Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
10/2012
10/10/2012CN102142490B Method for gluing LED module
10/10/2012CN102117801B Manufacturing method of high-power light-emitting diode module structure
10/10/2012CN102088013B Substrate structure with die embedded inside and dual build-up layers over both side surfaces and method of the same
10/10/2012CN102064119B Method of fabricating a semiconductor device
10/10/2012CN102034801B Semiconductor package structure
10/10/2012CN101989596B Thermoelectric module and optical transmission apparatus
10/10/2012CN101859714B Manufacturing method of display device and display device
10/10/2012CN101847623B Power module
10/10/2012CN101842887B Method for contacting of electronic components, apparatus manufactured therefor and related equipments
10/10/2012CN101794738B 半导体装置及其制造方法 Semiconductor device and manufacturing method
10/10/2012CN101789036B Programmable transistor array design methodology
10/10/2012CN101771024B Light-emitting diode (LED) and packaging method thereof
10/10/2012CN101714512B Method of fabricating semiconductor device having three-dimensional stacked structure
10/10/2012CN101591472B Curable resin material composition, optical material, light-emitting device, method for producing light-emitting device, and electronic device
10/10/2012CN101499504B Luminous element packaging structure
10/10/2012CN101419964B Device with a plurality of semiconductor chips
10/10/2012CN101378051B Semiconductor device and manufacturing method thereof
10/10/2012CN101232014B Organic illuminated display element and manufacturing method thereof
10/09/2012USRE43720 Integrated circuit device having stacked dies and impedance balanced transmission lines
10/09/2012US8283755 Multichip semiconductor device, chip therefor and method of formation thereof
10/04/2012WO2012134796A1 Differential infrared imager for gas plume detection
10/04/2012WO2012134666A1 An interposer having an inductor
10/04/2012WO2012134637A1 Induced thermal gradients
10/04/2012WO2012133818A1 Three-dimensional integrated circuit laminate and interlayer filler material for three-dimensional integrated circuit laminate
10/04/2012WO2012133760A1 Electronic component mounting method, electronic component mounting system, and substrate
10/04/2012WO2012132709A1 Power module semiconductor device
10/04/2012WO2012132019A1 Three-dimensionally mounted semiconductor device and method for manufacturing same
10/04/2012WO2012131532A1 Patterned uv sensitive silicone-phosphor layer over leds
10/04/2012WO2012129819A1 Radio frequency emitting front end module in global system for mobile communication manufactured with quad flat non-leaded package
10/04/2012WO2012082227A3 Enhanced stacked microelectronic assemblies with central contacts and improved ground or power distribution
10/04/2012WO2012062707A3 Compact diode/thyristor rectifier architecture allowing high power
10/04/2012US20120249230 Integrated circuit power consumption calculating apparatus and processing method
10/04/2012US20120249229 Semiconductor integrated circuit and semiconductor system including the same
10/04/2012US20120249217 Semiconductor integrated circuit device
10/04/2012US20120249182 Power Routing in Standard Cell Designs
10/04/2012US20120248630 Hybrid integrated circuit device, and method for fabricating the same, and electronic device
10/04/2012US20120248469 Light emitting apparatus
10/04/2012DE102012201889A1 Electrical power module has electronic components for electrically coupling contact elements, and punched grid that is arranged for coupling contact elements and one side of electronic component
10/04/2012DE102011075661A1 Thermoelektrische Anordnung und Verfahren zum Herstelleneiner thermoelektrischen Anordnung Thermoelectric assembly and method of making a thermoelectric device
10/04/2012DE102011015726A1 Halbleiterchip, Display mit einer Mehrzahl von Halbleiterchips und Verfahren zu deren Herstellung Semiconductor chip, display with a plurality of semiconductor chips and processes for their preparation
10/04/2012DE102011015408A1 Optoelektronisches Bauelement und Verfahren zum Betrieb eines optoelektronischen Bauelements Optoelectronic component and method of operating an optoelectronic component
10/04/2012DE102011015405A1 Optisches Element und strahlungsemittierende Vorrichtung mit einem derartigen optischen Element Optical element and radiation-emitting device having such an optical element
10/04/2012DE102011006688A1 LED chip for use in LED illumination device of e.g. projector, has inwardly reflective layer formed on radiation exit side using wafer process, where aperture is formed at edge section of reflective layer for exit of radiation
10/04/2012DE102011001680A1 Verfahren zum Herstellen eines Beleuchtungskörpers auf LED-Basis A method for producing a LED-based lighting fixture
10/04/2012DE102009049102B4 Halbleiterbauelement mit Durchkontaktierung und Verfahren zur Herstellung einer Durchkontaktierung in einem Halbleiterbauelement A semiconductor device having through-hole plating and method for making a via hole in a semiconductor device
10/04/2012DE102009002993B4 Leistungshalbleitermodul mit beabstandeten Schaltungsträgern Power semiconductor module having spaced circuit boards
10/04/2012DE102006051454B4 Halbleitervorrichtung Semiconductor device
10/04/2012DE102004025616B4 Halbleiterbauteil mit Kühlsystem A semiconductor device comprising the cooling system
10/03/2012EP2506301A2 Luminous-body flexible board and luminous device
10/03/2012EP2506298A1 Production method for electronic device, electronic device, production method for electronic device package, and electronic device package
10/03/2012EP2504615A1 Led lamp having a pin socket for halogen lamps ('bi-pin')
10/03/2012CN202475280U High voltage and power three-phase rectifier bridge
10/03/2012CN202473920U Integrated packaging structure for high-voltage LED (light-emitting diode) chip and driving power supply chip
10/03/2012CN202473919U Flexible circuit substrate double-side lighting LED array light source
10/03/2012CN202473918U High-bright multichip white light LED package
10/03/2012CN202473917U LED (light-emitting diode) module
10/03/2012CN202473916U LED packaging structure with high color rendering index
10/03/2012CN202473915U Integrated packaged light-emitting diode (LED) supporting frame
10/03/2012CN202473914U Novel big power LED
10/03/2012CN202473913U LED light source structure capable of using blue light chip to excite phosphor module
10/03/2012CN202473912U LED array light source without circuit substrate
10/03/2012CN202473911U LED device capable of raising light extraction efficiency
10/03/2012CN202473910U Improved lamp bead applied on LED candle lamp
10/03/2012CN202473909U Combined type solid discharge tube
10/03/2012CN202473908U Chip stacking structure used in system integration module
10/03/2012CN202473907U High-frequency voltage multiplying rectification module
10/03/2012CN202469535U Three-serial-sixteen-parallel connection LED chips integrated surface light source
10/03/2012CN202469534U Eight-serial-six-parallel connection LED chips integrated surface light source
10/03/2012CN102714260A Solid state lighting devices including light mixtures
10/03/2012CN102714204A Illumination device
10/03/2012CN102714203A Power semiconductor module, power conversion device, and rail car
10/03/2012CN102714202A Semiconductor device and production method for same
10/03/2012CN102714190A Package assembly having a semiconductor substrate
10/03/2012CN102714186A Film for forming semiconductor protection film, and semiconductor device
10/03/2012CN102714054A Information storage and processing device
10/03/2012CN102713406A 混合光源 Hybrid light source
10/03/2012CN102710102A Liquid-cooled insulated gate bipolar transistor (IGBT) converter and manufacturing method
10/03/2012CN102709454A Surface-roughened double-layer adhesive structure LED light source and manufacturing method thereof
10/03/2012CN102709358A Waterproof integrated pressure-sensitive-adhesive modularized crystalline silicon solar power generation board system and preparation method thereof
10/03/2012CN102709282A Multi-die packages incorporating flip chip dies and associated packaging methods
10/03/2012CN102709281A Double fluorescent thin film two-sided light-emitting planar wafer LED (Light-Emitting Diode) array light source
10/03/2012CN102709280A Chip on board (COB) integrated light source module
10/03/2012CN102709279A LED (Light Emitting Diode) packaging structure of high brilliance full color display
10/03/2012CN102709278A Plane thin sheet type LED (Light-Emitting Diode) array light source of fluorescent thin film
10/03/2012CN102709277A Light emitting device and LCD backlight using the same
10/03/2012CN102709276A Low-capacity metal packaged silicon transient voltage suppressor and manufacturing method thereof
10/03/2012CN102709271A Stacked wafer level package having a reduced size
10/03/2012CN102705724A Light cavity that improves light output uniformity
10/03/2012CN101978492B Method for manufacturing electronic component module
10/03/2012CN101877342B Circuit arrangement and design method
10/03/2012CN101582420B Focusing infrared receiver with built-in reflective cup
10/03/2012CN101582418B Tricolor single-chip white light-emitting diode regulated through electric injection
10/03/2012CN101540313B Switching assembly with bond connection
10/03/2012CN101399262B Power semiconductor arrangement and assembling method thereof
10/02/2012US8278766 Wafer level stack structure for system-in-package and method thereof
10/02/2012US8278746 Semiconductor device packages including connecting elements
10/02/2012US8278147 Semiconductor device and manufacturing method thereof
10/02/2012US8278146 Manufacturing method of chip package with coplanarity controlling feature
09/2012
09/27/2012WO2012127696A1 Power semiconductor module and power unit device
09/27/2012WO2012127107A1 Led component
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