| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 05/08/2013 | EP2590236A1 Light emitting diode and illuminant with at least two light emitting diodes as light sources |
| 05/08/2013 | EP2590217A2 Stacked packages using laser direct structuring |
| 05/08/2013 | EP2590216A2 Light emitting device and lighting apparatus |
| 05/08/2013 | EP2590215A2 Substrate, light emitting device and method for manufacturing substrate |
| 05/08/2013 | EP2590214A2 Light-emitting module and luminaire |
| 05/08/2013 | EP2590213A1 Power module and power converter using same |
| 05/08/2013 | EP2590212A1 Power semiconductor module, electricity transformer device, and railway car |
| 05/08/2013 | EP2589080A1 Electro-static discharge protection for die of a multi-chip module |
| 05/08/2013 | EP2589079A1 Stacked ic comprising integrated voltage regulator with embedded passive device (s) |
| 05/08/2013 | EP2589078A2 Method and system for thin multi chip stack package with film on wire and copper wire |
| 05/08/2013 | EP2589055A2 Galvanic isolation transformer |
| 05/08/2013 | DE102012219904A1 Leiterplatte aus AlN mit Kupferstrukturen Board of AlN with copper structures |
| 05/08/2013 | DE102012219171A1 Dreidimensionale (3D) integrierte Schaltung mit verbessertem Kupfer-Kupfer-Bonding Three-dimensional (3D) integrated circuit with improved copper-copper bonding |
| 05/08/2013 | DE102012217731A1 LED module i.e. chip-on-board module for presentation of e.g. meat, in butcher's shop, has blue LED and red or orange LED mounted on circuit board, where module provides continuous emission spectrum in specific range |
| 05/08/2013 | DE102012110494A1 Vorrichtung umfassend zwei Leistungshalbleiterchips und Herstellungsverfahren dafür A device comprising two power semiconductor chips and manufacturing method thereof |
| 05/08/2013 | DE102011085658A1 Elektronische Schaltung Electronic circuit |
| 05/08/2013 | DE102011085645A1 Leuchtdiodenmodul und Verfahren zum Betreiben eines Leuchtdiodenmoduls Light emitting diode module and method of operating a light-emitting diode module |
| 05/08/2013 | DE102009011233B4 Verfahren zur Herstellung einer Halbleitervorrichtung A process for producing a semiconductor device |
| 05/08/2013 | DE102006005050B4 Halbleitervorrichtung mit Extraktionselektrode und Verfahren A semiconductor device comprising extraction electrode and method |
| 05/08/2013 | DE102005059224B4 SiC-Halbleitervorrichtung und Herstellungsverfahren dafür SiC semiconductor device and manufacturing method thereof |
| 05/08/2013 | CN202930428U LED lamp structure |
| 05/08/2013 | CN202930380U Full color LED sealing structure of integrating driving mechanism |
| 05/08/2013 | CN202930379U Light source module group for increasing light extraction efficiency |
| 05/08/2013 | CN202930378U Thyristor module and silicon controlled rectifier |
| 05/08/2013 | CN202930372U Power electronic system with switching device and trigger device |
| 05/08/2013 | CN103098248A Method for producing an optoelectronic semiconductor component |
| 05/08/2013 | CN103098245A Semifinished product and method for producing a light-emitting diode |
| 05/08/2013 | CN103098208A Method For Combining LEDs In A Packaging Unit And Packaging Unit Having A Multiplicity Of LEDs |
| 05/08/2013 | CN103098207A Stacked semiconductor chip device with thermal management |
| 05/08/2013 | CN103098204A Semiconductor chip with redundant thru-silicon-vias |
| 05/08/2013 | CN103098201A Multifunction sensor as pop-mwlp |
| 05/08/2013 | CN103094466A Led package module |
| 05/08/2013 | CN103094462A Light-emitting diode packaging module |
| 05/08/2013 | CN103094452A Packaging method of light-emitting diode (LED) |
| 05/08/2013 | CN103094386A Solar module and process for preparing same |
| 05/08/2013 | CN103094270A Magnetoelectric composite structure and manufacturing method thereof |
| 05/08/2013 | CN103094269A White light luminescent device and manufacturing method thereof |
| 05/08/2013 | CN103094268A Light-emitting diode (LED) module used for commercial lighting and manufacturing method thereof |
| 05/08/2013 | CN103094267A Light Emitting Device And Lighting Apparatus |
| 05/08/2013 | CN103094266A Light-emitting Module |
| 05/08/2013 | CN103094265A Light-emitting Module And Luminaire |
| 05/08/2013 | CN103094264A High power light-emitting diode |
| 05/08/2013 | CN103094263A Light-emitting diode device |
| 05/08/2013 | CN103094262A Device Including Two Power Semiconductor Chips And Manufacturing Thereof |
| 05/08/2013 | CN103094261A Electronic Assembly Apparatus And Associated Methods |
| 05/08/2013 | CN103094260A Package On Package Devices And Methods Of Packaging Semiconductor Dies |
| 05/08/2013 | CN103094249A Three dimensional integrated circuit connection structure and method |
| 05/08/2013 | CN103094220A Storage device, semiconductor device and manufacturing method thereof |
| 05/08/2013 | CN103094218A System in package process flow |
| 05/08/2013 | CN103090240A High-efficiency luminescence light emitting diode (LED) light source and LED lamp using thereof |
| 05/08/2013 | CN102208518B Integrated patch unit |
| 05/08/2013 | CN102201395B Multi-layer semiconductor module packaging structure with anti-surge function and manufacturing method thereof |
| 05/08/2013 | CN102184915B High-power base plate effectively integrating circuit board and radiator and manufacturing method thereof |
| 05/08/2013 | CN102017140B Semiconductor device |
| 05/08/2013 | CN102017139B 3-D integrated circuit lateral heat dissipation |
| 05/08/2013 | CN101908584B White light diode |
| 05/08/2013 | CN101884254B Electronic apparatus produced using lead-free bonding material for soldering |
| 05/08/2013 | CN101651136B Semiconductor light emitting device |
| 05/08/2013 | CN101571237B Light emitting diode module and lighting string comprising same |
| 05/08/2013 | CN101529588B Power module substrate, method for manufacturing power module substrate, and power module |
| 05/08/2013 | CN101453166B Micro power converter |
| 05/07/2013 | US8436680 Multi-layered semiconductor apparatus |
| 05/07/2013 | US8436454 Reprogrammable circuit board with alignment-insensitive support for multiple component contact types |
| 05/02/2013 | WO2013062533A1 Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips |
| 05/02/2013 | WO2013061228A1 Light emitting device with integral shaped reflector |
| 05/02/2013 | WO2013060868A1 Led device with recessed components |
| 05/02/2013 | WO2013060357A1 Light emitting component |
| 05/02/2013 | WO2013036561A3 Broad -area lighting systems and methods of its fabrication |
| 05/02/2013 | US20130107482 Printed circuit board |
| 05/02/2013 | US20130107468 Apparatus and method for stacking integrated circuits |
| 05/02/2013 | US20130106504 Integrated circuits with cascode transistor |
| 05/02/2013 | US20130105992 Semiconductor component having a stack of semiconductor chips and method for producing the same |
| 05/02/2013 | DE102012219791A1 Niederinduktives leistungsmodul Niederinduktives power module |
| 05/02/2013 | DE102012219686A1 Leistungsmodul mit geringer streuinduktivität Power module with low leakage inductance |
| 05/02/2013 | DE102012110000A1 3D-Chipaufbau mit abgeschirmten Strukturen 3D chip structure with shielded structures |
| 05/02/2013 | DE102012101606A1 ESD-Schutzbauelement und Bauelement mit einem ESD-Schutzbauelement und einer LED ESD protection device and the ESD protection device having a device and a LED |
| 05/02/2013 | DE102012101560A1 Leuchtdiodenvorrichtung Light emitting diode device |
| 05/02/2013 | DE102011054943A1 High performance lighting LED packet for e.g. communication device, has silicone volumes evenly distributed on surface of optical transparent plate to effectively break light beams of LED chips and enlarge lighting region |
| 05/02/2013 | DE102006015335B4 Halbleiter-Strahlungsquelle sowie Lichthärtgerät Semiconductor radiation source and light curing device |
| 05/01/2013 | EP2587538A1 A light emitting diode array |
| 05/01/2013 | EP2587537A2 Light emitting device |
| 05/01/2013 | EP2587533A1 Wiring substrate, light emitting device, and method for manufacturing wiring substrate |
| 05/01/2013 | EP2586070A1 Optoelectronic semiconductor component |
| 05/01/2013 | EP2586059A1 Encapsulated control module for a motor vehicle |
| 05/01/2013 | EP2586058A1 Memory device |
| 05/01/2013 | EP2586056A1 Chip elements mounted on wires having an incipient breaking point |
| 05/01/2013 | EP2585842A1 Integrated circuit for and method of testing die -to -die bonding |
| 05/01/2013 | EP2585628A1 Inclusion of chip elements in a sheathed wire |
| 05/01/2013 | CN202918215U Novel integrated power packaging module |
| 05/01/2013 | CN202917540U Integrated high power LED integrated light source with two or more convex lenses |
| 05/01/2013 | CN202917538U High coloration LED light source based on green chip compensation |
| 05/01/2013 | CN202917487U High chromogenic LED light source based on red light chip direct-packaging compensation |
| 05/01/2013 | CN202917486U Single-particle surface-mounted light-mixing LED module assembly |
| 05/01/2013 | CN202917485U MCOB integrated light-mixing LED module assembly |
| 05/01/2013 | CN202917484U COB structure with remote phosphor film |
| 05/01/2013 | CN202917178U Encrypt security USB (universal series bus) flash disc and UDP (user datagram protocol) module |
| 05/01/2013 | CN202915169U Chip on board (COB) packaging light-emitting diode (LED) lamp assisting plant growing |
| 05/01/2013 | CN202915080U High-voltage light-emitting diode (LED) bulb |
| 05/01/2013 | CN103081578A Module substrate and method for manufacturing module substrate |
| 05/01/2013 | CN103081147A Optoelectronic semiconductor component and method for producing it |