| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 02/06/2013 | CN202721192U Radiating type LED2835 double crystal packing structure |
| 02/06/2013 | CN202721187U Frameless COB type LED light-emitting device |
| 02/06/2013 | CN202721186U Integrated high-efficiency lighting device provided with multi-layer structure |
| 02/06/2013 | CN202721178U High light efficiency LED light source module based on KGD design |
| 02/06/2013 | CN202721127U High-voltage thyristor valve bank module integrated with dynamic and static voltage-sharing loops |
| 02/06/2013 | CN202721126U Integrated optical sensor package |
| 02/06/2013 | CN202721125U Combined testability LED packaging support |
| 02/06/2013 | CN202721124U 6500V diode high-voltage module |
| 02/06/2013 | CN202721123U Light emitting diode |
| 02/06/2013 | CN202721122U LED (light emitting diode) double crystal patch with adjustable color rendering index |
| 02/06/2013 | CN202721121U Surface-mounted LED (light emitting diode) double crystal packing structure |
| 02/06/2013 | CN202721120U LED device in form of chip-on-board (COB) package |
| 02/06/2013 | CN102918106A Semiconductor-sealing epoxy resin composition and semiconductor device using same |
| 02/06/2013 | CN102917161A Method for seamlessly splicing 3*3 plane array detector by adopting total reflection prisms |
| 02/06/2013 | CN102916119A LED (light-emitting diode) lamp panel with good heat dissipation property and low cost |
| 02/06/2013 | CN102916108A Light-emitting diode packaging structure |
| 02/06/2013 | CN102916106A Light-emitting diode |
| 02/06/2013 | CN102916008A Semiconductor device, DC/DC converter and power supply |
| 02/06/2013 | CN102916007A 3-D (three-dimension) Hall sensor and manufacturing method thereof |
| 02/06/2013 | CN102916006A Integrated high-power LED (Light Emitting Diode) light source with more than two convex mirrors and manufacturing process thereof |
| 02/06/2013 | CN102916005A High-color-rendering LED light source on basis of green light chip compensation |
| 02/06/2013 | CN102916004A 发光二极管装置 Light-emitting diode device |
| 02/06/2013 | CN102916003A Triggering and rectifying integrated component |
| 02/06/2013 | CN102915987A Semiconductor arrangement |
| 02/06/2013 | CN102915980A Substrate, electronic device, and electronic apparatus |
| 02/06/2013 | CN102913803A Light emitting diode (LED) lamp strip |
| 02/06/2013 | CN102185078B Outdoor surface mounted light emitting diode (LED) packaging structure and packaging method |
| 02/06/2013 | CN102185051B Light-emitting, radiating and wiring process of light-emitting diode (LED) outdoor product chip integrated package |
| 02/06/2013 | CN101840917B Integrate circuit and subassembly |
| 02/06/2013 | CN101800183B Combined semiconductor apparatus with thin semiconductor films |
| 02/06/2013 | CN101719719B Novel thyristor converter valve module |
| 02/06/2013 | CN101593749B Photoelectric converter |
| 02/05/2013 | US8368231 Chipstack package and manufacturing method thereof |
| 02/05/2013 | US8368230 Electronic part and method of manufacturing the same |
| 02/05/2013 | US8368227 Semiconductor element and package having semiconductor element |
| 02/05/2013 | US8368213 Low fabrication cost, fine pitch and high reliability solder bump |
| 02/05/2013 | US8368150 High performance IC chip having discrete decoupling capacitors attached to its IC surface |
| 02/01/2013 | DE202013100158U1 Vollfarben - LED - Verkapselungsstruktur mit Steuerungsmechanismus Full color - LED - Encapsulation with control mechanism |
| 01/31/2013 | WO2013015862A1 Improved led lighting systems and/or methods of making the same |
| 01/31/2013 | WO2013015031A1 Semiconductor device and method for producing a semiconductor device |
| 01/31/2013 | WO2013014542A1 A system and method to process horizontally aligned graphite nanofibers in a thermal interface material used in 3d chip stacks |
| 01/31/2013 | WO2013013931A1 Lighting device |
| 01/31/2013 | US20130029848 Low-loss superconducting devices |
| 01/31/2013 | US20130027127 Integrated circuit systems including vertical inductors |
| 01/31/2013 | US20130027113 Power Semiconductor Chip Having Two Metal Layers on One Face |
| 01/31/2013 | US20130027083 Semiconductor integrated circuit device |
| 01/31/2013 | DE112006004098B4 Halbleiter-Baugruppe mit einer Lead-Frame-Anordnung mit mindestens zwei Halbleiterchips und Verfahren zu deren Herstellung Semiconductor package with a lead frame assembly having at least two semiconductor chips and processes for their preparation |
| 01/31/2013 | DE102012213043A1 Reflector arrangement for LED used in signage, has reflector that is provided with U-shaped main portion having two transparent side sections |
| 01/31/2013 | DE102012106566A1 Leistungshalbleiterchip mit zwei Metallschichten auf einer Fläche Power semiconductor chip with two metal layers on a surface |
| 01/31/2013 | DE102012106266A1 Stromversorgungsgehäusemodul und Verfahren zur Herstellung eines Stromversorgungsgehäusemoduls Power supply module and housing method for manufacturing a power supply module housing |
| 01/31/2013 | DE102011079697A1 Beleuchtungsvorrichtung Lighting device |
| 01/31/2013 | DE102011053006A1 Mit Wechselstrom angesteuertes LED-Modul mit hohem Wirkungsgrad That is controlled with AC LED module with high efficiency |
| 01/30/2013 | EP2551904A1 Semiconductor device, semiconductor module structure configured by vertically stacking semiconductor devices, and manufacturing method thereof |
| 01/30/2013 | EP2551903A2 Light emitting device package and lighting system including the same |
| 01/30/2013 | EP2551902A1 Power module and method for manufacturing same |
| 01/30/2013 | DE202012011765U1 Manövrierhilfe Maneuvering aid |
| 01/30/2013 | CN202713169U 半导体装置 Semiconductor device |
| 01/30/2013 | CN202712266U Fluorescent transparent ceramic LED sealing structure |
| 01/30/2013 | CN202712254U High-integrated high-light-efficiency thermoelectricity separation power type light emitting diode |
| 01/30/2013 | CN202712253U High-integrated high-light-efficiency diode circuit structure and diode |
| 01/30/2013 | CN202712183U 半导体模块 Semiconductor Modules |
| 01/30/2013 | CN202712182U LED COB light source packaging structure with high light efficiency and heat conduction |
| 01/30/2013 | CN202712181U LED module group type packaging structure |
| 01/30/2013 | CN202712180U LED single lamp for promoting plant growth |
| 01/30/2013 | CN202712179U White light LED light source of high brightness and high color rendering index |
| 01/30/2013 | CN202712178U Stereoscopic light-emitting device composed of upside-down mounted light-emitting unit arrays |
| 01/30/2013 | CN202712177U Two-sided light emitting plane sheet type LED package structure |
| 01/30/2013 | CN202712176U LED sealing structure using transparent oxide substrate |
| 01/30/2013 | CN202712175U Fluorescent film planar sheet type LED array light source |
| 01/30/2013 | CN202712174U Double fluorescent film planar sheet type LED array light source |
| 01/30/2013 | CN202712173U Parallel-type IGBT module |
| 01/30/2013 | CN102906874A Power semiconductor module |
| 01/30/2013 | CN102906833A Galvanic isolation transformer |
| 01/30/2013 | CN102906563A Method for manufacturing semiconductor device |
| 01/30/2013 | CN102905468A Printed circuit board having single reflective structure and led packaging manufacturing method utilizing the same |
| 01/30/2013 | CN102905465A 双面电路板结构 Double-sided circuit board structure |
| 01/30/2013 | CN102905061A Seamless splicing imaging photoelectric system based on double lenses and nine surface array detectors |
| 01/30/2013 | CN102903837A Light emitting device package and lighting system including the same |
| 01/30/2013 | CN102903833A Wide angle based indoor lighting lamp |
| 01/30/2013 | CN102903831A White LED structure and production process thereof |
| 01/30/2013 | CN102903829A Light-emitting diode light source device |
| 01/30/2013 | CN102903712A Input and output type photoelectric device |
| 01/30/2013 | CN102903711A Lamp panel technology of LED (Light Emitting Diode) lamp |
| 01/30/2013 | CN102903710A High-light-power-density ultraviolet ray LED (Light-emitting Diode) curing light source and preparation method thereof |
| 01/30/2013 | CN102903709A COB (Chip on Board) LED module and manufacturing method thereof |
| 01/30/2013 | CN102903708A LED (Light Emitting Diode) device, LED lamp and LED module |
| 01/30/2013 | CN102903707A Light emitting device package and manufacturing method thereof |
| 01/30/2013 | CN102903706A Light emitting device package and illuminance system using the same |
| 01/30/2013 | CN102903705A Light emitting diode packaging structure and manufacturing method thereof |
| 01/30/2013 | CN102903704A Hybrid integrated high-efficiency solar cell module |
| 01/30/2013 | CN102903703A Chip packaging stacking structure |
| 01/30/2013 | CN102903693A Power device package module and manufacturing method thereof |
| 01/30/2013 | CN102226995B LED (light-emitting diode) packaging structure and manufacturing method thereof |
| 01/30/2013 | CN102214652B LED (light emitting diode) packaging structure and preparation method thereof |
| 01/30/2013 | CN101872753B Restoration of electrical and mechanical connectability to an electrical device with a face equipped with contact studs |
| 01/30/2013 | CN101847590B Method for packaging multi-laminated multi-chip on flexible circuit board and packaging chipset |
| 01/29/2013 | US8362830 Power semiconductor device |
| 01/29/2013 | US8362829 Semiconductor device |
| 01/29/2013 | US8362800 3D semiconductor device including field repairable logics |
| 01/29/2013 | US8362621 Microelectronic devices including multiple through-silicon via structures on a conductive pad and methods of fabricating the same |