| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
|---|
| 07/08/2013 | DE202013102741U1 Doppelchip-Leuchtdiode Double-chip light emitting diode |
| 07/04/2013 | WO2013101815A1 Embedded heat spreader for microelectronic package |
| 07/04/2013 | WO2013098637A1 Titania microstructure in a dye solar cell |
| 07/04/2013 | WO2013052411A4 Stub minimization for wirebond assemblies without windows |
| 07/04/2013 | US20130169355 Integrated Circuit Device |
| 07/04/2013 | US20130169179 Light tube and power supply circuit |
| 07/04/2013 | US20130168798 Chip package structure |
| 07/04/2013 | DE102012113012A1 Elektronische Vorrichtung und Verfahren zum Herstellen einer elektronischen Vorrichtung An electronic device and method for manufacturing an electronic device |
| 07/04/2013 | DE102009049613B4 Leistungshalbleitervorrichtung Power semiconductor device |
| 07/03/2013 | EP2610919A1 Woven mesh substrate with semiconductors, and method and device for manufacturing same |
| 07/03/2013 | EP2610909A2 LED lighting device with high color rendering index |
| 07/03/2013 | EP2610907A1 Stacked electronic device and method for manufacturing such an electronic device |
| 07/03/2013 | EP2610906A1 Method for collective production of 3D electronic modules comprising only valid PCBs |
| 07/03/2013 | EP2609629A1 Photovoltaic module and method for improved reverse bias, reverse current and hotspot protection |
| 07/03/2013 | EP2609624A2 Solid state light sheet or strip for general illumination |
| 07/03/2013 | EP2609623A2 Optical communication in a ramp-stack chip package |
| 07/03/2013 | CN203038979U Moisture-proof full-color surface mount device |
| 07/03/2013 | CN203038975U Color-changing integrated LED lamp |
| 07/03/2013 | CN203038974U Large power COB-LED light source device structure with adjustable light and color |
| 07/03/2013 | CN203038972U LED module packaging structure |
| 07/03/2013 | CN203038920U Support plate packaging structure having induction device |
| 07/03/2013 | CN203038919U High-power bicrystal LED lamp |
| 07/03/2013 | CN203038918U Flat package structure without outer lead on four sides |
| 07/03/2013 | CN203038913U EMMC memory integrated with NANDFLASH flash memory function |
| 07/03/2013 | CN103190205A Method for coating an optoelectronic chip-on-board module and optoelectronic chip-on-board-module |
| 07/03/2013 | CN103189981A High density multi-chip LED devices |
| 07/03/2013 | CN103189980A Multi-chip LED devices |
| 07/03/2013 | CN103189978A Apparatus and method for thermal interfacing |
| 07/03/2013 | CN103187514A LED (light-emitting diode) package structure |
| 07/03/2013 | CN103187410A Encapsulation structure of RGB (Red, Green and Blue) three-color LED (Light-Emitting Diode) |
| 07/03/2013 | CN103187409A Light-emitting diode (LED) array packaging light source module based on lead frame |
| 07/03/2013 | CN103187408A Light-emitting diode packaging structure |
| 07/03/2013 | CN103187407A Method and structure for packaging light-emitting module of diffusion excitation fluorescent agent |
| 07/03/2013 | CN103187406A Package structure and package method of light emitting diode |
| 07/03/2013 | CN103187405A Methods and apparatus for package on package devices with reduced strain |
| 07/03/2013 | CN103187404A Semiconductor chip stacking and packaging structure and process thereof |
| 07/03/2013 | CN103187377A Semiconductor package with a bridge interposer |
| 07/03/2013 | CN103186252A Sensor module of optical mouse and manufacturing method for sensor module of optical mouse |
| 07/03/2013 | CN102255011B Manufacturing method of high-voltage direct current (DC) light-emitting diode (LED) chip |
| 07/03/2013 | CN102244186B High-power LED (light emitting diode) light emitting device package structure |
| 07/03/2013 | CN102176444B High integration level system in package (SIP) structure |
| 07/03/2013 | CN102110682B Light-emitting device and method for producing the same |
| 07/03/2013 | CN101950724B Thyristor pressing mechanism for direct current power transmission converter valve |
| 07/02/2013 | US8478123 Imaging devices having arrays of image sensors and lenses with multiple aperture sizes |
| 07/02/2013 | US8476959 Radio frequency switch circuit |
| 07/02/2013 | US8476928 System level interconnect with programmable switching |
| 07/02/2013 | US8476750 Printed circuit board having embedded dies and method of forming same |
| 07/02/2013 | US8476117 Methods and apparatus for a stacked-die interposer |
| 06/27/2013 | WO2013095444A1 Packaged semiconductor die and cte-engineering die pair |
| 06/27/2013 | WO2013095363A1 Microelectronic package and stacked microelectronic assembly and computing system containing same |
| 06/27/2013 | WO2013094755A1 Wiring board and electronic device |
| 06/27/2013 | WO2013094028A1 Semiconductor module |
| 06/27/2013 | WO2013092344A1 Light source lifetime extension in an optical system |
| 06/27/2013 | WO2013092098A1 Circuit carrier with a separate rf circuit and method for populating such a circuit carrier |
| 06/27/2013 | WO2013091829A1 Opto-electronic modules, in particular flash modules, and method for manufacturing the same |
| 06/27/2013 | WO2013091441A1 Pop encapsulation structure |
| 06/27/2013 | WO2013064592A3 Wafer scale technique for interconnecting vertically stacked semiconductor dies |
| 06/27/2013 | WO2013056916A3 Pad for a lighting device |
| 06/27/2013 | US20130162346 Interconnection device in a multi-layer shielding mesh |
| 06/27/2013 | US20130162345 Semiconductor integrated circuit including a power controllable region |
| 06/27/2013 | US20130162344 Distributed lc resonant tanks clock tree synthesis |
| 06/27/2013 | US20130162343 Integrated circuit system |
| 06/27/2013 | US20130162332 Integrated circuits with reduced voltage across gate dielectric and operating methods thereof |
| 06/27/2013 | DE112011102966T5 In den Kühlkörper integrierte Stromversorgung und Stromverteilung für integrierte Schaltungen In the heat sink integrated power supply and power distribution for integrated circuits |
| 06/27/2013 | DE112011102716T5 3D-Integration von Solarzelle und Batterie 3D integration of solar cell and battery |
| 06/27/2013 | DE10205870B4 Moduleinheit mit SiC-Halbleiterbauelement mit Schottky-Kontakten Module unit with SiC semiconductor device with Schottky contacts |
| 06/27/2013 | DE102012220164A1 Halbleitermodul Semiconductor module |
| 06/27/2013 | DE102012201890A1 Electrical power module for use in e.g. insulated gate bipolar transistor, has control device controlling electronic components, arranged at side of component and electrically coupled with contact element at another side of component |
| 06/27/2013 | DE102012112769A1 Modul mit einer diskreten Vorrichtung, die auf einem DCB-Substrat montiert ist Module with a discrete device that is mounted on a DCB substrate |
| 06/27/2013 | DE102012111914A1 Lichtquellenmodul und Hintergrundbeleuchtungseinheit Light source module and the backlight unit |
| 06/27/2013 | DE102012101409A1 Verfahren zur Herstellung einer Mehrzahl von optoelektronischen Halbleiterchips und optoelektronischer Halbleiterchip A process for producing a plurality of optoelectronic semiconductor chips and optoelectronic semiconductor chip |
| 06/27/2013 | DE102011089740A1 Power module for use in inverter for three-phase alternating-current motor utilized as drive motor in e.g. electric car, has strip conductors partially overlapped along direction of vertical axis, and insulation layer made of ceramic |
| 06/27/2013 | DE102011056890A1 Anschlussträger, optoelektronische Bauelementanordnung und Beleuchtungsvorrichtung Connection carrier, optoelectronic component arrangement and lighting device |
| 06/27/2013 | DE102006001792B4 Halbleitermodul mit Halbleiterchipstapel und Verfahren zur Herstellung desselben The same semiconductor module with the semiconductor chip stack, and process for preparing |
| 06/26/2013 | EP2608261A2 Semiconductor device |
| 06/26/2013 | EP2608207A1 Semiconductor device with through-silicon vias |
| 06/26/2013 | EP2606515A1 Optoelectronic semiconductor component and scattering body |
| 06/26/2013 | EP2606511A1 Optoelectronic semiconductor chip and method for producing optoelectronic semiconductor chips |
| 06/26/2013 | CN203026558U LED (lighting emitted diode) component |
| 06/26/2013 | CN203026504U Light emitting diode (LED) device |
| 06/26/2013 | CN203026503U LED device for display screen and display module |
| 06/26/2013 | CN203026502U Ultrathin miniature bridge rectifier |
| 06/26/2013 | CN203026501U Plane single-row or matrix type multi-carrier IC (Integrated Circuit) chip packaging piece |
| 06/26/2013 | CN203026500U Stack packaging device |
| 06/26/2013 | CN203026499U Chip double-sided packaging structure |
| 06/26/2013 | CN203026498U Chip stacked layer packaging structure |
| 06/26/2013 | CN103180946A Heat sink integrated power delivery and distribution for integrated circuits |
| 06/26/2013 | CN103180945A Laminate support film for fabrication of light emitting devices and method its fabrication |
| 06/26/2013 | CN103180944A Electronic components assembly |
| 06/26/2013 | CN103180943A Electronic component module |
| 06/26/2013 | CN103179787A Structure and method for packaging three-axis sensor |
| 06/26/2013 | CN103178201A Cold and hot bidirectional chip of semiconductor |
| 06/26/2013 | CN103178056A Semiconductor package including multiple chips and memory system having the same |
| 06/26/2013 | CN103178055A Light-emitting diode device |
| 06/26/2013 | CN103178054A Semiconductor Package Including Stacked Semiconductor Chips and a Redistribution Layer |
| 06/26/2013 | CN103178040A 半导体结构及其制造方法 The semiconductor structure and a method of manufacturing |
| 06/26/2013 | CN103178036A Semiconductor and manufacturing method thereof |
| 06/26/2013 | CN103178032A Semiconductor packaging process using through silicon vias |
| 06/26/2013 | CN103178031A Chip connection method |
| 06/26/2013 | CN103178025A Semiconductor device and fabrication method |