Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
08/2012
08/16/2012WO2012107972A1 Semiconductor device
08/16/2012WO2012107482A2 Power semiconductor module
08/16/2012WO2012107312A1 Contact system comprising a connecting means and method
08/16/2012WO2012075272A3 Structures and methods for electrically and mechanically linked monolithically integrated transistor and mems/nems devices
08/16/2012US20120206953 Memory edge cell
08/16/2012US20120205791 Semiconductor chip with reinforcing through-silicon-vias
08/16/2012US20120205677 Led module
08/16/2012DE102011102972A1 LED-Leuchtvorrichtung mit gleichmässiger Farbmischung LED lighting device with uniform color mixing
08/16/2012DE102011087149A1 Halbleitervorrichtung und Verfahren, um sie zu testen A semiconductor device and method in order to test them
08/16/2012DE102011010895A1 Leuchtdiodenmodul Light emitting diode module
08/16/2012DE102011003989A1 Lighting device i.e. LED module, has encapsulation chamber encapsulating semiconductor light source, and film-shaped optic element applied on free-surface of encapsulation chamber that consists of casting material such as silicone
08/16/2012DE102011003988A1 Lighting device has transparent light guidance portion provided in respective emitter area of semiconductor light source such as LED
08/16/2012DE102005024900B4 Leistungsmodul Power module
08/15/2012EP2487711A1 Semiconductor device, power semiconductor module, and power conversion device equipped with power semiconductor module
08/15/2012EP2486568A2 Vertically stackable dies having chip identifier structures
08/15/2012EP2339476B1 Interface connecting dies in an IC package
08/15/2012CN202384402U Multi-chip integrated packaging LED
08/15/2012CN202384397U Outdoor light emitting diode
08/15/2012CN202384339U Combined battery device based on photovoltaic battery and thermoelectric battery
08/15/2012CN202384338U COB (chip on board) integrated package LED with high color rendering index and high reliability
08/15/2012CN202384337U LED (light-emitting diode) packaging structure for improving light efficiency softened illumination
08/15/2012CN202384336U Light-emitting diode (LED) light source module
08/15/2012CN202384335U White light LED (light-emitting diode) plane light source with oxynitride fluorescent powder luminescent layers
08/15/2012CN202384334U Paster type LED support and lamp bead
08/15/2012CN202384333U Paster type large-power LED lamp bead
08/15/2012CN202384332U High power light emitting diode apparatus having metal substrate
08/15/2012CN202384331U Light mixing LED packaging structure
08/15/2012CN102640286A Methods and apparatus for inductors with integrated passive and active elements
08/15/2012CN102637683A Led device with shared voltage-limiting unit and individual voltage-equalizing resistance
08/15/2012CN102637682A Aluminum base bar type integrated light emitting diode (LED) device and manufacture method of aluminum base bar type integrated LED device
08/15/2012CN102637681A Vertical light-emitting device and manufacturing method thereof
08/15/2012CN102637680A LED (Light Emitting Diode) circuit structure and manufacturing method thereof
08/15/2012CN102637679A 半导体模块 Semiconductor Modules
08/15/2012CN102637678A Packaging and stacking device and method for manufacturing same
08/15/2012CN102157471B Dual-layer laminated patch rectifying full bridge
08/15/2012CN102064158B Compact power module
08/15/2012CN102017142B Three-dimensionally integrated semiconductor device and method for manufacturing the same
08/15/2012CN101901797B Power electronics power module with imbedded gate circuitry
08/15/2012CN101819967B Led module and led light source apparatus
08/15/2012CN101471270B Low profile wire bonded USB device
08/15/2012CN101392891B Array type illuminating device with high colour rendering
08/14/2012US8242837 Analog circuit and semiconductor device
08/09/2012WO2012106292A1 Stacked semiconductor chips packaging
08/09/2012WO2012106183A1 Multichip packages
08/09/2012WO2012104979A1 Single-layer chip-on-film (cof) type driver chip module
08/09/2012WO2012104507A1 Method for manufacturing two substrates connected by at least one mechanical and electrically conductive connection and the structure obtained
08/09/2012US20120200347 Skewed placement grid for very large scale integrated circuits
08/09/2012US20120199964 Electronic device having stack-type semiconductor package and method of forming the same
08/09/2012US20120199963 Package-on-Package Using Through-Hole Via Die on Saw Streets
08/09/2012DE202012006694U1 LED Modul mit circadianer Wirkung LED module with circadian effect
08/09/2012DE112009004640T5 Anordnung wechselstrombetriebener Leuchtdioden mit Überlastungsschutz Arrangement AC-driven LEDs with overload protection
08/09/2012DE102011010752A1 LED-Beleuchtungsvorrichtung mit einem ersten LED-Chip und einem zweiten LED-Chip und Verfahren zu dessen Herstellung LED lighting device comprising a first LED chip and a second LED chip, and process for its preparation
08/09/2012DE102011010362A1 Semiconductor device has planar conductor that is formed on insulation layer in opposite side of substrate, where lateral edge of conductor is contacted and covered with metal film
08/08/2012EP2485256A2 A semiconductor device
08/08/2012EP2485254A1 Insulation circuit board, and power semiconductor device or inverter module using the same
08/08/2012EP2483937A1 Optoelectronic component
08/08/2012EP2483923A1 Optoelectronic semiconductor chip and method for adapting a contact structure for electrically contacting an optoelectronic semiconductor chip
08/08/2012EP2483922A1 Circuit arrangement and manufacturing method thereof
08/08/2012CN202373625U Packaging structure of light-emitting diode (LED) modules
08/08/2012CN202373623U Light emitting diode (LED) support and LED module group
08/08/2012CN102629657A Clip type sheet LED patch structure and patch method thereof
08/08/2012CN102629604A Cantilever type IC (Integrated Circuit) chip stack package of BT (Bismaleimide Triazine) substrate and production method of cantilever type IC chip stack package
08/08/2012CN102044535B Surface mounted device (SMD) light emitting diode (LED) device and display module thereof for outdoor display screen
08/08/2012CN101926002B Lighting unit with temperature compensation
08/08/2012CN101901800B Light emitting module and illumination device
08/08/2012CN101866995B Light-emitting diode packaging structure
08/08/2012CN101740557B Vertical-type alternative-current light emitting diode
08/08/2012CN101621065B Circuit device
08/08/2012CN101577271B Semiconductor device and its manufacturing method
08/08/2012CN101477980B Stacked wafer level package having a reduced size
08/08/2012CN101467500B Interconnect substrate and electronic circuit mounted structure
08/08/2012CN101375299B Memory card and memory card manufacturing method
08/07/2012US8238134 Memory module and memory system
08/07/2012US8237493 Semiconductor device and power supply device using the same
08/07/2012US8237470 Universal IO unit, associated apparatus and method
08/07/2012US8237253 Package structures
08/07/2012US8237251 Semiconductor device including semiconductor chips with different thickness
08/07/2012US8237173 Semiconductor light emitting device, method of manufacturing the same, and lighting apparatus and display apparatus using the same
08/02/2012WO2012102303A1 Electronic component module and electronic component element
08/02/2012WO2012101547A1 Led-based modular assembly
08/02/2012WO2012101488A1 Led package comprising encapsulation
08/02/2012WO2012100721A1 Packaging structure
08/02/2012WO2012039120A4 Printed circuit board
08/02/2012US20120195396 Stacked digital/rf system-on-chip with integral isolation layer
08/02/2012US20120195037 Led light sources for image projection systems
08/02/2012US20120194216 3D Semiconductor Device
08/02/2012US20120193772 Stacked die packages with flip-chip and wire bonding dies
08/02/2012US20120193621 3d semiconductor device
08/02/2012DE102012001769A1 Gebondete gestapelte wafer und verfahren zum elektroplattieren gebondeter gestapelter wafer Bonded wafer stacked and moved to electroplate bonded stacked wafer
08/02/2012DE102011090085A1 Halbleiterchipstapel und Halbleiterbauelementherstellungsverfahren Semiconductor chip stack and semiconductor device manufacturing method
08/02/2012DE102011009697A1 Leuchtmodul zur Abstrahlung von Mischlicht Light module for emitting mixed light
08/02/2012DE102011003284A1 Leistungshalbleiterelement und Anordnung eines Leistungshalbleiterelements zu mindestens einer Solarzelle Power semiconductor element and arrangement of a power semiconductor element to at least one solar cell
08/01/2012EP2482342A1 Light emitting device
08/01/2012EP2482312A2 Power supply module and packaging and integrating method thereof
08/01/2012EP2482311A2 Semiconductor device, method of manufacturing semiconductor device, and electronic device
08/01/2012EP2068378B1 LED backlight for a liquid crystal display device
08/01/2012CN202363515U LED device and LED module device thereof
08/01/2012CN202363455U Lead frame and lead frame array used for packaging power IC and packaging structure
08/01/2012CN102625948A 3D memory devices decoding and routing systems and methods
08/01/2012CN102625516A Power IC, lead frame and packaging structure comprising power IC and lead frame
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