| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 02/21/2013 | DE102011081099A1 Anordnung mit Sensor oder Aktor und Bausteinen Assembly with sensor or actuator and components |
| 02/20/2013 | EP2560205A2 Light emitting module |
| 02/20/2013 | EP2560204A2 Power semiconducter module and semiconducter module assembly with multiple power semiconducter modules |
| 02/20/2013 | EP2560203A1 Power semiconductor arrangement |
| 02/20/2013 | EP2559066A1 Dual-side interconnected cmos for stacked integrated circuits |
| 02/20/2013 | CN202749413U Surface mounted LED (light-emitting diode) |
| 02/20/2013 | CN202749373U Infrared remote control receiving amplifier with double-layer structure |
| 02/20/2013 | CN202749372U Patch type LED (light-emitting diode) |
| 02/20/2013 | CN202749371U Stacked transient voltage suppression diode |
| 02/20/2013 | CN202749370U Stacking type diode |
| 02/20/2013 | CN202749369U Infrared remote control amplifier |
| 02/20/2013 | CN202746999U High-voltage direct-current light-emitting element |
| 02/20/2013 | CN102939652A 光源 Light source |
| 02/20/2013 | CN102938402A Chip-on-board (COB) packaging high-power light-emitting diode (LED) lamp and manufacture method thereof |
| 02/20/2013 | CN102938401A Stack packages having fastening element and halogen-free inter-package connector |
| 02/20/2013 | CN102169878B Spliced light emitting diode module |
| 02/20/2013 | CN101667570B 电路结构 Circuit configuration |
| 02/20/2013 | CN101452917B 光源装置 The light source device |
| 02/19/2013 | USRE44019 Stacked semiconductor module |
| 02/19/2013 | US8378742 Driver for a semiconductor chip |
| 02/19/2013 | US8378715 Method to construct systems |
| 02/19/2013 | US8378712 Integrated circuit with crosslinked interconnect networks |
| 02/19/2013 | US8378706 Method to dice back-contact solar cells |
| 02/19/2013 | US8378347 LED package |
| 02/14/2013 | WO2013023157A2 Thin film structure for high density inductors and redistribution in wafer level packaging |
| 02/14/2013 | WO2013021847A1 Semiconductor device manufacturing method, semiconductor device, and jig for forming wiring |
| 02/14/2013 | WO2013021726A1 Semiconductor device and method for manufacturing semiconductor device |
| 02/14/2013 | WO2013021684A1 Power semiconductor device |
| 02/14/2013 | WO2013021647A1 Semiconductor module, semiconductor device provided with semiconductor module, and method for manufacturing semiconductor module |
| 02/14/2013 | WO2013021519A1 Semiconductor light emitting device and light emitting module |
| 02/14/2013 | WO2013021255A1 Methods of forming bonded semiconductor structures in 3d integration processes using recoverable substrates, and bonded semiconductor structures formed by such methods |
| 02/14/2013 | WO2013020920A1 Connecting element for a multi-chip module, and multi-chip module |
| 02/14/2013 | WO2013020238A1 Opto-electronic module and method for manufacturing the same |
| 02/14/2013 | WO2012012338A8 Embedded structures and methods of manufacture thereof |
| 02/14/2013 | DE102011086354A1 Multichip-baugruppe auf waferebene Multi-chip module at wafer level |
| 02/14/2013 | DE102011080929A1 Method for manufacturing composite to interconnect two joining parts e.g. semiconductor chip, of power semiconductor module together, involves heating joining parts and connecting unit to predetermined maximum temperature by heating element |
| 02/14/2013 | DE102011080861A1 Leistungselektronisches System mit einer Schalt- und einer Ansteuereinrichtung Power electronic system with a switch and a control device |
| 02/14/2013 | DE102011080705A1 Verbindungselement für ein Multichipmodul und Multichipmodul Connecting element for a multi-chip module, and multi chip module |
| 02/13/2013 | EP2557595A1 Power electronics system with a switching device and a control device |
| 02/13/2013 | EP2557594A1 Semiconductor device reducing risks of a wire short-circuit and a wire flow |
| 02/13/2013 | EP2556299A2 Flat lighting elements, array of flat lighting elements and method for producing flat lighting elements |
| 02/13/2013 | EP2556292A1 Luminaire with optical plate |
| 02/13/2013 | EP2138021B1 Electrical connection of components |
| 02/13/2013 | CN202736964U High voltage light-emitting diode (LED) chip |
| 02/13/2013 | CN202736918U Packaging wafer integrating signal isolation transformers and protection elements |
| 02/13/2013 | CN202736917U LED packaging structure |
| 02/13/2013 | CN202736916U Fast recovery rectifier bridge |
| 02/13/2013 | CN202736915U Rectifier bridge structure |
| 02/13/2013 | CN202736914U Three-phase rectifier bridge |
| 02/13/2013 | CN202736913U Semiconductor packaging body and mobile phone having the semiconductor packaging body arranged inside |
| 02/13/2013 | CN202736912U Photoelectric coupler |
| 02/13/2013 | CN202736909U Pagoda type IC chip stacking package piece of lead wire frame |
| 02/13/2013 | CN202733562U Light-emitting diode (LED) spherical surface integrated light source |
| 02/13/2013 | CN102934228A Miniature surface mount device |
| 02/13/2013 | CN102934227A Stacked ic comprising integrated voltage regulator with embedded passive device |
| 02/13/2013 | CN102934225A Semiconductor device and process for manufacture thereof |
| 02/13/2013 | CN102931852A Power transducer |
| 02/13/2013 | CN102931331A A light-emitting device equipped with a heat pipe |
| 02/13/2013 | CN102931182A Packaging device of compact single-phase integrated drive circuit and single-phase integrated drive circuit |
| 02/13/2013 | CN102931181A Packaging manufacture method of integrating two bidirectional triode thyristor chips in one photoelectric coupler |
| 02/13/2013 | CN102931180A LED light source and manufacturing method thereof |
| 02/13/2013 | CN102931179A Light emitting device |
| 02/13/2013 | CN102931178A Novel light emitting diode (LED) integrated optical source packaging structure |
| 02/13/2013 | CN102931177A High colour development LED (light-emitting diode) light source based on red-light chip vertical seal compensation |
| 02/13/2013 | CN102931176A High heat-radiation multi-wafer encapsulation structure |
| 02/13/2013 | CN102931175A Thyristor module |
| 02/13/2013 | CN102931174A Miniature type surface mounting single-phase full-wave bridge rectifier and manufacturing method of rectifier |
| 02/13/2013 | CN102931173A Multi-chip wafer level package |
| 02/13/2013 | CN102931169A Embedded semiconductor power module and package thereof |
| 02/13/2013 | CN102270632B High voltage light emitting diode and manufacturing method thereof |
| 02/13/2013 | CN102214653B Packaging structure of high-power LED (light-emitting diode) chip |
| 02/13/2013 | CN102074537B Chip packaging cell |
| 02/13/2013 | CN101110462B Leadframe-based packages for solid state light emitting devices and methods of forming leadframe-based packages for solid state light emitting devices |
| 02/12/2013 | US8374438 Visual template-based thermal inspection system |
| 02/12/2013 | US8373561 Infrared detector |
| 02/12/2013 | US8373441 Orienting voltage translators in input/output buffers |
| 02/12/2013 | US8373428 Probe card assembly and kit, and methods of making same |
| 02/12/2013 | US8373277 Stacked die in die BGA package |
| 02/12/2013 | US8373058 Solar cell and method of adjusting color of the same |
| 02/12/2013 | US8372693 Semiconductor device including semiconductor chips with different thickness |
| 02/11/2013 | DE202011051897U1 Schlauch zur Führung von Fluiden Hose for conducting fluids |
| 02/07/2013 | WO2013018811A1 Power semiconductor module |
| 02/07/2013 | WO2013018343A1 Semiconductor module and inverter having semiconductor module mounted thereon |
| 02/07/2013 | WO2013018330A1 Substrate for mounting elements, and semiconductor power module |
| 02/07/2013 | WO2013017917A1 Semiconductor assembly |
| 02/07/2013 | WO2013017372A1 Structure comprising a plurality of optoelectronic modules |
| 02/07/2013 | WO2013017364A2 Optoelectronic assembly and method for producing an optoelectronic assembly |
| 02/07/2013 | US20130033308 Semiconductor device |
| 02/07/2013 | DE102012213581A1 LED-Packung und Verfahren zum Herstellen derselben LED package and method for manufacturing the same |
| 02/07/2013 | DE102012213208A1 Halbleiteranordnung Semiconductor device |
| 02/07/2013 | DE102011052322A1 Illuminating arrangement for illuminating underground parking, has LED-light modules detachably fastened at elongate module carrier, which conducts lost heat, which incidents on LED-light modules, away from LED-light modules |
| 02/07/2013 | DE102011006688B4 Beleuchtungsvorrichtung mit einer Anzahl von LED-Chips mit Lichtboxfunktion A lighting device with a number of LED chips with Lichtboxfunktion |
| 02/07/2013 | DE10152533B4 Hochfrequenz-Schaltungsplatineneinheit, Hochfrequenz-Modul, bei dem die Einheit verwendet ist, elektronische Vorrichtung, bei der das Modul verwendet ist, und Verfahren zur Herstellung der Hochfrequenz-Schaltungsplatineneinheit High-frequency circuit board unit, high-frequency module in which the unit is used, electronic device in which the module is used, and processes for making the high-frequency circuit board unit |
| 02/06/2013 | EP2555409A1 Electric vehicle control device |
| 02/06/2013 | EP2555240A1 Packaging substrate having embedded interposer and fabrication method thereof |
| 02/06/2013 | EP2555239A2 Thermal package with heat slug for die stacks |
| 02/06/2013 | EP2555238A1 Multichip module, printed wiring board unit, method for manufacturing multichip module, and method for manufacturing printed wiring board unit |
| 02/06/2013 | EP2553726A1 Optoelectronic semiconductor chip |
| 02/06/2013 | EP2553723A2 Photovoltaic window assembly with solar control properties |
| 02/06/2013 | EP2553722A2 Apparatuses enabling concurrent communication between an interface die and a plurality of dice stacks, interleaved conductive paths in stacked devices, and methods for forming and operating the same |