| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 04/09/2013 | US8415622 Infrared imaging element |
| 04/09/2013 | US8415552 Systems and methods for prevention of open loop damage during or immediately after manufacturing |
| 04/04/2013 | WO2013048620A1 Reconstituted wafer package with high voltage discrete active dice and integrated field plate for high temperature leakage current stability |
| 04/04/2013 | WO2013047671A1 Connection member and electrical connection device |
| 04/04/2013 | WO2013047607A1 Semiconductor module |
| 04/04/2013 | WO2013047329A1 Heat dissipation structure, power module, method for manufacturing heat dissipation structure and method for manufacturing power module |
| 04/04/2013 | WO2013047231A1 Semiconductor device and method of manufacture thereof |
| 04/04/2013 | WO2013047101A1 Semiconductor device and method for producing semiconductor device |
| 04/04/2013 | WO2013046992A1 Method for three-dimensionally mounting chip |
| 04/04/2013 | WO2013046991A1 Three-dimensional mounting device |
| 04/04/2013 | WO2013046954A1 Power module |
| 04/04/2013 | WO2013046824A1 Semiconductor device |
| 04/04/2013 | WO2013046680A1 Circuit device |
| 04/04/2013 | WO2013046675A1 Power converting apparatus |
| 04/04/2013 | WO2013046617A1 Substrate for mounting element thereon, semiconductor module, and method for manufacturing substrate for mounting element thereon |
| 04/04/2013 | WO2013046439A1 Semiconductor device |
| 04/04/2013 | WO2013046400A1 Semiconductor device |
| 04/04/2013 | WO2013045367A2 Electronic assembly comprising substrate basic material having high thermal stability |
| 04/04/2013 | WO2013045353A1 Led module |
| 04/04/2013 | WO2013044965A1 Power semiconductor switch with a modular design with current balance monitoring for fault detection |
| 04/04/2013 | WO2013044566A1 Chip encapsulation method and encapsulation structure thereof |
| 04/04/2013 | WO2013044409A1 Clamping mechanism and method for applying rated force to power conversion apparatus |
| 04/04/2013 | WO2013004538A3 Lighting device |
| 04/04/2013 | US20130083397 Optical elements, method of replicating optical elements, particularly on a wafer level, and optical devices |
| 04/04/2013 | US20130082382 Semiconductor device |
| 04/04/2013 | DE102012217624A1 Niederinduktives Halbleitermodul Niederinduktives semiconductor module |
| 04/04/2013 | DE102012109374A1 Halbleitergehäuse und Verfahren zum Herstellen desselben Of the same semiconductor package and method for manufacturing |
| 04/04/2013 | DE102011115314A1 LED-Modul LED module |
| 04/04/2013 | DE102011114559A1 Optoelektronisches Bauelement umfassend eine Haftschicht, Verfahren zur Herstellung einer Haftschicht in einem optoelektronischen Bauelement und Verwendung eines Klebstoffes zur Bildung von Haftschichten in optoelektronischen Bauelementen An optoelectronic component comprising an adhesive layer Process for the preparation of an adhesive layer in an optoelectronic device and use of an adhesive for forming adhesive layers in optoelectronic devices |
| 04/04/2013 | DE102011083911A1 Elektronische Baugruppe mit hochtemperaturstabilem Substratgrundwerkstoff Electronic assembly with high temperature stable substrate base material |
| 04/04/2013 | DE102011083906A1 Fügehilfe für ein Leistungsmodul Joining aid for a power module |
| 04/04/2013 | DE102011083719A1 Verfahren zur Herstellung einer Zweichipanordnung und entsprechende Zweichipanordnung A process for producing a two-chip layout and corresponding two-chip system |
| 04/04/2013 | DE102011083691A1 Optoelektronisches halbleiterbauteil The optoelectronic semiconductor component |
| 04/04/2013 | DE102010018997B4 Ansteuerschaltung mit Übertragungsschaltung zur kapazitiven Übertragung eines Signals und zugeordnetes Verfahren Drive circuit with transmission circuit for capacitive transmission of a signal and associated method |
| 04/04/2013 | CA2848802A1 Clamping mechanism and method for applying rated force to power conversion apparatus |
| 04/03/2013 | EP2575272A2 Signal distribution and radiation in a wireless enabled integrated circuit (IC) |
| 04/03/2013 | EP2575171A1 Wirelessly communicating among vertically arranged integrated circuits (ICs) in a semiconductor package |
| 04/03/2013 | EP2575170A2 Semiconductor package including an integrated waveguide |
| 04/03/2013 | EP2575167A2 Electronic device |
| 04/03/2013 | EP2575166A2 Chips having rear contacts connected by through vias to front contacts |
| 04/03/2013 | EP2575140A1 Semiconductor chip, semiconductor device, and method of measuring the same |
| 04/03/2013 | EP2575138A2 Semiconductor device and system |
| 04/03/2013 | CN202855798U Dimmable COB package structure |
| 04/03/2013 | CN202855796U Transparent ceramic white light LED packaging structure |
| 04/03/2013 | CN202855735U Dual-spectrum LED chip |
| 04/03/2013 | CN202852587U Light-emitting diode (LED) plant lighting module packaged integrally |
| 04/03/2013 | CN103026488A Light-emitting diode |
| 04/03/2013 | CN103026487A High-frequency module and communications device |
| 04/03/2013 | CN103026484A Three-dimensional integrated circuit having redundant relief structure for chip bonding section |
| 04/03/2013 | CN103022328A Solar simulator light source and realizing method thereof |
| 04/03/2013 | CN103022313A Light emitting module and its light emitting diode |
| 04/03/2013 | CN103022202A Novel low cost and high efficiency photovoltaic module |
| 04/03/2013 | CN103022026A Multichip module and manufacturing method thereof |
| 04/03/2013 | CN103022025A Method for manufacturing LED with high color rendering and luminous efficiency |
| 04/03/2013 | CN103022024A Solid state lighting component |
| 04/03/2013 | CN103022023A Ultrathin miniature bridge rectifier |
| 04/03/2013 | CN103022022A Low-parasitic-inductance IGBT (insulated gate bipolar translator) power module |
| 04/03/2013 | CN103022021A Semiconductor device and manufacturing method thereof |
| 04/03/2013 | CN103022020A High-efficiency amorphous silicon and copper-indium-gallium-selenium superposed solar cell technology |
| 04/03/2013 | CN103022005A Laminated 3D-MCM (3-dimensional multiple chip module) structure based on peripheral vertical interconnect technology |
| 04/03/2013 | CN103021996A Flat multichip packaging piece with stamping frame with square groove and production method of flat multichip packaging piece |
| 04/03/2013 | CN103021989A Multiple-component chip packaging structure |
| 04/03/2013 | CN103021444A Memory device |
| 04/03/2013 | CN103018852A Optical element module and manufacturing method thereof |
| 04/03/2013 | CN103017011A Linear light source device and planar light source device |
| 04/03/2013 | CN102184917B Global system for mobile communications (GSM) radio-frequency emission front-end module adopting Quad Flat No-lead package |
| 04/03/2013 | CN102148206B Semiconductor packaging structure and producing method thereof |
| 04/03/2013 | CN102067307B Apparatus and system for a single element solar cell |
| 04/03/2013 | CN102064168B Electroluminescent/photoinduced mixed white LED chip and manufacturing method |
| 04/03/2013 | CN101939825B Film for semiconductor, method for manufacturing semiconductor device and semiconductor device |
| 04/03/2013 | CN101794855B Light Emitting Semiconductor Device And Method Of Manufacture Thereof |
| 04/02/2013 | US8413094 Structure, design structure and process for increasing magnitude of device threshold voltage for low power applications |
| 04/02/2013 | US8409886 Method of producing image display unit |
| 03/28/2013 | WO2013042286A1 Semiconductor device |
| 03/28/2013 | WO2013040725A1 Flip chip light emitting diode surface light source light engine packaging method |
| 03/28/2013 | WO2012107482A3 Power semiconductor module |
| 03/28/2013 | US20130077735 Shift register circuit |
| 03/28/2013 | US20130075917 Multi-Chip and Multi-Substrate Reconstitution Based Packaging |
| 03/28/2013 | US20130075886 Semiconductor device |
| 03/28/2013 | DE102012216774A1 Leistungshalbleitermodul mit drahtlosem aow temperatursensor Power semiconductor module with wireless temperature sensor aow |
| 03/28/2013 | DE102011114196A1 Optisches Element und Leuchte mit einem optischen Element Optical element, and light with an optical element |
| 03/28/2013 | DE102011114192A1 Verfahren und Vorrichtung zur Farbortsteuerung eines von einem Licht emittierenden Halbleiterbauelement abgestrahlten Lichts Method and apparatus for color emitted local control of emitting light from a semiconductor device light |
| 03/28/2013 | DE102011083491A1 Connection assembly for use in scintillation detector of computed tomography system to connect e.g. memory chip with substrate, has two micro-components connected with each other as pair and arranged on functional side opposite to rear face |
| 03/28/2013 | DE102011083247A1 Hermetic encapsulated organic LED arrangement for use in roof of building to introduce daylight and artificial light, has sealing layer comprising inner recess at inner side, and connected with support substrate by hermetic connection |
| 03/28/2013 | DE102011083223A1 Leistungshalbleitermodul mit integrierter Dickschichtleiterplatte Power semiconductor module with integrated thick film circuit board |
| 03/28/2013 | DE102008062307B4 Optoelektronische Komponente basierend auf Premold-Technologie Optoelectronic component based on premold technology |
| 03/27/2013 | EP2574156A1 Wiring method, structure having wiring provided on surface, semiconductor device, wiring board, memory card, electric device, module, and multilayer circuit board |
| 03/27/2013 | EP2573830A2 Light-emitting circuit and luminaire |
| 03/27/2013 | EP2573812A2 Light-emitting apparatus |
| 03/27/2013 | EP2572380A1 Method for producing chip stacks, and a carrier for carrying out the method |
| 03/27/2013 | EP2572379A1 Large-area flexible oled light source |
| 03/27/2013 | EP2038929B1 Method for producing a matrix of individual electronic components and matrix produced thereby |
| 03/27/2013 | CN202839734U White-light LED |
| 03/27/2013 | CN202839733U White-light LED |
| 03/27/2013 | CN202839608U Substrate of light-emitting diode (LED) luminous body |
| 03/27/2013 | CN202839607U Light-emitting diode (LED) packaging structure |
| 03/27/2013 | CN202839606U Lamp panel of light-emitting diode (LED) lamp |
| 03/27/2013 | CN202839605U LED lighting device |
| 03/27/2013 | CN202839604U Light-emitting diode device |
| 03/27/2013 | CN202839603U RGB white-light LED lamp apparatus with good cooling performance |