| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 05/29/2013 | CN101286484B Semiconductor device and fabrication method |
| 05/28/2013 | US8453092 T-coil network design for improved bandwidth and electrostatic discharge immunity |
| 05/28/2013 | US8451026 Integrated circuit, method of generating a layout of an integrated circuit using standard cells, and a standard cell library providing such standard cells |
| 05/28/2013 | CA2520241C Metal base circuit board and its production process |
| 05/23/2013 | WO2013074846A1 Radio frequency package on package circuit |
| 05/23/2013 | WO2013073574A1 Semiconductor device, method for manufacturing same, and electronic component |
| 05/23/2013 | WO2013073573A1 Semiconductor device and fabrication method for same, and electronic component |
| 05/23/2013 | WO2013073082A1 Expanded semiconductor chip and semiconductor device |
| 05/23/2013 | WO2013071399A1 Package having stacked memory dies with serially connected buffer dies |
| 05/23/2013 | WO2012168858A3 Led array comprising scattering portions on the leds and method of manufacturing the same |
| 05/23/2013 | US20130130752 Flip-chip linear power amplifier with high power added efficiency |
| 05/23/2013 | DE102012111177A1 Chipträger, Verfahren zum Bilden eines Chipträgers und Verfahren zum Bilden eines Chipgehäuses Chip carrier, method of forming a chip carrier and method of forming a chip package |
| 05/23/2013 | DE102012109873A1 Anordnung von Hochvolt-Wechselstrom-LEDs Array of high-voltage AC LEDs |
| 05/23/2013 | DE102011055430A1 Light module for use in headlight of vehicle for e.g. creation of light, has light conductor comprising coupling surface that is provided with filter layer, where layer prevents coupling of light of source into conductor in defined range |
| 05/23/2013 | DE102008054306B4 Herstellungsverfahren für harzabgedichtete Halbleitervorrichtung Manufacturing process for harzabgedichtete semiconductor device |
| 05/22/2013 | EP2595188A1 Circuitry package |
| 05/22/2013 | EP2593976A2 Semifinished product and method for producing a light-emitting diode |
| 05/22/2013 | CN202949353U Power supply module used for large-power pulse stepping modulated high-voltage power supply |
| 05/22/2013 | CN202948979U High heat dissipation efficiency light emitting diode (LED) package structure |
| 05/22/2013 | CN202948977U Light emitting diode (LED) lamp board device with good radiation and low cost |
| 05/22/2013 | CN202948972U White light light emitting diode (LED) module packaging structure |
| 05/22/2013 | CN202948971U Integrated packaging structure for light-emitting diode (LED) |
| 05/22/2013 | CN202948921U Non-insulated type power module |
| 05/22/2013 | CN202948920U Three-dimensional integration high-density multi-chip assembly |
| 05/22/2013 | CN202948915U High density hybrid integrated circuit |
| 05/22/2013 | CN103119739A Led模块 Led Module |
| 05/22/2013 | CN103119702A Semiconductor chip device with polymeric filler trench |
| 05/22/2013 | CN103117354A Light-emitting diode (LED) lamp bead with built-in protection chip |
| 05/22/2013 | CN103117279A Method for forming chip-on-wafer assembly |
| 05/22/2013 | CN103117278A Integrated packing LED light source component |
| 05/22/2013 | CN103117277A Array lighting device of self-adaptive input power source and manufacturing method of array lighting device |
| 05/22/2013 | CN103117276A Low-inductive semiconductor module |
| 05/22/2013 | CN103117275A Chip packaging structure and chip packaging method |
| 05/22/2013 | CN103117274A Single-phase bridge rectifier |
| 05/22/2013 | CN103117273A Three-phase bridge rectifier |
| 05/22/2013 | CN103117272A Potting single-phase flat-shaped bridge rectifier |
| 05/22/2013 | CN103117271A Rectifier bridge pile with short noumenon |
| 05/22/2013 | CN103115258A Area light source with built-in light-emitting diode (LED) protective chips |
| 05/22/2013 | CN102237352B Light-emitting diode module and light-emitting diode lamp |
| 05/22/2013 | CN102034924B Light-emitting device and illumination device |
| 05/22/2013 | CN101999168B Method of creating alignment/centering guides for small diameter, high density through-wafer via die stacking |
| 05/22/2013 | CN101809741B Arrangement comprising at least one semiconductor component, in particular a power semiconductor component for the power control of high currents |
| 05/22/2013 | CN101770958B Protective thin film coating in chip packaging |
| 05/22/2013 | CN101663747B Ultra-thin chip packaging |
| 05/21/2013 | US8446176 Reconfigurable engineering change order base cell |
| 05/21/2013 | US8446175 Logic-cell-compatible decoupling capacitor |
| 05/21/2013 | US8445776 Solar cell module having a low haze encapsulant layer |
| 05/17/2013 | DE202012100508U1 LED-Leuchte mit Lichtbeeinflussungselement LED light with light influencing element |
| 05/16/2013 | WO2013069798A1 Manufacturing method for semiconductor device |
| 05/16/2013 | WO2013069192A1 Semiconductor device |
| 05/16/2013 | WO2013067654A1 Led chip fabrication method and structure thereof |
| 05/16/2013 | WO2013009866A3 Memory module in a package |
| 05/16/2013 | US20130122653 Stacked Package And Method Of Manufacturing The Same |
| 05/16/2013 | DE112005003653B4 Leistungshalbleitermodul mit auf Schaltungsträger aufgebrachten Lastanschlusselementen und Anschlussklemmelementen Power semiconductor module applied to circuit carrier load connection elements and terminal elements |
| 05/16/2013 | DE10295972B4 Nicht in einer Form hergestellte Packung für eine Halbleiteranordnung und Verfahren zur Herstellung Not manufactured in a mold package for a semiconductor device and method for producing |
| 05/16/2013 | DE102012101666B3 Power semiconductor modular system, has assembly segment and adjustment segment undetachably connected when undercut connection is not formed during positioning of two semiconductor modules relative to each other |
| 05/16/2013 | DE102011086365A1 LED assembly for retrofit LED lamp, has strip conductor that is electrically connected with the LED chip |
| 05/16/2013 | DE102011086359A1 LED-Modul LED module |
| 05/16/2013 | DE102011086193A1 LED module for use in vehicle light, has LED arranged at dielectric LED carrier that comprises contact section, and cooling body provided for removing heat of LED and directly connected with carrier, where cooling body has base plate |
| 05/16/2013 | DE102007015295B4 Leistungshalbleiterbauelement mit Temperatursensor und Verfahren zur Herstellung eines Leistungshalbleiterbauelements mit einem integrierten Temperatursensor Power semiconductor component with the temperature sensor and method for manufacturing a power semiconductor device with an integrated temperature sensor |
| 05/16/2013 | DE102006012007B4 Leistungshalbleitermodul mit oberflächenmontierbaren flachen Außenkontakten und Verfahren zur Herstellung desselben und dessen Verwendung The power semiconductor module of the same with flat outer surface mount contacts and methods of making and use thereof |
| 05/15/2013 | EP2592126A1 Photosensitive adhesive composition, photosensitive adhesive film, and semiconductor device using each |
| 05/15/2013 | EP2591502A1 Light-emitting diode |
| 05/15/2013 | EP2591280A2 Compact optically efficient solid state light source with integrated thermal management |
| 05/15/2013 | CN202940238U Printed flexible plastic LED module belt |
| 05/15/2013 | CN202940237U Long-persistence light emitting diode packaging structure |
| 05/15/2013 | CN202940231U Power electronic system with first and second subsystems |
| 05/15/2013 | CN103109587A Coating method for an optoelectronic chip-on-board module |
| 05/15/2013 | CN103109368A Semiconductor chip with reinforcing through-silicon-vias |
| 05/15/2013 | CN103109367A Stackable molded microelectronic packages |
| 05/15/2013 | CN103107274A Light-emitting diode (LED) integrated packaging module achieved by adopting transition electrode |
| 05/15/2013 | CN103107272A Substrate, light emitting device and method for manufacturing substrate |
| 05/15/2013 | CN103107172A Organic lighting emitting diode (OLED) image transmitting and receiving device of micro-display integrated back lighting image sensor |
| 05/15/2013 | CN103107171A Semiconductor device of flip chip |
| 05/15/2013 | CN103107170A Anti-dazzle color temperature adjustable high-voltage light-emitting diode (LED) lamp bead and lamp composed of the same |
| 05/15/2013 | CN103107169A Light emitting diode package, lighting device and backlight module |
| 05/15/2013 | CN103107168A LED package structure for enhancing mixed light effect |
| 05/15/2013 | CN103107167A Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device |
| 05/15/2013 | CN102306648B Optical coupler |
| 05/15/2013 | CN102299244B High-power light emitting diode (LED) seamless special-shaped light source |
| 05/15/2013 | CN101997079B Light-emitting device |
| 05/14/2013 | US8441314 Configurable clock network for programmable logic device |
| 05/14/2013 | US8441298 Analog bus sharing using transmission gates |
| 05/14/2013 | US8441095 Semiconductor device having a ring oscillator and MISFET for converting voltage fluctuation to frequency fluctuation |
| 05/14/2013 | US8440472 Stacking apparatus and method for stacking integrated circuit elements |
| 05/10/2013 | WO2013066920A2 Broad-area lighting systems |
| 05/10/2013 | WO2013066294A1 Multi die package structures |
| 05/10/2013 | WO2013065647A1 Semiconductor device |
| 05/10/2013 | WO2013065472A1 Integrated power converter apparatus and dc-dc converter apparatus to be used therein |
| 05/10/2013 | WO2013065316A1 Power converter |
| 05/10/2013 | WO2013065182A1 Power module, power converter, and electric vehicle |
| 05/10/2013 | WO2013064800A1 Illumination apparatus |
| 05/10/2013 | WO2013064592A2 Wafer scale technique for interconnecting vertically stacked dies |
| 05/10/2013 | WO2013064361A1 Led module and method for operating an led module |
| 05/10/2013 | WO2013063806A1 Power stack structure and method |
| 05/10/2013 | WO2013009871A3 Memory module in a package |
| 05/10/2013 | WO2013006243A3 Inverted metamorphic multi-junction (imm) solar cell and associated fabrication method |
| 05/10/2013 | CA2852783A1 Power stack structure and method |
| 05/09/2013 | US20130114323 Semiconductor device and data storage apparatus |
| 05/09/2013 | US20130114171 Apparatus for Electrostatic Discharge Protection and Noise Suppression in Circuits |