| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 06/12/2013 | CN103151938A Converter unit provided with inversely parallel cascade structure and based on welding type insulated gate bipolar translators (IGBT)s and pressure welding type diodes |
| 06/12/2013 | CN103151419A An optical coupler |
| 06/12/2013 | CN103151345A Lamp core plate, and method for manufacturing lamp core |
| 06/12/2013 | CN103151344A LED (Light Emitting Diode) high-development white light emitting device for common illumination |
| 06/12/2013 | CN103151343A Light emitting diode (LED) structure with functions of improving light-emitting efficiency and heat dissipation efficiency |
| 06/12/2013 | CN103151342A VMOS (V-groove Metal Oxide Semiconductor) mixed membrane integrated chip for driving multiple paths of valves |
| 06/12/2013 | CN103151341A System-level packaging structure |
| 06/12/2013 | CN103151340A Antenna encapsulating module and manufacturing method thereof |
| 06/12/2013 | CN103151323A Flip packaging structure based on anisotropy conductive glue |
| 06/12/2013 | CN103151316A Reconfigurable operator array structure scale expansion method based on multiple chip package (MCP) encapsulation form |
| 06/12/2013 | CN103148387A LED (light emitting diode) luminaire |
| 06/12/2013 | CN102544325B Light emitting diode (LED) integrated module and method for manufacturing same |
| 06/12/2013 | CN102044536B Photoelectric energy conversion device |
| 06/12/2013 | CN101983428B Method for producing a plurality of optoelectronic components |
| 06/12/2013 | CN101924080B Power semiconductor module featuring resiliently supported substrates and method for fabricating a power semiconductor module |
| 06/12/2013 | CN101853826B Connection member and printed circuit board unit |
| 06/11/2013 | US8463092 Waveguide assisted solar energy harvesting |
| 06/11/2013 | US8461920 Semiconductor integrated circuit device |
| 06/11/2013 | US8461919 Radio frequency switch circuit |
| 06/11/2013 | US8461875 Digital circuits having improved transistors, and methods therefor |
| 06/11/2013 | US8461867 Semiconductor device having plural unit buffers constituting output buffer |
| 06/11/2013 | US8461679 Method for fabricating circuit component |
| 06/11/2013 | US8461613 Light emitting device |
| 06/11/2013 | CA2671924C Light-emitting or light-receiving semiconductor module and method for making the same |
| 06/06/2013 | WO2013081328A1 Light emitting diode package and method of manufacturing light emitting diode package |
| 06/06/2013 | WO2013080749A1 Electronic module |
| 06/06/2013 | WO2013080442A1 Power conversion device |
| 06/06/2013 | WO2013080441A1 Power conversion device |
| 06/06/2013 | WO2013080440A1 Power conversion device |
| 06/06/2013 | WO2013080426A1 Integrated-circuit device with structure devised in consideration of heat, three-dimensional integrated circuit, three-dimensional processor device, and process scheduler |
| 06/06/2013 | WO2013078609A1 Active chip package substrate and preparation method of the substrate |
| 06/06/2013 | WO2013078536A1 Cpu with stacked memory |
| 06/06/2013 | WO2012054335A8 Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristics |
| 06/06/2013 | DE102012106664A1 Metallene PCB mit einer löchrigen reflektierenden Fläche und Verfahren zur Herstellung derselben Metal PCB with a holey reflecting surface and method of manufacturing the same |
| 06/06/2013 | DE102011087614A1 Optoelectronic arrangement for use in headlight in vehicle, has planar light conductor for mixing of electromagnetic radiation, arranged downstream to semiconductor chips in radiation pattern and covering gap between semiconductor chips |
| 06/05/2013 | EP2600516A1 Power converter |
| 06/05/2013 | EP2600428A2 Element-connecting board, producing method thereof, and light emitting diode device |
| 06/05/2013 | EP2600398A1 Power semiconductor unit, power module, production method for power semiconductor unit and production method for power module |
| 06/05/2013 | EP2599120A1 Optoelectronic component |
| 06/05/2013 | CN202977417U Carrier plate encapsulation structure with sensing device |
| 06/05/2013 | CN202977416U Diode block of off-highway dumper |
| 06/05/2013 | CN202977415U Warm light LED (Light Emitting Diode) lamp package structure |
| 06/05/2013 | CN202977414U Sheet type switch clad tube |
| 06/05/2013 | CN202977413U Chip type difference clad pipe |
| 06/05/2013 | CN202972602U LED illumination device |
| 06/05/2013 | CN103139952A Organic el illumination module and illumination apparatus including same |
| 06/05/2013 | CN103137716A Solar battery, solar battery pack and method for preparing solar battery pack |
| 06/05/2013 | CN103137614A Optical assembly packaging structure for strengthening heat dissipation and manufacturing method thereof |
| 06/05/2013 | CN103137613A Package substrate of active chip and preparation method thereof |
| 06/05/2013 | CN103137612A Solar cell module and manufacturing method thereof |
| 06/05/2013 | CN103137611A Crystal plate stacked structure and manufacturing method thereof |
| 06/05/2013 | CN103137589A Package-on-package (PoP) structure and method |
| 06/05/2013 | CN103137566A Method for forming an integrated circuit |
| 06/05/2013 | CN102270628B 光源模组 Light module |
| 06/05/2013 | CN102222737B LED (Light Emitting Diode) encapsulating body and encapsulating method thereof |
| 06/05/2013 | CN102208517B LED package die having a small footprint |
| 06/05/2013 | CN102148311B LED (light-emitting diode) packaging method |
| 06/05/2013 | CN102074637B Method and structure for encapsulating solid-state luminous chips and light source device using encapsulation structure |
| 06/05/2013 | CN102005509B Light-emitting diode (LED) and manufacturing method thereof |
| 06/05/2013 | CN101687284B Joint product, process for producing the joint product, power semiconductor module, and process for producing the power semiconductor module |
| 06/05/2013 | CN101593736B Semiconductor device and manufacturing method therefor |
| 06/04/2013 | US8458627 Semiconductor device including logic circuit having areas of different optical proximity accuracy |
| 06/04/2013 | US8456192 Permutable switching network with enhanced interconnectivity for multicasting signals |
| 06/04/2013 | US8456141 Boost converter with integrated high power discrete FET and low voltage controller |
| 06/04/2013 | US8456015 Triaxial through-chip connection |
| 06/04/2013 | US8455825 Opto-mechanical infrared thermal viewer device |
| 06/04/2013 | US8455806 Photovoltaic assembly for use in diffuse weather conditions and related methods |
| 06/04/2013 | US8455356 Integrated void fill for through silicon via |
| 06/04/2013 | US8453449 Vertical axis solar powered generator |
| 05/30/2013 | WO2013077081A1 Semiconductor device and electronic apparatus |
| 05/30/2013 | WO2013075947A1 Semiconductor device with through-substrate via covered by a solder ball and related method of production |
| 05/30/2013 | WO2013075754A1 A hvdc thyristor valve assembly |
| 05/30/2013 | WO2013075309A1 Water resistant led devices and led display including the same |
| 05/30/2013 | WO2013045367A3 Electronic assembly comprising a high temperature-stable substrate basic material, method for the production thereof and use thereof in a power electronics |
| 05/30/2013 | US20130137259 Process for Making Contact with and Housing Integrated Circuits |
| 05/30/2013 | US20130134544 Energy harvesting in integrated circuit packages |
| 05/30/2013 | US20130134484 Abutment structure of semiconductor cell |
| 05/29/2013 | EP2597678A2 Package for mounting electronic components, electronic apparatus, and method for manufacturing the package |
| 05/29/2013 | EP2597677A1 Semiconductor device with through-substrate via covered by a solder ball and related method of production |
| 05/29/2013 | EP2597671A2 Method for permanently connecting two metal surfaces |
| 05/29/2013 | EP2597670A2 Method for permanently connecting two metal surfaces |
| 05/29/2013 | EP2597353A1 Led integrated packaging light source module |
| 05/29/2013 | EP2596534A1 Radiation-emitting component and method for producing radiation-emitting components |
| 05/29/2013 | EP2596532A1 Optoelectronic component |
| 05/29/2013 | EP2596531A1 Embedded structures and methods of manufacture thereof |
| 05/29/2013 | DE112011101862T5 Elektrische Verbindungsvorrichtung Electrical connection device |
| 05/29/2013 | DE102012220728A1 Leuchtdiode, die eine beliebige gewünschte Farbe erzeugt Light-emitting diode, which generates any desired color |
| 05/29/2013 | DE102012206758B3 Method for manufacturing substrate for power semiconductor component such as MOSFET of power semiconductor module, involves performing galvanic isolation of metal film on broad strip conductor |
| 05/29/2013 | DE102011119467A1 Solarzellenmodul und Konzentratormodul sowie deren Verwendung Solar cell module and concentrator and their use |
| 05/29/2013 | DE102005007373B4 Leistungshalbleiterbaugruppe Power semiconductor module |
| 05/29/2013 | CN202957241U Light source structure |
| 05/29/2013 | CN202957240U High-power double-tablet overlay packaged diode matrix type assembly |
| 05/29/2013 | CN103125022A Power semiconductor module, electricity transformer device, and railway car |
| 05/29/2013 | CN103123921A Lighting device for growing plant |
| 05/29/2013 | CN103123920A Electronic assembly apparatus and associated methods |
| 05/29/2013 | CN103123919A Low inductance power module |
| 05/29/2013 | CN102237349B Light emitting devices |
| 05/29/2013 | CN102231378B Light-emitting diode (LED) packaging structure and preparation method thereof |
| 05/29/2013 | CN102005439B High frequency device |
| 05/29/2013 | CN101901791B Die set for multi-packaging assembly and method for making the die set and the multi- packaging assembly |