2012CN102610597A Package having a light-emitting element and method of fabricating the same
07/25/2012CN102610596A Method for incorporating existing silicon die into 3d integrated stack
07/25/2012CN102610595A Radio-frequency power amplifier multichip module and generation method thereof
07/25/2012CN102610594A Stackable semiconductor assembly with bump/flange heat spreader and dual build-up circuitry
07/25/2012CN102064167B Helical packaging structure of light-emitting semiconductor chip and light-emitting semiconductor light source device thereof
07/25/2012CN102034793B Relay board and semiconductor device having the relay board
07/25/2012CN102024883B Preparation method of light-emitting diode radiating substrate
07/25/2012CN102024796B Integrated circuit module with display device
07/25/2012CN101960593B High current control circuit including metal-insulator transition device, and system including the high current control circuit
07/25/2012CN101908527B Reverse interleaved stack structure of integrated circuit module
07/25/2012CN101894819B Substrate structure
07/25/2012CN101887887B 3d integration structure and method using bonded metal planes
07/25/2012CN101886759B Light emitting device using alternating current and manufacturing method thereof
07/25/2012CN101800217B Semiconductor module
07/25/2012CN101728376B Method of fabricating organic electroluminescent device
07/25/2012CN101626218B Driving signal output circuit and multi chip package
07/25/2012CN101587875B Chip structure, three-dimensional stacked chip packaging structure and manufacturing method thereof
07/24/2012US8227913 Power semiconductor module comprising elastic housing for accommodating movement of individual substrate regions on a heat sink
07/19/2012WO2012096807A1 Arc fault mitigation for photovoltaic systems
07/19/2012WO2012096774A1 Method of transferring and electrically joining a high density multilevel thin film to a circuitized and flexible organic substrate and associated devices
07/19/2012WO2012096112A1 Semiconductor device
07/19/2012WO2012096066A1 Power semiconductor module
07/19/2012WO2012095950A1 Cooler
07/19/2012WO2012095812A2 Method for embedding a led network
07/19/2012US20120182066 Method of manufacturing a package for embedding one or more electronic components
07/19/2012US20120181674 Stacked Half-Bridge Package with a Common Conductive Leadframe
07/19/2012DE112007000829B4 Anordnung aus Wechselrichter und Kühler und ihre Verwendung Arrangement of inverter and coolers and their use
07/19/2012DE102012100137A1 Halbleitermodul Semiconductor module
07/19/2012DE102012100027A1 Halbleiterbauelement und Verfahren zur Herstellung desselben A semiconductor device and method of manufacturing the same
07/19/2012DE102011008952A1 Mehrchipmodul, Verfahren zum Betreiben desselben und DC/DC-Wandler A multi-chip module and method thereof for operating DC / DC converter
07/19/2012DE102007025248B4 Elektronisches Bauelement, das mindestens zwei Halbleiterleistungsbauteile aufweist und Verfahren zu dessen Herstellung An electronic component having at least two semiconductor power components and process for its preparation
07/18/2012EP2477225A2 Adhesive film for light emitting device and method of manufacturing LED package using the same
07/18/2012EP2477224A2 Die attach composition for silicon chip placement on a flat substrate having improved thixotropic properties
07/18/2012EP2477223A2 Method of manufacturing semiconductor apparatus, the semiconductor apparatus, and ignitor using the semiconductor apparatus
07/18/2012EP2476369A1 Multiple wavelength optical sensor
07/18/2012CN202339918U 具高压驱动的发光二极管 A high-voltage-driven light emitting diode
07/18/2012CN202339917U 一种大功率高出光效率的集成封装led光源 One kind of higher power efficiency of the integrated package led light source
07/18/2012CN202339916U 一种新型top led支架及由其制造的led器件 A new top led led stents and devices fabricated therefrom
07/18/2012CN102598879A Device mounting structure and device mounting method
07/18/2012CN102598327A Optoelectronic component and method for producing an opto-electronic component
07/18/2012CN102598262A 半导体装置和噪声抑制方法 Semiconductor device and method for noise suppression
07/18/2012CN102593337A High-reliability integrated packaging LED (light-emitting diode) chip
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