| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 04/18/2013 | WO2013053199A1 Light-mixing light-emitting diode packaging structure |
| 04/18/2013 | WO2013053192A1 Light-emitting diode used by display screen and preparation method |
| 04/18/2013 | US20130093508 Semiconductor integrated circuit device |
| 04/18/2013 | US20130093103 Layered Semiconductor Package |
| 04/18/2013 | US20130093080 Multi-chip package and method of manufacturing the same |
| 04/18/2013 | DE112010003271T5 Hochfrequenz Fast Recovery Diode High frequency fast recovery diode |
| 04/18/2013 | DE102012218927A1 Licht emittierende Vorrichtung (LED), Fertigungsverfahren dafür und ein LED-Modul, das diese verwendet Light emitting device (LED), manufacturing method thereof and an LED module that uses this |
| 04/18/2013 | DE102012218670A1 Elektronikmodul und leistungssystem Electronic module and power system |
| 04/18/2013 | DE102012202765B3 Halbleitermodul Semiconductor module |
| 04/18/2013 | DE102011084365A1 LED-Modul mit einem Kühlkörper LED module to a heat sink |
| 04/17/2013 | EP2581937A1 Resin-sealed semiconductor device and method for manufacturing same |
| 04/17/2013 | CN202888226U LED full-color display screen |
| 04/17/2013 | CN202888175U Packaging structure of high-power LED (Light Emitting Diode) integrated chip |
| 04/17/2013 | CN202888174U LED light source module |
| 04/17/2013 | CN202888173U LED packaging device and illuminating device |
| 04/17/2013 | CN202888172U LED wafer and power LED |
| 04/17/2013 | CN202888171U Thyristor module |
| 04/17/2013 | CN202888170U Multi-chip assembly with controllable operating temperature |
| 04/17/2013 | CN202888163U Photoelectric coupler lead wire frame and photoelectric coupler |
| 04/17/2013 | CN103053023A Optoelectronic device and method for producing same |
| 04/17/2013 | CN103051159A Power electronic device and hybrid power module thereof, and forming method of hybrid power module |
| 04/17/2013 | CN103050608A LED (light emitting diode) packaged based on zinc oxide-bismuth oxide composite ceramic substrate and preparation method thereof |
| 04/17/2013 | CN103050489A LED (Light Emitting Diode) illuminating device |
| 04/17/2013 | CN103050488A Light-emitting diode (LED) for display screen and production method |
| 04/17/2013 | CN103050487A Integrated circuit structure having dies with connectors of different sizes |
| 04/17/2013 | CN103050486A Process for forming package-on-package structures |
| 04/17/2013 | CN102315197B Three-dimensional (3D) integrated circuit structure and method for detecting alignment of chip structures |
| 04/17/2013 | CN102263086B 半导体封装结构 Semiconductor package structure |
| 04/17/2013 | CN102214615B Semiconductor device packages with fan-out and with connecting elements for stacking and manufacturing methods thereof |
| 04/17/2013 | CN102194779B 封装结构 Package |
| 04/17/2013 | CN102169875B Semiconductor device and producing method thereof |
| 04/17/2013 | CN102157498B Hybrid integrated circuit module and manufacturing method thereof |
| 04/17/2013 | CN102097809B Thyristor valve block of static var compensator (SVC) |
| 04/17/2013 | CN102077344B Through silicon via bridge interconnect |
| 04/17/2013 | CN101897022B 半导体模块 Semiconductor Modules |
| 04/17/2013 | CN101436586B Semiconductor module and image pickup apparatus |
| 04/16/2013 | US8423317 Temperature detection method of semiconductor device and power conversion apparatus |
| 04/16/2013 | US8421235 Semiconductor device with heat spreaders |
| 04/16/2013 | US8421225 Three-dimensional stacked substrate arrangements |
| 04/16/2013 | US8421222 Chip package having a chip combined with a substrate via a copper pillar |
| 04/16/2013 | US8421211 Wafer level semiconductor package and fabrication method thereof |
| 04/16/2013 | US8421109 Light-emitting apparatus package, light-emitting apparatus, backlight apparatus, and display apparatus |
| 04/16/2013 | US8421087 Semiconductor module including a switch and non-central diode |
| 04/11/2013 | WO2013052502A1 Determining spacing of semiconductor dies using a spatially varying charge distribution |
| 04/11/2013 | WO2013052458A1 Memory modules in packages |
| 04/11/2013 | WO2013052448A1 Stub minimization for wirebond assemblies without windows |
| 04/11/2013 | WO2013052411A1 Stub minimization for wirebond assemblies without windows |
| 04/11/2013 | WO2013052373A1 Stub minimization for multi-die wirebond assemblies with parallel windows |
| 04/11/2013 | WO2013052347A1 Memory module in a package and its pin configuration |
| 04/11/2013 | WO2013052345A1 Stub minimization for assemblies without wirebonds to package substrate |
| 04/11/2013 | WO2013052323A1 Stub minimization using duplicate sets of terminals for wirebond assemblies without windows |
| 04/11/2013 | WO2013052322A2 Stub minimization using duplicate sets of terminals for wirebond assemblies without windows |
| 04/11/2013 | WO2013052320A1 Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate |
| 04/11/2013 | WO2013052129A1 Led light disposed on a flexible substrate and connected with a printed 3d conductor |
| 04/11/2013 | WO2013052080A1 Stub minimization for multi-die wirebond assemblies with orthogonal windows |
| 04/11/2013 | WO2013051463A1 Wafer bonding method and structure of bonding part of wafer |
| 04/11/2013 | WO2013051387A1 Pcb attachment structure and semiconductor device using structure |
| 04/11/2013 | WO2013051182A1 Semiconductor device and method for manufacturing same |
| 04/11/2013 | WO2013050948A1 Electronics package for high temperature downhole applications |
| 04/11/2013 | WO2013050898A1 Electrically insulating bond for mounting a light emitting device |
| 04/11/2013 | US20130088289 Semiconductor chip package including voltage generation circuit with reduced power noise |
| 04/11/2013 | US20130088288 Integrated magnetic field sensor-controlled switch devices |
| 04/11/2013 | US20130088280 High power semiconductor electronic components with increased reliability |
| 04/11/2013 | US20130088261 Low leakage spare gates for integrated circuits |
| 04/11/2013 | DE102011115376A1 Arrangement for use in half-bridge module for arranging n-channel-MOSFET to half bridge circuit, has support plates comprising contact surfaces, where drain terminals of MOSFETS are applied on plates with surfaces and connected by lines |
| 04/11/2013 | DE102011088791B3 Beleuchtungseinheit mit einem Leuchtstoffelement, Beleuchtungsvorrichtung und Verwendung davon A lighting unit comprising a phosphor element, lighting apparatus and use thereof |
| 04/11/2013 | DE102010007086B4 Anordnung mit Leistungshalbleiterbaugruppen und einer Flüssigkeitskühleinrichtung Arrangement with power semiconductor modules and a liquid cooling device |
| 04/10/2013 | EP2579439A2 Electric power conversion apparatus |
| 04/10/2013 | EP2579309A1 Power module and manufacturing method thereof |
| 04/10/2013 | EP2579308A2 Stacked semiconductor devices |
| 04/10/2013 | EP2579307A1 Stacked semiconductor devices |
| 04/10/2013 | EP2579029A1 Method for manufacturing semiconductor device |
| 04/10/2013 | EP2577729A1 Electronic chip having channels through which a heat transport coolant can flow, electronic components and communication arm incorporating said chip |
| 04/10/2013 | EP2577728A1 Semiconductor device, solid-state imaging device, and camera system |
| 04/10/2013 | CN202871853U Energy-saving efficient heat dissipation LED |
| 04/10/2013 | CN202871791U Encapsulating device of compact single-phase integration driving circuit, and single-phase integration driving circuit |
| 04/10/2013 | CN202871790U Infrared remote control amplifier |
| 04/10/2013 | CN202871789U Full-color surface-mounted device |
| 04/10/2013 | CN202871788U Surface mount type double-cup LED lamp bead |
| 04/10/2013 | CN202871787U Structure with chip directly packaged on uniform temperature plate |
| 04/10/2013 | CN202871786U Light emitting diode package and light emitting diode display |
| 04/10/2013 | CN202871785U Integrated triggering and rectifying device |
| 04/10/2013 | CN202871784U Shielding insertion mechanism and semiconductor package with integrated electromagnetic shielding body |
| 04/10/2013 | CN202868369U Light-emitting diode (LED) device with unity of multicolor |
| 04/10/2013 | CN103038903A Radiation-emitting component and method for producing radiation-emitting components |
| 04/10/2013 | CN103038880A Optoelectronic component |
| 04/10/2013 | CN103036618A Light transmit-receive element and sealing method thereof |
| 04/10/2013 | CN103035632A Luminous encapsulation body and manufacturing method thereof |
| 04/10/2013 | CN103035631A Semi-conductive device for joint encapsulation of high-end chip and low-end chip and manufacture method thereof |
| 04/10/2013 | CN103035630A Stacked semiconductor devices |
| 04/10/2013 | CN103035629A Stacked semiconductor devices |
| 04/10/2013 | CN103035628A Device having wirelessly enabled functional blocks |
| 04/10/2013 | CN103035627A Stacking-type semiconductor package structure |
| 04/10/2013 | CN102226994B Display device for integrating LED (light-emitting diode) chip on conducting glass and manufacturing method thereof |
| 04/10/2013 | CN102194808B LED (light emitting diode) integrated packaging device with up-down power type electrodes and packaging method thereof |
| 04/10/2013 | CN102136466B Electrostatic discharge test structure and system of gate-driven MOSFET (metal oxide semiconductor field effect transistor) |
| 04/10/2013 | CN101577272B Luminescence module |
| 04/10/2013 | CN101477955B Encapsulation structure and method for tablet reconfiguration |
| 04/09/2013 | US8415976 Optimized interconnection networks |
| 04/09/2013 | US8415790 Semiconductor package having passive device and method for making the same |