Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
06/2013
06/26/2013CN102376674B Packaging structure with embedded semi-conductor element
06/26/2013CN102231376B Multi-cycle arrangement carrier-free double-integrated chip (IC) package and production method
06/26/2013CN102032483B Light-emitting diode (LED) plane light source
06/26/2013CN101989598B Multi-die package
06/26/2013CN101697348B Small-carrier flat-four-side pin-less packaging part and preparation method thereof
06/26/2013CN101409279B Semiconductor device including electronic component coupled to a backside of a chip
06/25/2013US8471594 Apparatus and method for obtaining maximum value and minimum value in plurality of digital input signals
06/25/2013US8471592 Recursive code logic
06/25/2013US8471379 Semiconductor device
06/25/2013US8471374 Integrated circuit package system with L-shaped leadfingers
06/25/2013US8471140 Porous silica precursor composition and method for preparing the precursor composition, porous silica film and method for preparing the porous silica film, semiconductor element, apparatus for displaying an image, as well as liquid crystal display
06/25/2013CA2716920C Semiconductor device, and communication apparatus and electronic apparatus having the same
06/20/2013WO2013089242A1 Power module semiconductor device and method for manufacturing same
06/20/2013WO2013089211A1 Semiconductor device and semiconductor device manufacturing method
06/20/2013WO2013089099A1 Power module substrate, substrate for power module with heat sink, power module, paste for forming flux component penetration prevention layer, and bonding method for article to be bonded
06/20/2013WO2013088870A1 Power semiconductor module and power module
06/20/2013WO2013088864A1 Semiconductor device
06/20/2013WO2013087382A1 Power module for an electric drive
06/20/2013WO2013087101A1 Substrate-supported circuit parts with free-standing three-dimensional structures
06/20/2013WO2013052322A3 Stub minimization using duplicate sets of terminals for wirebond assemblies without windows
06/20/2013US20130157413 Semiconductor package including flip chip controller at bottom of die stack
06/20/2013US20130157412 Chip on wafer bonder
06/20/2013US20130154727 Distributed resonant clock grid synthesis
06/20/2013US20130154706 Semiconductor chip and semiconductor device
06/20/2013US20130154117 Stacked die in die bga package
06/20/2013DE102012105153A1 Halbleiter-package The semiconductor package
06/20/2013DE102012005787A1 Halbleiter-Package The semiconductor package
06/20/2013DE102011088617A1 Elektrisch abstimmbares Impedanzanpassnetzwerk eines HF-Leistungstransistors Electrically tunable Impedanzanpassnetzwerk of an RF power transistor
06/20/2013DE102011056654A1 Leuchtdiodenanordnung LED arrangement
06/20/2013DE102008033465B4 Leistungshalbleitermodulsystem und leistungshalbleitermodul mit einem gehause sowie verfahren zur herstellung einer leis- tungshalbleiteranordnung Power semiconductor module system and power semiconductor module with a housing and process for manufacturing a power semiconductors arrangement
06/19/2013EP2605279A1 Stacked packaging using reconstituted wafers
06/19/2013EP2605273A2 Method for forming isolation trenches in micro-bump interconnect structures and devices obtained thereof
06/19/2013CN203013787U Graphite substrate packaged LED light source
06/19/2013CN203013722U An improved structure of surface-mounted LED lamp beads
06/19/2013CN203013721U A multifunctional integrated LED support
06/19/2013CN203013720U LED surface light source
06/19/2013CN203013719U White-light LED light source
06/19/2013CN203013718U Photovoltaic bypass diode
06/19/2013CN203013717U Three-dimensional integration power hybrid integrated circuit
06/19/2013CN203013716U High-reliability homogeneous bonding system multi-chip module
06/19/2013CN203013702U Packaging structure
06/19/2013CN103168358A Embedded structures and methods of manufacture thereof
06/19/2013CN103168355A Circuit board for large-capacity module peripheral circuit and large-capacity module containing peripheral circuit using said circuit board
06/19/2013CN103165803A Light-emitting element mounting package, light-emitting element package, and method of manufacturing the same
06/19/2013CN103165795A Light-emitting element mounting package, light-emitting element package, and method of manufacturing these
06/19/2013CN103165593A Standard light-emitting diode printed circuit board (LED PCB) module design and module connecting structure
06/19/2013CN103165592A Light emitting device
06/19/2013CN103165591A Light-emitting diode (LED) area light source module and packaging method thereof
06/19/2013CN103165590A Light emitting diode (LED) and down-straight type backlight source
06/19/2013CN103165589A Mixed light type polycrystal packaging structure
06/19/2013CN103165588A Insulated gate bipolar transistor (IGBT) module
06/19/2013CN103165587A 半导体封装 The semiconductor package
06/19/2013CN103165586A Semiconductor stack packages and methods of fabricating the same
06/19/2013CN103165585A Stacked packaging using reconstituted wafers
06/19/2013CN103165563A Semiconductor packaging piece and producing method thereof
06/19/2013CN103165545A Chip package and method for forming the same
06/19/2013CN103165484A Stacked package and manufacturing method thereof
06/19/2013CN103162127A LED packaging structure
06/19/2013CN102347323B Color-temperature-tunable assembly and method for producing white light with different color temperature
06/19/2013CN102176452B High-density chip system-in-package structure
06/19/2013CN102074558B Light-emitting device and lighting appliance
06/19/2013CN102024803B 功率模块 Power Modules
06/19/2013CN101971486B Semiconductor device, and communication apparatus and electronic apparatus provided with semiconductor device
06/19/2013CN101807651B Light emitting device package
06/19/2013CN101359660B Semiconductor apparatus with thin semiconductor film
06/18/2013US8468485 Integrated circuit, integrated circuit design device and integrated circuit design method
06/18/2013US8467633 Wavelength conversion structure and light source apparatus
06/18/2013US8466739 3D chip stack skew reduction with resonant clock and inductive coupling
06/18/2013US8466422 Visible light and IR combined image camera
06/14/2013DE202013101876U1 Verbesserte Verpackungsstruktur des Leuchtdiodenmoduls mit integriertem Schaltkreischip The improved package structure of the light-emitting module with an integrated circuit chip
06/13/2013WO2013084589A1 Semiconductor device and semiconductor device manufacturing method
06/13/2013WO2013084529A1 Imaging device and manufacturing method for same
06/13/2013WO2013084417A1 Power conversion apparatus
06/13/2013WO2013084384A1 Semiconductor device and method for manufacturing same
06/13/2013WO2013084334A1 Substrate for large-capacity module, and manufacturing method for said substrate
06/13/2013WO2013083819A1 Light‑emitting diode arrangement
06/13/2013WO2013083528A2 Semiconductor luminaire
06/13/2013WO2013083334A1 Optoelectronic semi-conductor component and method for producing an optoelectronic semi-conductor component
06/13/2013WO2013055453A3 Solder-coated copper stud bump wafer level package and manufacturing method thereof
06/13/2013US20130148310 Printed circuit board having wire pattern
06/13/2013US20130147063 Methods of fabricating fan-out wafer level packages and packages formed by the methods
06/13/2013US20130146991 Device Including Two Power Semiconductor Chips and Manufacturing Thereof
06/13/2013DE102012111788A1 Vorrichtung mit zwei Leistungshalbleiterchips und Verfahren für ihre Herstellung Device with two power semiconductor chips and methods for their preparation
06/13/2013DE102011088216A1 Motorsteuergerät mit Opferstruktur Engine control unit with sacrificial structure
06/13/2013DE102011087887A1 Leuchtdiodenanordnung LED arrangement
06/13/2013DE102011087886A1 Halbleiterleuchte Semiconductor light
06/13/2013DE102011056329A1 Smart card module of smart card e.g. payment card, has chip external coil and chip external capacitor that are arranged to form a module arrangement which produces resonant frequency corresponding to operating frequency
06/13/2013DE102011004544B4 Schaltungsanordnung Circuitry
06/12/2013EP1260196B1 Illumination device
06/12/2013CN202996907U Efficient integrated LED light source
06/12/2013CN202996892U Led packaging structure
06/12/2013CN202996833U Compound packaged IGBT device
06/12/2013CN202996832U COB surface light source
06/12/2013CN202996831U Power electronic system possessing cooling device
06/12/2013CN202996821U 半导体装置 Semiconductor device
06/12/2013CN202994184U Support plate packaging structure having induction device
06/12/2013CN103155190A Pec biasing technique for LEDs
06/12/2013CN103155186A Wavelength converted light emitting device
06/12/2013CN103155147A Internal wiring structure of semiconductor device
06/12/2013CN103155146A Method for producing chip stacks, and a carrier for carrying out the method
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