| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 07/18/2013 | WO2013105456A1 Circuit board and electronic device |
| 07/18/2013 | WO2013105332A1 Power semiconductor module, power module, and power module manufacturing method |
| 07/18/2013 | WO2013105153A1 Semiconductor device |
| 07/18/2013 | WO2013104963A1 Light emitting array with improved light output efficiency |
| 07/18/2013 | WO2013104712A1 Semiconductor devices |
| 07/18/2013 | WO2013104708A1 Light-emitting module, light source assembly, and methods for manufacturing |
| 07/18/2013 | WO2013076480A3 Led light source with passive chromaticity tuning |
| 07/18/2013 | WO2013010284A3 Opto -electronic modules and methods of manufacturing the same |
| 07/18/2013 | US20130182180 High Density Composite Focal Plane Array |
| 07/18/2013 | US20130181228 Power semiconductor module and method of manufacturing the same |
| 07/18/2013 | DE202013103056U1 Leistungsmodul Power module |
| 07/18/2013 | DE112011103148T5 Multichip-LED-Vorrichtungen mit hoher Dichte Multi-chip LED devices with high density |
| 07/18/2013 | DE112010005894T5 Herstellungsverfahren für Leuchtdioden mit Gehäuse Manufacturing process for light-emitting diodes with housing |
| 07/18/2013 | DE112005001285B4 Halbleitervorrichtungsmodul mit Flipchip-Vorrichtungen auf einem gemeinsamen Leiterrahmen Semiconductor device module with flip-chip devices on a common leadframe |
| 07/18/2013 | DE102012222879A1 Leistungshalbleitermodul und Verfahren zu seiner Herstellung The power semiconductor module and method for its preparation |
| 07/18/2013 | DE102008045744B4 Halbleiterbaustein mit einer an eine Rückseite eines Chips gekoppelten Elektronikkomponente und Verfahren zur Herstellung A semiconductor device having a coupled to a backside of a chip electronic component and methods for making |
| 07/18/2013 | DE102004054996B4 Elektronisches Gerät Electronic Instrument |
| 07/17/2013 | EP2615641A2 Chip attack protection |
| 07/17/2013 | EP2615639A2 Semiconductor die with a universal interface block, associated electronic apparatuses and associated methods |
| 07/17/2013 | EP2615140A2 Light emitting device package |
| 07/17/2013 | EP2614694A1 Coating method for an optoelectronic chip-on-board module |
| 07/17/2013 | EP2614693A1 Method for coating an optoelectronic chip-on-board module and optoelectronic chip-on-board-module |
| 07/17/2013 | EP2614539A1 Optoelectronic semiconductor component and method for producing it |
| 07/17/2013 | EP2614538A1 Method for producing an optoelectronic semiconductor component |
| 07/17/2013 | EP2614523A1 Semiconductor chip with redundant thru-silicon-vias |
| 07/17/2013 | EP2614522A1 Semiconductor chip device with polymeric filler trench |
| 07/17/2013 | EP2274773B1 Die stacking with an annular via having a recessed socket |
| 07/17/2013 | EP1876644B1 Semiconductor device and manufacturing method of same |
| 07/17/2013 | CN203071134U LED integrated packaging module realized by using transition electrode |
| 07/17/2013 | CN203071129U Light emitting device |
| 07/17/2013 | CN203071080U Diode component having temperature compensation |
| 07/17/2013 | CN203071070U Composite power supply of solar cell-thermoelectric cell |
| 07/17/2013 | CN203071069U Three-cup LED lamp |
| 07/17/2013 | CN203071068U Convex-type packaging structure of LED light source |
| 07/17/2013 | CN203071067U Anti-dazzling color temperature adjustable high-voltage LED lamp bead and lamp formed by same |
| 07/17/2013 | CN203071066U Parallelly connected welding wire structure of LED lamp |
| 07/17/2013 | CN203071065U White LED source structure |
| 07/17/2013 | CN203071064U Light emitting element packaging device |
| 07/17/2013 | CN203071063U Novel MCOB light source |
| 07/17/2013 | CN203071062U Light emitting diode package module |
| 07/17/2013 | CN203068236U LED lamp with separated welding wire structure |
| 07/17/2013 | CN203068198U Integrated light-emitting diode (LED) lamp structure |
| 07/17/2013 | CN1501493B Combined semiconductor apparatus with thin semiconductor films |
| 07/17/2013 | CN103210510A Optoelectronic semiconductor device |
| 07/17/2013 | CN103210490A Solid state light sheet or strip for general illumination |
| 07/17/2013 | CN103210489A 半导体装置 Semiconductor device |
| 07/17/2013 | CN103210486A Staged via formation from both sides of chip |
| 07/17/2013 | CN103208489A Light emitting diode array and manufacturing method thereof |
| 07/17/2013 | CN103208488A Thin-type multilayer array type light-emitting diode optical engine |
| 07/17/2013 | CN103208487A Methods and apparatus for thinner package on package structures |
| 07/17/2013 | CN103208486A Package of multi-chip stack and manufacturing method thereof |
| 07/17/2013 | CN102124563B Substrate on which element is to be mounted, semiconductor module, semiconductor device, method for producing substrate on which element is to be mounted, method for manufacturing semiconductor device, and portable device |
| 07/17/2013 | CN101960592B Circuit for preventing self-heating of metal-insulator-transition (mit) device and method of fabricating integrated-device for the same circuit |
| 07/17/2013 | CN101809773B Arrangement comprising an optoelectronic component |
| 07/17/2013 | CN101687393B Light output device |
| 07/17/2013 | CN101582396B Semiconductor device and manufacturing of the same |
| 07/16/2013 | US8487658 Compact and robust level shifter layout design |
| 07/16/2013 | US8487653 SDOC with FPHA and FPXC: system design on chip with field programmable hybrid array of FPAA, FPGA, FPLA, FPMA, FPRA, FPTA and frequency programmable xtaless clockchip with trimless/trimfree self-adaptive bandgap reference xtaless clockchip |
| 07/16/2013 | US8487519 Light emitting device |
| 07/16/2013 | US8486728 Semiconductor device including semiconductor elements mounted on base plate |
| 07/11/2013 | WO2013052320A4 Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate |
| 07/11/2013 | US20130178016 Methods of fabricating a package-on-package device and package-on-package devices fabricated by the same |
| 07/11/2013 | US20130175706 Semiconductor package |
| 07/11/2013 | DE102013100063A1 LED-Gehäusesubstrat und Verfahren zum Herstellen des LED-Gehäusesubstrates LED package substrate and method for manufacturing the LED package substrate |
| 07/11/2013 | DE102012200327A1 Optoelektronisches Bauelement Optoelectronic component |
| 07/11/2013 | DE102009005915B4 Leistungshalbleitermodul in Druckkontaktausführung Power semiconductor module in pressure contact design |
| 07/10/2013 | EP2613354A1 Multi-cavaties light emitting device |
| 07/10/2013 | EP2613351A1 Semiconductor module |
| 07/10/2013 | EP2613350A1 Semiconductor module |
| 07/10/2013 | EP2612372A2 Light-emitting diode chip |
| 07/10/2013 | EP2612356A2 Ramp-stack chip package with static bends |
| 07/10/2013 | EP2612067A2 Diodes, printable compositions of a liquid or gel suspension of diodes or other two-terminal integrated circuits, and methods of making same |
| 07/10/2013 | CN203055981U A LED projection lamp |
| 07/10/2013 | CN203055973U Light-emitting-surface-shape-customizable semiconductor LED light source |
| 07/10/2013 | CN203055908U Outdoor moisture-proof paster type LED structure |
| 07/10/2013 | CN203055907U Side-emitting LED bracket and side-emitting LED |
| 07/10/2013 | CN203055906U A high-color-purity LED |
| 07/10/2013 | CN203055905U Thyristor radiator of excitation device |
| 07/10/2013 | CN203055904U Power hybrid integrated circuit with high integrated level |
| 07/10/2013 | CN103201898A Electromagnetic resonance coupler |
| 07/10/2013 | CN103201836A Stackable molded microelectronic packages with area array unit connectors |
| 07/10/2013 | CN103201829A Circuit device and method for manufacturing same |
| 07/10/2013 | CN103199176A LED package substrate and method of manufacturing led package |
| 07/10/2013 | CN103199088A Self-heat-dissipation light emitting diode (LED) light source and manufacturing method |
| 07/10/2013 | CN103199087A Light mixing light-emitting diode (LED) lamp panel |
| 07/10/2013 | CN103199071A Stacking type packaging structure and manufacturing method thereof |
| 07/10/2013 | CN103199069A Device including two power semiconductor chips and manufacturing thereof |
| 07/10/2013 | CN103199023A System-level photoelectric structure and manufacturing method thereof |
| 07/10/2013 | CN103198909A Energy recovery type resistance module and resistor |
| 07/10/2013 | CN102347322B Light-emitting element, backlight module device and illuminating device |
| 07/10/2013 | CN102254907B LED (light-emitting diode) and packaging method thereof |
| 07/10/2013 | CN102097427B Laminate electronic device |
| 07/09/2013 | US8482345 Semiconductor device |
| 07/09/2013 | US8482313 Universal digital block interconnection and channel routing |
| 07/09/2013 | US8482246 Customized shading devices including photovoltaic properties |
| 07/09/2013 | US8482133 Semiconductor package |
| 07/09/2013 | US8482120 Combined heat sink multi-configuration processor memory substrate device |
| 07/09/2013 | US8482111 Stackable molded microelectronic packages |
| 07/09/2013 | US8481937 Photocathode apparatus using photoelectric effect of surface plasmon resonance photons |
| 07/09/2013 | US8481367 Method of manufacturing circuit device |