| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 03/14/2013 | WO2013035337A1 Semiconductor module, circuit board |
| 03/14/2013 | WO2013035024A1 Topology of distributing and connecting leds in a large area matrix |
| 03/14/2013 | WO2013006641A3 Ehf communication with electrical isolation and with dielectric transmission medium |
| 03/14/2013 | WO2012082772A3 Apparatus and method for hybrid photovoltaic device having multiple, stacked, heterogeneous, semiconductor junctions |
| 03/14/2013 | US20130063206 Integrated circuit |
| 03/14/2013 | US20130063179 Protecting data from decryption from power signature analysis in secure applications |
| 03/14/2013 | US20130062784 Multi-chip packages providing reduced signal skew and related methods of operation |
| 03/14/2013 | US20130062758 Semiconductor device |
| 03/14/2013 | DE102012204159A1 Power semiconductor module for controlling electric machine in e.g. motor mode, has punching lattice provided with metal strips, where covers of lattice comprise connection between surfaces of electrode with terminal surfaces |
| 03/14/2013 | DE102012200325A1 Halbleiteranordnung mit plattierter Basisplatte A semiconductor device comprising plated base plate |
| 03/14/2013 | DE102012108608A1 Elektronisches Modul Electronic module |
| 03/14/2013 | DE102011113483A1 Verfahren zum Herstellen einer Mehrzahl von optoelektroischen Bauelementen und optoelektronisches Bauelement A method of manufacturing a plurality of components and optoelectronic component optoelektroischen |
| 03/14/2013 | DE102011113255A1 Chipmodul und ein Verfahren zur Herstellung eines Chipmoduls Chip module and a method for producing a chip module |
| 03/13/2013 | EP2568787A1 Semiconductor device and power conversion apparatus using the same |
| 03/13/2013 | EP2568503A2 Light emitting device comprising two stacked LEDs |
| 03/13/2013 | EP2568499A2 Semiconductor device including insulating resin film provided in a space between semiconductor chips |
| 03/13/2013 | EP2567402A1 Light source |
| 03/13/2013 | CN202798537U Motor drive circuit |
| 03/13/2013 | CN202798491U Three-phase AC large power rectifier bridge group |
| 03/13/2013 | CN202797061U COB package high-power LED lamp |
| 03/13/2013 | CN202796952U LED integrated packaging light source module and multi-layer ceramic substrate used thereby |
| 03/13/2013 | CN202796951U Double fluorescent thin film two-sided light-emitting planar wafer LED (Light-Emitting Diode) array light source |
| 03/13/2013 | CN202796950U Semiconductor light-emitting device |
| 03/13/2013 | CN202796949U Five-color encapsulated color mixing LED (Light Emitting Diode) lamp bulb |
| 03/13/2013 | CN202796948U Small-sized LED packaging structure |
| 03/13/2013 | CN202796947U High-luminous-efficiency packaging structure of middle-power white-light surface mounted device-light emitting diode (SMD-LED) device |
| 03/13/2013 | CN202796946U Light-emitting diode (LED) and display screen comprising same |
| 03/13/2013 | CN202796945U Light-emitting diode (LED) and lamp |
| 03/13/2013 | CN202796944U Light-emitting diode (LED) and lamp |
| 03/13/2013 | CN202796943U SMDLED white lamp |
| 03/13/2013 | CN202796942U Insertion type patch-applicable full-color LED lamp bead |
| 03/13/2013 | CN202796941U An LED white-light source with multiple color temperatures |
| 03/13/2013 | CN202796940U Semiconductor light emitting device |
| 03/13/2013 | CN202796939U Light emitting diode device |
| 03/13/2013 | CN202796938U Flip chip of white-light module |
| 03/13/2013 | CN202796937U Color-temperature-adjustable module chip |
| 03/13/2013 | CN202796936U Polycrystalline wide-angle light emitting diode |
| 03/13/2013 | CN202796935U Double-iron-electrode rectification chip |
| 03/13/2013 | CN202796934U Novel solar cell panel |
| 03/13/2013 | CN202796920U Multi-chip quad flat no-lead (QFN) packaging structure |
| 03/13/2013 | CN202791545U Light-emitting diode (LED) panel lamp |
| 03/13/2013 | CN102971793A Rule-based semiconductor die stacking and bonding within a multi-die package |
| 03/13/2013 | CN102970843A Face shield of LED (Light-Emitting Diode) display module, connection method of face shield of LED display module and LED device and LED display module |
| 03/13/2013 | CN102969432A Light-emitting diode packaging structure and manufacture method thereof |
| 03/13/2013 | CN102969377A Photovoltaic subassembly, PN (positive-negative) junction element and manufacturing method of PN junction element |
| 03/13/2013 | CN102969309A 半导体封装 The semiconductor package |
| 03/13/2013 | CN102969308A LED (light-emitting diode) lamp structure and packaging method thereof |
| 03/13/2013 | CN102969307A A light-emitting diode structure and a manufacture method thereof |
| 03/13/2013 | CN102969306A Power module and manufacturing method thereof |
| 03/13/2013 | CN102969305A Die-to-die gap control for semiconductor structure and method |
| 03/13/2013 | CN102969290A 封装结构 Package structure |
| 03/13/2013 | CN102252219B Light-emitting diode (LED) street lamp and high-power LED device |
| 03/13/2013 | CN102214651B LED (light emitting diode) pixel unit device structure and preparation method thereof |
| 03/13/2013 | CN102214650B Light emitting diode (LED) pixel unit device structure and preparation method thereof |
| 03/13/2013 | CN102214649B LED (light-emitting diode) packaging structure and manufacturing method thereof |
| 03/13/2013 | CN102130115B White LED (light emitting diode) planar light source device |
| 03/13/2013 | CN102130078B Heat-conducting insulated composite film and chip stacking structures |
| 03/13/2013 | CN102105983B 半导体装置 Semiconductor device |
| 03/13/2013 | CN102044531B Apparatus and method for vertically-structured passive components |
| 03/13/2013 | CN102034804B Multilayer stacked storage and manufacture method thereof |
| 03/13/2013 | CN101894891B LED wafer package and lighting device using same |
| 03/13/2013 | CN101785093B Semiconductor assemblies and methods of manufacturing such assemblies |
| 03/13/2013 | CN101771127B LED light-emitting module with liquid metal heat dispersion heat sink |
| 03/13/2013 | CN101714545B 半导体装置 Semiconductor device |
| 03/13/2013 | CN101582419B Device and system for mini surface-mount device |
| 03/13/2013 | CN101373722B Semiconductor device and manufacturing method for the same |
| 03/12/2013 | US8395415 Enhanced permutable switching network with multicasting signals for interconnection fabric |
| 03/12/2013 | US8395191 Semiconductor device and structure |
| 03/12/2013 | US8395041 Photoelectric conversion element and solor cell |
| 03/11/2013 | DE202013100293U1 Intergral ausgebildete hocheffiziente mehrschichtige lichtemittierende Vorrichtung Intergral trained highly efficient multi-layer light-emitting device |
| 03/07/2013 | WO2013032725A2 Glass as a substrate material and a final package for mems and ic devices |
| 03/07/2013 | WO2013031147A1 Power conversion device |
| 03/07/2013 | WO2013030663A1 Fluid cooled light emitting diodes |
| 03/07/2013 | WO2013029533A1 Chip-packaging structure, packaging method and electronic device |
| 03/07/2013 | WO2013009741A9 De-skewed multi-die packages |
| 03/07/2013 | US20130057420 Digital-to-analog converter |
| 03/07/2013 | US20130057339 Circuit and Electronic Module for Automatic Addressing |
| 03/07/2013 | US20130057338 Power controller for soc power gating applications |
| 03/07/2013 | US20130056881 Discrete Three-Dimensional Memory |
| 03/07/2013 | US20130056730 Semiconductor device |
| 03/07/2013 | DE19758864B4 Verfahren zur Herstellung eines Leistungsmoduls A process for producing a power module |
| 03/07/2013 | DE102012215438A1 System mit einem High-Power-Chip und einem Low-Power-Chip, das niedrige Verbindungsparasitäten aufweist Having system with a high-power chip and a low-power chip, low Verbindungsparasitäten |
| 03/07/2013 | DE102012212611A1 Halbleiterpackung und Verfahren zur Herstellung derselben Semiconductor package and method for manufacturing the same |
| 03/07/2013 | DE102012108075A1 Chip-aufnehmendes Modul und Verfahren zum Ausbilden eines Chip-aufnehmenden Moduls Chip receiving module and method for forming a chip receiving module |
| 03/07/2013 | DE102011112710A1 Beleuchtungsvorrichtung Lighting device |
| 03/07/2013 | DE102011112285A1 Optical device for use as e.g. illumination device and for illuminating e.g. road sign, has lenses arranged in small distance to surface of light sources, where one of lenses focuses light in direction and forms light on defined geometry |
| 03/07/2013 | DE102005034873B4 Anordnung eines elektrischen Bauelements und eines auf dem Bauelement auflaminierten Folienverbunds und Verfahren zur Herstellung der Anordnung Arrangement of an electrical component and a laminated composite film on the component and method of manufacturing the arrangement |
| 03/07/2013 | DE102004032928B4 RF-Modul mit verbesserter Integration RF module with improved integration |
| 03/06/2013 | EP2566308A1 Method for filling a circuit board |
| 03/06/2013 | EP2565955A2 Oled tile for illumination |
| 03/06/2013 | EP2565921A1 Light emitting device |
| 03/06/2013 | EP2565918A1 Power module and method for manufacturing power module |
| 03/06/2013 | EP2565913A2 Method for encapsulating semiconductor and structure thereof |
| 03/06/2013 | EP2149008B1 Safety accommodation arrangement in led package/lens structure |
| 03/06/2013 | CN202772157U Solar energy module |
| 03/06/2013 | CN202772135U Lighting device |
| 03/06/2013 | CN202772134U Light-emitting device and illumination device |
| 03/06/2013 | CN202772132U Multi-chip stacked flat packaging part based on stamping frame |
| 03/06/2013 | CN102959746A 光电子半导体构件 Optoelectronic semiconductor components |
| 03/06/2013 | CN102959704A Electro-static discharge protection for die of multi-chip module |