| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
|---|
| 03/06/2013 | CN102959703A Encapsulated control module for a motor vehicle |
| 03/06/2013 | CN102959698A Chip elements mounted on wires having an incipient breaking point |
| 03/06/2013 | CN102959417A 3d integrated circuit and test method for same |
| 03/06/2013 | CN102956807A Efficiently integrated LED (Light Emitting Diode) light source |
| 03/06/2013 | CN102956805A Light emitting element |
| 03/06/2013 | CN102956799A Light emitting device |
| 03/06/2013 | CN102956789A Package structure of multilayer arrayed LED light engine |
| 03/06/2013 | CN102956757A Manufacturing method of LED encapsulation structure |
| 03/06/2013 | CN102956630A Three-dimensional integrated semiconductor system and method for forming the same |
| 03/06/2013 | CN102956629A Back-to-back stacked dies |
| 03/06/2013 | CN102956628A 发光二极管封装 Light emitting diode package |
| 03/06/2013 | CN102956627A LED (Light Emitting Diode) package structure |
| 03/06/2013 | CN102956626A LED structure |
| 03/06/2013 | CN102956625A Light-emitting device |
| 03/06/2013 | CN102956624A Multilayer arrayed LED light engine |
| 03/06/2013 | CN102956623A Controlling device performance by forming a stressed backside dielectric layer |
| 03/06/2013 | CN102956619A Semiconductor device |
| 03/06/2013 | CN102956615A Installing substrate and circuit device using same |
| 03/06/2013 | CN102956610A Semiconductor arrangement |
| 03/06/2013 | CN102956594A Power overlay structure with leadframe connections |
| 03/06/2013 | CN102956593A Power electronics system with a switching device and a control device |
| 03/06/2013 | CN102956570A Power semiconducter module and semiconducter module assembly with multiple power semiconducter modules |
| 03/06/2013 | CN102956512A Flip-chip type semiconductor full-wave rectifying element and production method thereof |
| 03/06/2013 | CN102956510A Method for manufacturing combination and power semiconductor module |
| 03/06/2013 | CN102956468A Semiconductor device and method of manufacturing a semiconductor device including grinding steps |
| 03/06/2013 | CN102954366A Light engine with led switching array |
| 03/06/2013 | CN102386311B Integrated light-emitting diode (LED) light source and manufacturing method thereof |
| 03/06/2013 | CN102347318B All-piezoelectric abreast pushing three-friction-force stepper and scanning probe microscope body |
| 03/06/2013 | CN102290524B LED (Light Emitting Diode) device and LED (Light Emitting Diode) module device thereof |
| 03/06/2013 | CN102254902B IGBT (Insulated Gate Bipolar Translator) power half-bridge module |
| 03/06/2013 | CN102088015B Semiconductor packaging piece and manufacture method thereof |
| 03/06/2013 | CN101996979B Interposer, module and electronic device including the same |
| 03/06/2013 | CN101958313B 半导体模块 Semiconductor Modules |
| 03/05/2013 | US8390330 Base cell for implementing an engineering change order (ECO) |
| 03/05/2013 | US8390109 Chip package with plank stack of semiconductor dies |
| 03/05/2013 | US8389938 Method for processing images arising from a photosensitive detector and photosensitive detector |
| 02/28/2013 | WO2013028745A1 Packaging dram and soc in an ic package |
| 02/28/2013 | WO2013028435A1 Package-on-package structures |
| 02/28/2013 | WO2013027832A1 Method for manufacturing semiconductor device, block stacked body, and sequential stacked body |
| 02/28/2013 | WO2013027826A1 Semiconductor device and semiconductor device manufacturing method |
| 02/28/2013 | WO2013027819A1 Semiconductor module |
| 02/28/2013 | WO2013027454A1 Semiconductor device |
| 02/28/2013 | WO2013027409A1 Wiring board and high frequency module using same |
| 02/28/2013 | WO2013002924A3 Power converters having capacitive energy transfer elements and arrangements of energy storage elements for power converters |
| 02/28/2013 | US20130049852 Mofset mismatch characterization circuit |
| 02/28/2013 | US20130049851 Active pull-up/pull-down circuit |
| 02/28/2013 | US20130049840 Implementing differential resonant clock with dc blocking capacitor |
| 02/28/2013 | US20130049228 Semiconductor package having supporting plate and method of forming the same |
| 02/28/2013 | US20130049227 Package stacks and method of manufacturing the same |
| 02/28/2013 | US20130049023 Light emitting device package and lighting system |
| 02/28/2013 | DE102012214917A1 Halbleitervorrichtung und Verfahren zu deren Herstellung Semiconductor device and process for their preparation |
| 02/28/2013 | DE102012108032A1 Halbleiterchippaket und Verfahren Semiconductor chip package and method |
| 02/28/2013 | DE102012107547A1 Gehäuse für eine lichtabgebende Vorrichtung A housing for a light emitting device |
| 02/28/2013 | DE102012100796A1 Chip-Zu-Chip-Abstandskontrolle für eine Halbleiterstruktur und Verfahren zu deren Herstellung Chip-to-chip spacing control for a semiconductor structure and process for their preparation |
| 02/28/2013 | DE102011111980A1 Verfahren zur Herstellung einer Leuchtdiode und Leuchtdiode A method of manufacturing a light emitting diode and light emitting diode |
| 02/28/2013 | DE102011111970A1 LED-Modul-System mit einem LED-Modul LED module system with an LED module |
| 02/28/2013 | DE102011111920A1 Optoelectronic semiconductor device has primary converter and semiconductor chip that are arranged downstream of secondary converter |
| 02/28/2013 | DE102011110799A1 Substrat für den Aufbau elektronischer Elemente Substrate for the development of electronic elements |
| 02/27/2013 | EP2562834A2 Light emitting diode package |
| 02/27/2013 | EP2562832A2 Light emitting diode package, light source module, and lighting system including the same |
| 02/27/2013 | EP2562815A2 Light emitting device and light emitting device package |
| 02/27/2013 | EP2562811A1 Power module and power conversion device provided with said power module |
| 02/27/2013 | CN202758888U Sensor sealing module |
| 02/27/2013 | CN202758887U Light emitting diode module packaging structure |
| 02/27/2013 | CN202758886U Packaging structure of LED lamp panel |
| 02/27/2013 | CN202758885U Light emitting diode module packaging structure |
| 02/27/2013 | CN202758884U Emitter package |
| 02/27/2013 | CN202758883U Stacked semiconductor device assembly |
| 02/27/2013 | CN202758874U Integrated chip |
| 02/27/2013 | CN102947926A Semiconductor integrated circuit device inspection method and semiconductor integrated circuit device |
| 02/27/2013 | CN102945914A Phosphor glass coating for optical wavelength conversion and white light emitting device |
| 02/27/2013 | CN102945845A LED (Light Emitting Diode) device for display screen and display module |
| 02/27/2013 | CN102945844A Light source module |
| 02/27/2013 | CN102944709A Electric meter module structure realized by adopting multi-chip system-level packaging technology and packaging method thereof |
| 02/27/2013 | CN102171825B Power module and encapsulation and integration method thereof |
| 02/27/2013 | CN102142510B Solid light source based on optical wavelength conversion and application of solid light source |
| 02/27/2013 | CN102117876B 半导体封装结构 The semiconductor package structure |
| 02/27/2013 | CN101521246B 成像探测器 Imaging Detectors |
| 02/26/2013 | US8386990 Unique identifier derived from an intrinsic characteristic of an integrated circuit |
| 02/26/2013 | US8386690 On-chip networks for flexible three-dimensional chip integration |
| 02/26/2013 | US8384439 Semiconductor devices and methods of fabricating the same |
| 02/26/2013 | US8384432 Semiconductor device and information processing system including the same |
| 02/26/2013 | US8384428 Pre-configuration programmability of I/O circuitry |
| 02/26/2013 | US8384221 Semiconductor device, LED head and method of manufacturing the same |
| 02/26/2013 | US8384156 Complementary metal oxide semiconductor devices |
| 02/26/2013 | US8383553 Dyes |
| 02/26/2013 | US8382964 Solar-powered pool skimmer lid |
| 02/26/2013 | US8382327 Light tube and power supply circuit |
| 02/21/2013 | WO2013025982A1 Liquid cooling of stacked die through substrate lamination |
| 02/21/2013 | WO2013024428A1 Led mixing chamber with reflective walls formed in slots |
| 02/21/2013 | WO2012175631A3 Method for producing a plurality of optoelectronic semiconductor components in combination, semiconductor component produced in such a way, and use of said semiconductor component |
| 02/21/2013 | US20130043940 Back-to-back stacked dies |
| 02/21/2013 | US20130043939 Integrated Circuit With an Adaptable Contact Pad Reconfiguring Architecture |
| 02/21/2013 | US20130043580 Diode structure |
| 02/21/2013 | US20130043494 Light emitting diode package |
| 02/21/2013 | DE102012213407A1 Halbleiteranordnung Semiconductor device |
| 02/21/2013 | DE102012107403A1 Chip-Gehäuse-Modul für einen Chip und ein Verfahren zum Herstellen eines Chip-Gehäuse-Moduls Chip package for a chip module and a method of manufacturing a chip package module |
| 02/21/2013 | DE102012105764A1 Housing stack structure for wireless mobile phone, has intermediate housing terminals to transfer data signals and address/control signals and to provide power supply voltage for address/control circuit and data circuit, respectively |
| 02/21/2013 | DE102012009098A1 Leuchtvorrichtung Lighting device |
| 02/21/2013 | DE102011081100A1 Anordnung mit Photozellen Arrangement with photocell |