Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
03/2013
03/27/2013CN202839602U RGB white-light LED lamp packaging apparatus with good cooling performance
03/27/2013CN202839601U LED (Light Emitting Diode) chip
03/27/2013CN202839600U Ultrathin full-wave rectifier
03/27/2013CN202839599U Chip-embedded-type three-dimensional wafer-level packaging structure
03/27/2013CN202839589U Soaking plate, LED chip packaging structure based on soaking plate and chip support thereof
03/27/2013CN103003941A Optoelectronic component
03/27/2013CN103000793A Light emitting diode package structure and light emitting diode package method
03/27/2013CN103000788A LED packaging structure and method
03/27/2013CN103000782A Light emitting diode packaging structure
03/27/2013CN103000622A Structure and method for packaging light-emitting diodes
03/27/2013CN103000621A Multi-groove light emitting device
03/27/2013CN103000620A Damp-proof full-color surface mount device
03/27/2013CN103000619A System with a high power chip and a low power chip having low interconnect parasitics
03/27/2013CN103000618A Apparatus for stacked electronic circuitry and associated methods
03/27/2013CN103000603A Transistor structure and related transistor packaging method thereof
03/27/2013CN103000600A Semiconductor device
03/27/2013CN103000594A 电子模块 Electronic Modules
03/27/2013CN103000592A 封装结构 Package
03/27/2013CN103000536A Preparation technology for intelligent power modules
03/27/2013CN102194707B Method for manufacturing semiconductor structure
03/27/2013CN102148172B Semiconductor process, semiconductor component and package structure with semiconductor component
03/27/2013CN102148167B Method for manufacturing stackable packaging structure
03/27/2013CN102136430B Semiconductor encapsulating structure and manufacturing method thereof
03/27/2013CN102130269B Solid-state luminous element and light source module
03/27/2013CN102129820B Light-emitting diode device and display
03/27/2013CN102027593B Cooling arrangement comprising two semiconductor components disposed next to one another
03/27/2013CN101996892B System level photoelectric structure and manufacturing method thereof
03/27/2013CN101840983B Light emitting device, light emitting device package and lighting system including the same
03/27/2013CN101826593B Wiring board contributable to reduction in thickness of light emitting apparatus and having high versatility
03/27/2013CN101826519B LED integrated light source board, special mould and manufacture method
03/27/2013CN101807569B Light emitting device package
03/27/2013CN101523598B Light-emitting diode arrangement and method for producing the same
03/27/2013CN101409241B Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device
03/27/2013CN101232779B Printed circuit board and method for producing the printed circuit board
03/26/2013US8405454 Output circuit of semiconductor apparatus having two different types of decoupling capacitors
03/26/2013US8405420 System comprising a semiconductor device and structure
03/26/2013US8405225 Three-dimensional integrated circuits with protection layers
03/26/2013US8405029 Photodiode array output signal multiplexing
03/26/2013US8404586 Manufacturing method for semiconductor device
03/21/2013WO2013040396A1 Wireless communication with dielectric medium
03/21/2013WO2013039258A1 Semiconductor device and printed circuit board
03/21/2013WO2013039099A1 Method for producing semiconductor device, and semiconductor device produced using production method
03/21/2013WO2013038749A1 Electrode terminal with wiring sheet, wiring structure body, semiconductor device, and method of manufacturing said semiconductor device
03/21/2013WO2013038579A1 Semiconductor light emitting device and method for manufacturing same
03/21/2013WO2013038304A1 Reflective coating for a light emitting device mount
03/21/2013WO2013004496A3 Optoelectronic semiconductor component and module comprising a plurality of such components
03/21/2013WO2012155135A3 Scalable high-bandwidth connectivity
03/21/2013WO2012148869A9 Contact metal for hybridization and related methods
03/21/2013US20130069923 Driver circuit, display device, and electronic device
03/21/2013US20130069163 Multi-die package
03/21/2013DE102011113802A1 Optoelektronisches Halbleiterbauelement und Modul mit einer Mehrzahl von derartigen Bauelementen An optoelectronic semiconductor device and module with a plurality of such devices
03/21/2013DE102011082808A1 Leuchtvorrichtung mit Halbleiterlichtquelle und Leuchtstoffbereich Lighting device with semiconductor light source and fluorescent area
03/21/2013DE102011053680A1 Schaltungsanordnung zur Verminderung von Oszillationsneigung Circuitry to reduce to oscillation
03/21/2013DE102009002732B4 Schaltungsanordnung mit zwei Halbleiterschaltelementen und einem Freilaufelement sowie zugehöriger Schaltwandler Circuit with two semiconductor switching elements and a freewheeling element and associated switching converter
03/20/2013EP2571067A2 Encapsulating sheet, producing method thereof, light emitting diode device, and producing method thereof
03/20/2013EP2571054A2 Solid state light source module and array thereof
03/20/2013EP2571053A1 Power semiconductor arrangement and method of forming thereof
03/20/2013EP2571051A2 Power overlay structure with leadframe connections
03/20/2013EP2571045A2 Flip-chip hybridisation method for forming sealed cavities and systems obtained by such a method
03/20/2013EP2569736A1 Document and method for producing a document
03/20/2013EP2569051A2 Electrical feedthrough assembly
03/20/2013EP1267402B1 Semiconductor device and method of production of same
03/20/2013CN202817017U Substrate and light source module
03/20/2013CN202816942U A multi-chip packaging structure and a converter module
03/20/2013CN202816941U LED COB package light source
03/20/2013CN202816940U LED light-emitting device
03/20/2013CN202816939U Led芯片封装结构 Led chip package structure
03/20/2013CN202816938U Fast recovery rectifier diode parallel modules
03/20/2013CN202816937U Stereoscopic energy accumulation ball
03/20/2013CN202816936U LED light source with fluorescent glue layers
03/20/2013CN202816902U Integrated photosensitive sensor chip
03/20/2013CN102986026A Power module and power converter using same
03/20/2013CN102985505A Photosensitive adhesive composition, photosensitive adhesive film, and semiconductor device using each
03/20/2013CN102983259A LED packaging structure with high cooling efficiency
03/20/2013CN102983129A Light emitting device
03/20/2013CN102983128A LED and manufacturing method thereof
03/20/2013CN102983127A LED composite chip, processing method and display screen using composite chip
03/20/2013CN102983126A Led发光芯片阵列封装结构 Led light-emitting chip array package
03/20/2013CN102983125A LED (Light Emitting Diode) encapsulating body, manufacturing method thereof and LED system containing LED encapsulating body
03/20/2013CN102983124A Light emitting diode (LED) light source with cooling device
03/20/2013CN102983123A Light-emitting diode (LED) integration module provided with upper and lower electrodes LED chip ceramics substrate and integration technique thereof
03/20/2013CN102983122A Stacked-type semiconductor package structure and manufacturing method thereof
03/20/2013CN102983106A Packaging and function tests for package-on-package and system-in-package structures
03/20/2013CN102255012B Manufacturing method and structure of high-voltage direct-current light-emitting diode chip
03/20/2013CN102208403B Half-bridge power module
03/20/2013CN101963296B Manufacture method of LED integrated structure
03/20/2013CN101752489B Electronic component mounting module and electrical apparatus
03/20/2013CN101477979B Multi-chip encapsulation body
03/20/2013CN101364579B Semiconductor package, method of manufacturing the same and system containing the package
03/19/2013US8400780 Stacked microfeature devices
03/19/2013US8400187 Logic circuit and semiconductor device
03/19/2013US8399903 LED lamps
03/18/2013DE202013002043U1 Halbleiter-Leuchtvorrichtung mit Halbleiter-Lichtquellen unterschiedlicher Farbe Semiconductor light-emitting device having semiconductor light sources of different color
03/14/2013WO2013036561A2 Broad-area lighting systems
03/14/2013WO2013036544A1 Optimization of multi-stage hierarchical networks for practical routing applications
03/14/2013WO2013035716A1 Method for producing module
03/14/2013WO2013035715A1 Module manufacturing method and module
03/14/2013WO2013035714A1 Method for producing module and terminal assembly
03/14/2013WO2013035655A1 Module substrate
03/14/2013WO2013035596A1 Semiconductor device and microphone
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