Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
07/2012
07/04/2012CN102543971A Chip package and method for forming the same
07/04/2012CN102543970A Semiconductor packaging component and manufacturing method thereof
07/04/2012CN102543969A Wafer level molding structure and manufacturing method thereof
07/04/2012CN102543968A Three dimensional stacked chip package structure
07/04/2012CN102543967A Package and method for manufacturing same
07/04/2012CN102543966A Power package module
07/04/2012CN102543941A Semiconductor device, semiconductor memory device, and operating method thereof
07/04/2012CN102543904A Modular integrated circuit packaging structure and manufacturing method thereof
07/04/2012CN102543779A Semiconductor device and method of forming an inductor within interconnect layer vertically separated from semiconductor die
07/04/2012CN102543778A Methods for directly bonding together semiconductor structures, and bonded semiconductor structures formed using such methods
07/04/2012CN102543770A Encapsulation method of special half-bridge drive integrated circuit of compact fluorescent lamp
07/04/2012CN102537740A GCOB (GdCa4O(BO3)3) high-brightness integration plane light source
07/04/2012CN102110674B Semiconductor package
07/04/2012CN101996984B Light-emitting diode packing structure of forming filling type convex lens and manufacturing method thereof
07/04/2012CN101944514B Semiconductor packaging structure and package manufacturing technology
07/04/2012CN101887889B LED integrated circuit module and LED display module
07/04/2012CN101872817B Light-emitting diode packaging structure and manufacturing method thereof
07/04/2012CN101819970B Welded IGBT and solderless diode-based series structure module
07/04/2012CN101809738B Memory device interface methods, apparatus, and systems
07/04/2012CN101803019B Integrated circuit stack and its thermal management
07/04/2012CN101800215B Wireless communication module package structure
07/04/2012CN101796638B Semiconductor component and method for producing a semiconductor component
07/04/2012CN101794766B Heat exchange unit
07/04/2012CN101794762B Light source module and lighting device
07/04/2012CN101777549B Packaging module structure of compound semiconductor elements and production method thereof
07/04/2012CN101764117B Line structure of packaging carrier plate and multi-chip packaging body
07/04/2012CN101752358B Compact semiconductor package with integrated bypass capacitor and method
07/04/2012CN101740555B Ultrahigh pressure pulse silicon rectifier stack
07/04/2012CN101728364B 芯片封装体及制作方法 Chip package and method of making
07/04/2012CN101681902B Array of small contacts for solar cell fabrication
07/04/2012CN101621871B New type high-power LED driving power source
07/04/2012CN101621055B Multi-die integrated circuit device and method
07/04/2012CN101617414B Radiation emitting semi-conductor body having an electrically conductive contact layer permeable to the emitted radiation
07/04/2012CN101610629B Electronic ballast for lamp
07/04/2012CN101504943B 半导体集成电路 The semiconductor integrated circuit
07/04/2012CN101488497B Stacked semiconductor apparatus with configurable vertical I/O
07/04/2012CN101459166B Licht aussendende diode
07/04/2012CN101350344B Semiconductor device package and fabricating method thereof
07/04/2012CN101336026B LED light-emitting component of integrated single line control apparatus
07/04/2012CN101335263B Semiconductor module and manufacturing method thereof
07/04/2012CN101202472B Rectifier circuit, power supply circuit, and semiconductor device
07/04/2012CN101197538B Microminiature power converter
07/03/2012US8214774 Method for implementing functional changes into a design layout of an integrated device, in particular a system-on-chip, by means of mask programmable filling cells
07/03/2012US8212611 Switching core layout
07/03/2012US8212586 Universal pinout for both receiver and transceiver with loopback
07/03/2012US8212364 Method for manufacturing semiconductor apparatus, and semiconductor apparatus and electric appliance
07/03/2012US8212348 Techniques for packaging multiple device components
06/2012
06/28/2012WO2012087364A1 Simultaneous wafer bonding and interconnect joining
06/28/2012WO2012087287A1 Integrated digital- and radio-frequency system-on-chip devices with integral passive devices in package substrates, and methods of making same
06/28/2012WO2012086417A1 Insulating structure for power module and power conversion device using power module
06/28/2012WO2012086107A1 Intermediate for electronic component mounting structure, electronic component mounting structure, and method for manufacturing electronic component mounting structure
06/28/2012WO2012086100A1 Semiconductor device
06/28/2012WO2012085952A1 Assembly for the heat dissipation and the electrical connection of current-rectifier button diodes
06/28/2012WO2012085724A1 Method of fabricating a flip chip electrical coupling, a flip chip electrical coupling, and a device comprising a flip chip electrical coupling
06/28/2012WO2012084899A1 Led (light‑emitting diode) luminous source module
06/28/2012WO2012084556A1 Electrical module for being received by automatic placement machines by means of generating a vacuum
06/28/2012WO2012005771A3 Compact optically efficient solid state light source with integrated thermal management
06/28/2012US20120161279 Semiconductor Device and Method of Forming Integrated Passive Device Over Semiconductor Die with Conductive Bridge and Fan-Out Redistribution Layer
06/28/2012US20120161209 Electronic interconnects and devices with topological surface states and methods for fabricating same
06/28/2012US20120161162 Optoelectronic Semiconductor Component
06/28/2012DE112010000142T5 Kostenoptimiertes Verfahren zum Bilden von hoch dichten passiven Kondensatoren zum Ersetzen diskreter Kondensatoren unter Verwendung eines kostenoptimierten modularen 3D-Wafer-Wafer-Integrationsschemas Cost-effective methods of forming high density passive capacitors to replace discrete capacitors using a cost-optimized modular 3D wafer-wafer integration scheme
06/28/2012DE102011088610A1 Halbleiterbauelement und -packung sowie Verfahren zur Übertragung von Temperaturinformation Semiconductor device and -packung and method for transmitting temperature information
06/28/2012DE102011084602A1 Halbleiterbauelement und Herstellungsverfahren desselben Of the same semiconductor device and manufacturing method
06/28/2012DE102011056937A1 Die-Gehäuse The housing
06/28/2012DE102011056878A1 Lichtemittierende Vorrichtung A light emitting device
06/28/2012DE102011056624A1 Hybrid-Verfolgungssystem unter Verwendung einer Kombination von LED und Magnetowiderstands-Sensor Hybrid tracking system using a combination of LED and magnetoresistive sensor
06/28/2012DE102011005689A1 Spektrum für mesopisches bzw. Dämmerungssehen Spectrum for mesopic or twilight vision
06/28/2012DE102010055935A1 Verfahren zum Verbinden mehrerer ungehäuster Substrate A method for connecting a plurality of bare substrates
06/27/2012EP2469617A2 Scalable heat dissipating microelectronic integration platform (SHDMIP) for lighting solutions and method of manufacturing thereof
06/27/2012EP2469613A2 Light emitting device and illumination apparatus using the same
06/27/2012EP2469596A2 Light module for a lighting device of a motor vehicle with semiconductor light sources arranged on a silicon substrate
06/27/2012EP2469595A1 Vertically integrated systems
06/27/2012EP2469594A2 Light emitting module and method of manufacturing the same
06/27/2012EP2469593A2 Light-emitting device and illumination device using the same
06/27/2012EP2469591A2 Method for fabricating a semiconductor device package
06/27/2012EP2469290A2 Beam direction sensor and method for determining the angle of incidence of a beam source
06/27/2012EP2467451A1 Artificial photosynthesis
06/27/2012EP2126969B1 Method of interconnecting electronic wafers
06/27/2012CN202285235U 数字电路集成模块 Digital integrated circuit module
06/27/2012CN1825586B Led assembly and method of making the same
06/27/2012CN102522485A Semiconductor light emitting device
06/27/2012CN102522400A Anti-electrostatic-damage vertical light-emitting device and manufacturing method thereof
06/27/2012CN102522399A LED encapsulation structure
06/27/2012CN102522398A COB (Chip On Board) integrated-packaged LED (Light-Emitting Diode) with high color-rendering index and high reliability
06/27/2012CN102522397A Light emitting device and method for manufacturing the same
06/27/2012CN102522396A LED (Light Emitting Diode) package structure capable of improving illumination with softened lighting effect
06/27/2012CN102522395A Package structures
06/27/2012CN102522394A On-chip chip package and production method thereof
06/27/2012CN102522393A Packaging device and assembly for packaging a plurality of integrated circuits
06/27/2012CN102522392A e/LQFP (low-profile quad flat package) planar packaging part with grounded ring and production method of e/LQFP planar packaging part with grounded ring
06/27/2012CN102522391A e/LQFP (low-profile quad flat package) stacked package with grounded ring and production method of e/LQFP stacked package with grounded ring
06/27/2012CN102522390A Welding-free packaged power module
06/27/2012CN102522389A Small-sized power semiconductor module
06/27/2012CN102522380A PoP packaging structure
06/27/2012CN102097418B IGBT driving unit
06/27/2012CN101919054B Using 3d integrated diffractive gratings in solar cells
06/27/2012CN101894829B Stacked encapsulating structure
06/27/2012CN101814484B 芯片封装体及其制作方法 Chip package and manufacturing method thereof
06/27/2012CN101813296B LED light source using filter with dual-function of stopping ultraviolet rays and infrared rays
06/27/2012CN101795064B Power phase module based on IEGT
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