Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
07/2012
07/11/2012CN102569106A Method and device for implementing high-power application of glass passivation diode
07/11/2012CN102568572A Data storage devices, staking method thereof and data storage device assembly
07/11/2012CN102568562A Stack package and method for selecting chip in stack package
07/11/2012CN102568552A Semiconductor apparatus
07/11/2012CN102563557A Encapsulation method used for strip light
07/11/2012CN102231377B High color rendering light emitting diode and manufacture method thereof
07/11/2012CN102136468B Thyristor valve section and crimping method thereof
07/11/2012CN102104010B Module structural member capable of improving isolation voltage VISO and reducing crusting thermal resistance Rthjc
07/11/2012CN102097549B Chip scale integration packaging process and light emitting diode (LED) device
07/11/2012CN102005447B LED (Light Emitting Diode) integrated structure with cooler
07/11/2012CN101826517B Light emitting device
07/11/2012CN101794765B Semiconductor device and method of manufacturing the semiconductor device
07/11/2012CN101755335B Device having electronic component mounted therein and method for manufacturing such device
07/11/2012CN101553917B Method of manufacturing stacked chip packages
07/11/2012CN101551962B Full-color LED display device
07/11/2012CN101523605B Bare microelectronic chip provided with a recess forming a housing for a wire element constituting a flexible mechanical support, fabrication process and microstructure
07/11/2012CN101496181B Method and apparatus for arranging a solar cell and reflector
07/11/2012CN101459168B Method and system for a phased array antenna embedded in an integrated circuit package
07/11/2012CN101241910B Semiconductor device, substrate, equipment board, method for producing semiconductor device, and semiconductor chip
07/10/2012US8216934 Semiconductor device suitable for a stacked structure
07/10/2012US8216762 adhesion of positive dry diazide based photoresist film on polyethylene terephthlate support on a glass substrate to adhere diazide layer to glass substrate, releasing support layer using fluoro based silicone resin as releasing agent, exposing to light, developing using tetramethylammonium hydroxide
07/05/2012WO2012091975A1 Phosphor reflector assembly for remote phosphor led device
07/05/2012WO2012091973A1 Remote phosphor led device with broadband output and controllable color
07/05/2012WO2012091813A1 Generation of radiation conducive to plant growth using a combination of leds and phosphors
07/05/2012WO2012091780A1 Semiconductor device with stacked power converter
07/05/2012WO2012091140A1 Interposer and semiconductor module using same
07/05/2012WO2012090594A1 Semiconductor module, mould device, and mould-forming method
07/05/2012WO2012088676A1 66kv light-controlled water-cooled thyristor valve bank
07/05/2012WO2012028460A3 Light-emitting diode chip
07/05/2012WO2012012323A3 Stackable molded microelectronic packages
07/05/2012US20120170384 Integrated circuit, memory system, and operation method thereof
07/05/2012US20120169415 Semiconductor device including body connected fets
07/05/2012US20120168965 Semiconductor device and a method of manufacturing the same
07/05/2012DE102011083927A1 Leistungsmodul und Verfahren zur Herstellung desselben Power module and method of manufacturing the same
07/05/2012DE102011055013A1 Halbleitergehäuse und Verfahren zum Herstellen derselben Semiconductor package and method for manufacturing the same
07/05/2012DE102011002458A1 Elektronische Baugruppe mit verbessertem Thermo-Management Electronic assembly with improved thermal management
07/05/2012DE102010049333B4 Verfahren und Vorrichtung zur Herstellung einer bandförmigen Struktur zur Aufnahme von elektronischen Bauteilen Method and apparatus for producing a band-shaped structure for receiving of electronic components
07/04/2012EP2472616A2 Light-emitting device package and method of manufacturing the same
07/04/2012EP2472610A2 Light emitting diode package and method for manufacturing same
07/04/2012EP2472608A1 Nitride-based semiconductor light-emitting element, lighting device, liquid crystal display device, and method for producing lighting device
07/04/2012EP2472594A1 Multi-junction photoelectric converter, integrated multi-junction photoelectric converter, and method for manufacturing same
07/04/2012EP2472578A2 Light emitting device
07/04/2012EP2471624A1 Continuous wire bonding
07/04/2012EP2471094A1 Semiconductor wafer-to-wafer bonding for dissimilar semiconductor dies and/or wafers
07/04/2012EP1818979B1 Electronic component and fabrication method thereof
07/04/2012EP1386348B9 Method of forming a lattice-mismatched semiconductor layer
07/04/2012CN202309705U 通用微功率无线通信模块 GM micro-power wireless communication module
07/04/2012CN202308058U 一种led灯封装结构 A lamp package structure led
07/04/2012CN202308050U 一种表面贴片型led A surface SMD led
07/04/2012CN202308045U 一种led支架及led One kind of led bracket and led
07/04/2012CN202308044U 一种新型发光二极管 A new light-emitting diode
07/04/2012CN202308030U 多层式阵列型发光二极管光引擎的结构改良 Improved multi-layered structure of the array-type light-emitting diode light engines
07/04/2012CN202307961U Crystalline silicon standard solar cell for testing amorphous silicon cell
07/04/2012CN202307892U 一种大电流mosfmt器件 One kind of high-current devices mosfmt
07/04/2012CN202307891U 贴片数码管 SMD digital
07/04/2012CN202307890U 一种新型集成大功率led封装结构 A new integrated power led package
07/04/2012CN202307889U 一种大功率led集成封装结构 One kind of led integrated power package
07/04/2012CN202307888U 一种大功率白光led封装结构 One kind of high-power white led package structure
07/04/2012CN202307887U 高功率发光二极体装置 High-power light-emitting diode device
07/04/2012CN202307886U 一种led球泡灯光源 One kind of led bulb light source
07/04/2012CN202307885U 发光二极管及应用该发光二极管的显示屏 Light-emitting diodes and the application of the light-emitting diode display
07/04/2012CN202307884U 一种大功率集成式led产品 One kind of high-power integrated led products
07/04/2012CN202307883U 一种新型led灯珠芯片结构 A new chip architecture led lamp beads
07/04/2012CN202307882U 发光装置及具备该发光装置的照明器具 Light emitting device and lighting fixture with the light-emitting device
07/04/2012CN202307881U 一种电子设备 An electronic device
07/04/2012CN202307880U 一种新型驱动芯片 A new driver chip
07/04/2012CN202307879U 一种SiP模块的结构 Structure for SiP modules
07/04/2012CN202307878U 片型电路保护器件 Chip-type circuit protection devices
07/04/2012CN202306120U 一种简易led投影装置 A Simple led projector apparatus
07/04/2012CN202302944U Led面光源用cob封装灯条模块 Led surface light source light strip modules packaged with cob
07/04/2012CN202302870U 灯具模块 Lighting module
07/04/2012CN102549746A Optoelectronic semiconductor chip and method for adapting a contact structure for electrically contacting an optoelectronic semiconductor chip
07/04/2012CN102549745A Potted optoelectronic module having a plurality of semiconductor components and method for producing an optoelectronic module
07/04/2012CN102549744A Semiconductor device, power semiconductor module, and power conversion device equipped with power semiconductor module
07/04/2012CN102544325A Light emitting diode (LED) integrated module and method for manufacturing same
07/04/2012CN102544310A Mounting substrate and manufacturing method thereof
07/04/2012CN102544308A Light-emitting diode module which is used for improving radiating efficiency and is provided with fluorescent layer
07/04/2012CN102544307A Light-emitting diode module used for improving heat radiation efficiency and provided with high-reflectivity material layer
07/04/2012CN102544306A Light-emitting diode module which is used for improving radiating efficiency and is provided with upright chip
07/04/2012CN102544305A Light-emitting diode module for improving heat radiation efficiency
07/04/2012CN102544304A Carrier, semiconductor package and manufacturing method for semiconductor package
07/04/2012CN102544124A Solar cell and manufacturing method for same
07/04/2012CN102543989A LED(light-emitting diode)device
07/04/2012CN102543988A Metal supporting vertical structure fluorescent powderless white light LED
07/04/2012CN102543987A Solid-state light-emitting component
07/04/2012CN102543986A Light-emitting diode device
07/04/2012CN102543985A Semiconductor packaging device and semiconductor substrate structure thereof
07/04/2012CN102543984A Light-emitting device package and method of manufacturing the same
07/04/2012CN102543983A LED integrated light source
07/04/2012CN102543982A Light-Emitting Device And Manufacturing Method
07/04/2012CN102543981A Light emitting diode package and manufacturing method thereof
07/04/2012CN102543980A Led package structure and fabrication method thereof
07/04/2012CN102543979A Heat radiation type light-emitting diode module
07/04/2012CN102543978A Refrigeration type light-emitting diode module
07/04/2012CN102543977A Light-emitting diode module with enhanced heat radiation
07/04/2012CN102543976A Light-emitting diode heat-radiating module
07/04/2012CN102543975A Light-emitting diode module for forming white light and improving heat radiation efficiency
07/04/2012CN102543974A High voltage light-emitting diode (LED)
07/04/2012CN102543973A 芯片封装结构 Chip package structure
07/04/2012CN102543972A Solar battery module
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