| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 05/01/2013 | CN103081143A Optoelectronic semiconductor component and scattering body |
| 05/01/2013 | CN103081137A Light-emitting diode chip |
| 05/01/2013 | CN103081133A A light emitting apparatus |
| 05/01/2013 | CN103081104A Power semiconductor module and method for manufacturing same |
| 05/01/2013 | CN103081103A Manufacturing fixture for a ramp-stack chip package |
| 05/01/2013 | CN103081102A Optical communication in a ramp-stack chip package |
| 05/01/2013 | CN103081098A 半导体模块 Semiconductor Modules |
| 05/01/2013 | CN103081097A Semiconductor module |
| 05/01/2013 | CN103081096A Semiconductor device and method of producing semiconductor device |
| 05/01/2013 | CN103081077A Method of manufacturing semiconductor device and semiconductor device |
| 05/01/2013 | CN103080641A Compact optically efficient solid state light source with integrated thermal management |
| 05/01/2013 | CN103080392A Inclusion of chip elements in a sheathed wire |
| 05/01/2013 | CN103080144A Method for producing an esterified substance |
| 05/01/2013 | CN103078491A Power module |
| 05/01/2013 | CN103078048A 白光发光装置 White light emitting device |
| 05/01/2013 | CN103077940A LED (Light-Emitting Diode) array |
| 05/01/2013 | CN103077939A Semiconductor package including semiconductor chip with through opening |
| 05/01/2013 | CN103077930A Integrated photosensitive sensor |
| 05/01/2013 | CN103077929A Integrated photosensitive sensor chip |
| 05/01/2013 | CN102214776B Light emitting diode package, lighting device and light emitting diode package substrate |
| 05/01/2013 | CN102194709B Light emitting diode packaging element and manufacture method thereof |
| 05/01/2013 | CN102157671B Light-emitting diode arrangement for a high-power light-emitting diode, and method for producing a light-emitting diode arrangement |
| 05/01/2013 | CN102140690B Photoluminescent wafer as well as preparation method and application thereof |
| 05/01/2013 | CN101958315B Lighting device, display, and method for manufacturing the same |
| 05/01/2013 | CN101937909B An electrical module |
| 05/01/2013 | CN101587885B Semiconductor device, semiconductor device module, and method for manufacturing the semiconductor device module |
| 04/30/2013 | US8432190 Semiconductor device with reduced power consumption |
| 04/30/2013 | US8429813 Process to allow electrical and mechanical connection of an electrical device with a face equipped with contact pads |
| 04/25/2013 | WO2013059801A1 Low-profile wireless connectors |
| 04/25/2013 | WO2013059731A1 Molded glass lid for wafer level packaging of opto-electronic assemblies |
| 04/25/2013 | WO2013059715A2 Iron based alloys for bioabsorbable stent |
| 04/25/2013 | WO2013059297A1 Microelectronic package with stacked microelectronic units and method for manufacture thereof |
| 04/25/2013 | WO2013059181A1 Package-on-package assembly with wire bond vias |
| 04/25/2013 | WO2013058038A1 Semiconductor device and semiconductor device manufacturing method |
| 04/25/2013 | WO2013058000A1 High-frequency module |
| 04/25/2013 | WO2013057886A1 Integrated circuit, multicore processor apparatus, and method for manufacturing integrated circuit |
| 04/25/2013 | WO2013057867A1 Semiconductor device |
| 04/25/2013 | WO2013057861A1 Semiconductor device |
| 04/25/2013 | WO2013057172A1 Power semiconducter module and power semiconductor module assembly with multiple power semiconducter modules |
| 04/25/2013 | WO2013032726A3 Glass as a substrate material and a final package for mems and ic devices |
| 04/25/2013 | WO2013032725A3 Glass as a substrate material and a final package for mems and ic devices |
| 04/25/2013 | WO2013023157A3 Thin film structure for high density inductors and redistribution in wafer level packaging |
| 04/25/2013 | US20130100561 Semiconductor device and method of forming same for esd protection |
| 04/25/2013 | US20130100318 Semiconductor device and fabrication method therefore |
| 04/25/2013 | US20130099377 Molded Chip Interposer Structure and Methods |
| 04/25/2013 | US20130099359 Semiconductor package and stacked semiconductor package |
| 04/25/2013 | US20130099292 Semiconductor device and method for manufacturing same |
| 04/25/2013 | US20130099257 Led package with efficient illumination |
| 04/25/2013 | DE112008000452B4 Halbleitermodul und Wechselrichtervorrichtung Semiconductor module and inverter device |
| 04/25/2013 | DE102011084885A1 Auflage für eine Leuchtvorrichtung Pad for a light-emitting device |
| 04/24/2013 | EP2584600A1 Semiconductor integrated circuit device inspection method and semiconductor integrated circuit device |
| 04/24/2013 | EP2584598A1 Method of producing a semiconductor device comprising a through-substrate via and a capping layer and corresponding semiconductor device |
| 04/24/2013 | CN202906474U Thyristor valve module used in horizontal water-cooling static reactive power compensator |
| 04/24/2013 | CN202905781U LED full-color surface-mounting device and LED support thereof |
| 04/24/2013 | CN202905714U Photoelectric coupler integrated with two bidirectional controlled silicon chip |
| 04/24/2013 | CN202905713U 一种led封装结构 One kind of led package |
| 04/24/2013 | CN202905712U Welding plate with metal baffle plate |
| 04/24/2013 | CN202905711U LED light source |
| 04/24/2013 | CN202905710U LED uniform light source with high color rendering index |
| 04/24/2013 | CN202905709U COB LED module |
| 04/24/2013 | CN202905708U High-luminous-efficiency high-color-rendering-index LED light source |
| 04/24/2013 | CN202905707U LED integrated module |
| 04/24/2013 | CN202905697U 系统级封装结构 System level package structure |
| 04/24/2013 | CN202905694U A first-subsystem-and-second-subsystem-containing power electronic system of a connecting device |
| 04/24/2013 | CN202905693U A liquid-cooled power electronic device |
| 04/24/2013 | CN202905686U Multichip wafer level packaging structure |
| 04/24/2013 | CN202901891U Surface-mounted type light emitting device (LED) luminescent device |
| 04/24/2013 | CN103069568A Optoelectronic semiconductor chip and method for producing optoelectronic semiconductor chips |
| 04/24/2013 | CN103069556A Semiconductor module, mould device, and mould-forming method |
| 04/24/2013 | CN103066191A Light-emitting diode (LED) light source and manufacturing method thereof |
| 04/24/2013 | CN103066184A Wiring substrate, light emitting device, and method for manufacturing wiring substrate |
| 04/24/2013 | CN103066182A LED lamp template apparatus |
| 04/24/2013 | CN103066068A Integrated circuit package structure |
| 04/24/2013 | CN103066067A Semiconductor apparatus |
| 04/24/2013 | CN103066066A Semiconductor apparatus |
| 04/24/2013 | CN103066065A Vertically placing mechanical press fitting structure of power device clusters |
| 04/24/2013 | CN103066064A Semiconductor encapsulation piece and manufacturing method thereof |
| 04/24/2013 | CN103066052A Semiconductor package and stacked semiconductor package |
| 04/24/2013 | CN103066033A 半导体装置 Semiconductor device |
| 04/24/2013 | CN103066032A Packages and methods for forming same |
| 04/24/2013 | CN103066027A Power module, method for manufacturing power module, and molding die |
| 04/24/2013 | CN103065983A Simultaneous silicone dispension on coupler |
| 04/24/2013 | CN102412242B Light-emitting diode (LED) chipset capable of being connected to alternating current directly |
| 04/24/2013 | CN102148221B Electronic component package and manufacturing method therefor |
| 04/24/2013 | CN102132376B Adhesive injection device |
| 04/24/2013 | CN102124562B Method and device for manufacturing 3D integrated circuit device using interface wafer as permanent carrier |
| 04/24/2013 | CN102124550B Metal nano-ink, process for producing the metal nano-ink, and die bonding method and die bonding apparatus using the metal nano-ink |
| 04/24/2013 | CN102005440B 集成电路结构及其形成方法 Integrated circuit structure and method of forming |
| 04/24/2013 | CN101901638B Busbar assembly, vehicle inverter module and method for cooling the inverter module |
| 04/24/2013 | CN101887890B Lighting module, backlight unit, and display device |
| 04/24/2013 | CN101836294B Multilayer semiconductor device |
| 04/24/2013 | CN101369566B Semiconductor package through-electrode suitable for a stacked semiconductor package and semiconductor package having the same |
| 04/23/2013 | US8427833 Thermal power plane for integrated circuits |
| 04/23/2013 | US8426961 Embedded 3D interposer structure |
| 04/23/2013 | US8425272 Laminated interconnects for organic opto-electronic device modules and method |
| 04/23/2013 | CA2393069C Power converter enclosure |
| 04/18/2013 | WO2013055406A1 Multi-die integrated circuit structure with heat sink |
| 04/18/2013 | WO2013054413A1 Power semiconductor module, power conversion apparatus, and electric vehicle |
| 04/18/2013 | WO2013054408A1 Circuit board for large-capacity module peripheral circuit and large-capacity module containing peripheral circuit using said circuit board |
| 04/18/2013 | WO2013054226A1 Light-emitting arrangement |