| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
|---|
| 01/29/2013 | US8361881 Method for alternately contacting two wafers |
| 01/24/2013 | WO2013012450A1 Inductive structure formed using through silicon vias |
| 01/24/2013 | WO2013010636A1 Optoelectronic module comprising a lens system |
| 01/24/2013 | WO2013010634A1 Optoelectronic module with improved optical system |
| 01/24/2013 | WO2013010284A2 Opto-electronic modules and methods of manufacturing the same and appliances and devices comprising the same |
| 01/24/2013 | US20130021093 Dual-function integrated circuit |
| 01/24/2013 | US20130020720 Semiconductor packages and methods of forming the same |
| 01/24/2013 | DE112010002705T5 Multi-Chip-Baugruppe und Verfahren zur Bereitstellung von Chip-Chip-Zwischenverbindungen in demselben Gebiet der Erfindung Multi-chip module and method of providing chip-chip interconnections in the same Field of the Invention |
| 01/24/2013 | DE102012106456A1 Eine weißes Licht aussendende Vorrichtung, sowie Anzeigegerät und Beleuchtungsgerät, die diese nutzen A white light emitting device and display device and illumination device, which they use |
| 01/24/2013 | DE102012106454A1 Halbleiterbauelemente, die zu Mono- und Multi-Ranks kompatibel sind Semiconductor devices that are compatible with single and multi-Ranks |
| 01/24/2013 | DE102011107895A1 Optoelektronisches Modul mit Linsensystem The optoelectronic module with lens system |
| 01/24/2013 | DE102011107893A1 Optoelektronisches Modul mit verbesserter Optik The optoelectronic module with improved optics |
| 01/24/2013 | DE102011107892A1 Method for coating e.g. chip-on-board UV-LED module utilized in solar cell, involves curing and cross-linking liquid silicone with optoelectronic components and carriers, and removing carrier with hardened silicone coating from mold |
| 01/24/2013 | DE102011079403A1 Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements Optoelectronic component and process for producing an optoelectronic component |
| 01/24/2013 | CA2842148A1 Optoelectronic module with improved optical system |
| 01/24/2013 | CA2842117A1 Optoelectronic module comprising a lens system |
| 01/23/2013 | EP2549553A2 Led module and manufacturing method thereof |
| 01/23/2013 | EP2549534A1 Semiconductor device |
| 01/23/2013 | EP2549533A1 Double-sided flip chip package |
| 01/23/2013 | EP2548226A1 Multi-chip package with offset die stacking and method of making same |
| 01/23/2013 | EP2547258A1 Implantable biomedical devices on bioresorbable substrates |
| 01/23/2013 | CN202695546U Light emitting diode (LED) support with surface mount device resistors and LED device with same |
| 01/23/2013 | CN202695543U Full-color direct-inserting LED (Light Emitting Diode) lamp bead and display screen thereof |
| 01/23/2013 | CN202695536U Polycrystalline integrated high-power light-emitting diode (LED) packaging structure |
| 01/23/2013 | CN202695442U High brightness light emitting diode (LED) packaging device |
| 01/23/2013 | CN202695441U Light-emitting diode (LED) light source module |
| 01/23/2013 | CN202695440U Light emitting diode (LED) integrated optical source |
| 01/23/2013 | CN202695439U LED die set with LED chip directly encapsulated on rigid-flexible circuit board |
| 01/23/2013 | CN202695438U Ultra-fast recovery rectified diode module for large current |
| 01/23/2013 | CN202695437U 晶闸管模块 Thyristor module |
| 01/23/2013 | CN202695436U Expitaxy diode module |
| 01/23/2013 | CN202695435U 独立可控晶闸管模块 Independently controllable thyristor module |
| 01/23/2013 | CN202695434U Series module of thyristors |
| 01/23/2013 | CN202695433U One-phase rectifier bridge device |
| 01/23/2013 | CN202695432U 整流晶闸管模块 Thyristor rectifier module |
| 01/23/2013 | CN202695431U Thyristor rectifier diode module |
| 01/23/2013 | CN202695430U 封装晶闸管模块 Package thyristor module |
| 01/23/2013 | CN202695429U Ultra fast recovery epitaxial diode |
| 01/23/2013 | CN202695428U Insulated gate bipolar transistor (IGBT) power module |
| 01/23/2013 | CN202695427U Multi-chip wafer-level packaging structure |
| 01/23/2013 | CN202694717U Surface mounted chip on board (COB) package light-emitting diode (LED) dot matrix module |
| 01/23/2013 | CN202691647U Warm white LED (Light Emitting Diode) lamp with high brightness and high color rendering index |
| 01/23/2013 | CN102893711A Wiring method, construction being wired on the surface thereof, semiconductor device, printed circuit board, memory card, electrical device, module, and multi-layered circuit board |
| 01/23/2013 | CN102893397A Three-dimensional integrated circuit, processor, semiconductor chip, and method for manufacturing three-dimensional integrated circuit |
| 01/23/2013 | CN102893396A Semiconductor device and method for manufacturing same |
| 01/23/2013 | CN102893395A Large-area flexible OLED light source |
| 01/23/2013 | CN102893394A Photovoltaic window assembly with solar control properties |
| 01/23/2013 | CN102891245A High-power white light emitting diode (LED) packaging structure employing fluorescence wafer and packaging method thereof |
| 01/23/2013 | CN102891226A Manufacturing method of high-voltage alternating semiconductor LED (light-emitting diode) chips |
| 01/23/2013 | CN102891222A Packaging method of light-emitting or light-receiving diode |
| 01/23/2013 | CN102891141A Waterproof anti-corrosion high-heat dispersion and high-insulation LED (Light-Emitting Diode) ceramic integrated light source and manufacturing method of the same |
| 01/23/2013 | CN102891140A Light emitting diode (LED) wafer and power type LED |
| 01/23/2013 | CN102891139A Double-sided flip chip package |
| 01/23/2013 | CN102891138A Multi-die building block for stacked-die package and method of manufacturing the same |
| 01/23/2013 | CN102891137A 半导体封装件 Semiconductor package |
| 01/23/2013 | CN102891136A Semiconductor packages and methods of forming the same |
| 01/23/2013 | CN102889480A Three-dimensional luminous light emitting diode (LED) lamp bulb module and manufacturing method thereof |
| 01/23/2013 | CN102222665B Integrated LED (light emitting diode) module with thin fly's-eye lens |
| 01/23/2013 | CN102201382B Semiconductor packaging piece and manufacturing method thereof |
| 01/23/2013 | CN102130113B Submounts for semiconductor light emitting device packages and semiconductor light emitting device packages including the same |
| 01/23/2013 | CN102122653B Production process of bipolar light-emitting diode |
| 01/23/2013 | CN102117799B Buried multi-chip semiconductor package structure and manufacturing method thereof |
| 01/23/2013 | CN102064265B Semiconductor chip assembly with post/base heat spreader and substrate |
| 01/23/2013 | CN102054827B Light-emitting diode wafer encapsulation body and encapsulation method thereof |
| 01/23/2013 | CN101996983B Light-emitting diode encapsulation structure and bracket structure |
| 01/23/2013 | CN101971377B Led light engine kernel and method of making the kernel |
| 01/23/2013 | CN101908514B Semiconductor device |
| 01/23/2013 | CN101652004B White light LED circuit and method for controlling average current of white light LED |
| 01/23/2013 | CN101447477B Light emitting diode package, method for fabricating the same and backlight assembly including the same |
| 01/22/2013 | US8358150 Programmable microcontroller architecture(mixed analog/digital) |
| 01/22/2013 | US8358016 Semiconductor package having an internal cooling system |
| 01/22/2013 | US8357999 Assembly having stacked die mounted on substrate |
| 01/22/2013 | US8357899 Color correction circuitry and methods for dual-band imaging systems |
| 01/22/2013 | CA2520992C Method for manufacturing an electronic module and an electronic module |
| 01/17/2013 | WO2013009871A2 Memory module in a package |
| 01/17/2013 | WO2013009866A2 Memory module in a package |
| 01/17/2013 | WO2013009741A1 De-skewed multi-die packages |
| 01/17/2013 | WO2013008424A1 Power semiconductor module |
| 01/17/2013 | WO2013007029A1 Chip-on-package structure for multiple die stacks |
| 01/17/2013 | US20130016445 RC Triggered ESD Protection Device |
| 01/17/2013 | US20130015915 Semiconductor device |
| 01/17/2013 | US20130015589 Chip-on-package structure for multiple die stacks |
| 01/17/2013 | US20130015496 Power Semiconductor Device |
| 01/17/2013 | US20130015484 Led lamps |
| 01/17/2013 | DE102012212119A1 Leistungshalbleitervorrichtung Power semiconductor device |
| 01/17/2013 | DE102011078998A1 Lichtemittierendes Bauelement und Verfahren zum Herstellen eines lichtemittierenden Bauelements The light emitting device and method for manufacturing a light emitting device |
| 01/17/2013 | DE102011078971A1 LED lighting device for use in form of e.g. quasi-endless belt, has partially reflecting transparent covering to cover semiconductor light sources and color change regions arranged adjacent to light sources |
| 01/16/2013 | EP2546899A1 Light emitting module, light source device, liquid crystal display device, and method for manufacturing light emitting module |
| 01/16/2013 | EP2546876A1 System and method for wafer level packaging |
| 01/16/2013 | EP2546875A2 Light-emitting device and illumination fixture using the same |
| 01/16/2013 | EP2546874A1 Stacked Half-Bridge Power Module |
| 01/16/2013 | EP2546873A2 Semiconductor device |
| 01/16/2013 | EP2546869A1 Semiconductor device, and process for manufacture of semiconductor device |
| 01/16/2013 | EP2544598A1 Waterproof stretchable optoelectronics |
| 01/16/2013 | CN202679262U Three phase bridge apparatus |
| 01/16/2013 | CN202679259U 三相桥式整流模块 Three-phase bridge rectifier modules |
| 01/16/2013 | CN202678406U Split type dimmable SMD-LED incandescent lamp |
| 01/16/2013 | CN202678405U Light emitting diode (LED) device |
| 01/16/2013 | CN202678311U Illumination COB packaging structure of a LED lamp |
| 01/16/2013 | CN202678310U A large-power LED integrated array lighting source based on COB technology |