| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 08/01/2013 | WO2013112868A1 Stacked integrated component devices with energization |
| 08/01/2013 | WO2013112691A2 Light-emitting dies incorporating wavelength-conversion materials and related methods |
| 08/01/2013 | WO2013112435A1 Light - emitting devices having discrete phosphor chips and fabrication methods |
| 08/01/2013 | WO2013111276A1 Power semiconductor device |
| 08/01/2013 | WO2013111234A1 Power conversion device |
| 08/01/2013 | WO2013110540A1 Luminaire and method for the production of a luminaire |
| 08/01/2013 | WO2013110179A1 Method and apparatus for connecting memory dies to form a memory system |
| 08/01/2013 | WO2013083528A3 Semiconductor luminaire |
| 08/01/2013 | WO2013052370A3 Stub minimization for multi-die wirebond assemblies with parallel windows |
| 08/01/2013 | US20130194035 Semiconductor device and method of controlling the same |
| 08/01/2013 | US20130193612 Semiconductor device manufacturing method and manufacturing equipment |
| 08/01/2013 | DE102013201363A1 Light emitting component has wall portion located between light emitting elements and protruded from bottom surface through opening, and light emitting elements that are connected by wire to bridge wall portion |
| 08/01/2013 | DE102012201449A1 Flexibles LED-Modul und Verfahren zu dessen Fertigung Flexible LED module and method for its manufacturing |
| 08/01/2013 | DE102012201446A1 LED, has partially transparent layers including inner and outer layers that are serially arranged in optical path of LED and connected with one another, where radiation characteristic of LED is adjusted by outer layer in optical path of LED |
| 08/01/2013 | DE102010014936B4 Gleitschlitten für Peltier-Elemente und dessen Verwendung in einem modular aufgebauten Thermogenerator Sliding carriage for Peltier elements and its use in a modular thermal generator |
| 08/01/2013 | DE102006009955B4 Weiße Lichtquelle und Beleuchtungsvorrichtung, die die weiße Lichtquelle verwendet White light source and illumination device that uses the white light source |
| 07/31/2013 | EP2619809A2 Optoelectronic semiconductor device |
| 07/31/2013 | EP2619795A1 Stacked semiconductor chip device with thermal management |
| 07/31/2013 | EP2619794A1 Semiconductor chip with reinforcing through-silicon-vias |
| 07/31/2013 | EP2619792A1 Multifunction sensor as pop microwave pcb |
| 07/31/2013 | EP2619501A2 Segmented spotlight having narrow beam size and high lumen output |
| 07/31/2013 | CN203104305U Three-phase rectifier bridge module |
| 07/31/2013 | CN203103302U Support plate packaging structure with inductive device |
| 07/31/2013 | CN203103301U Light emitting device and lighting device |
| 07/31/2013 | CN203103300U LED color-changing lamp |
| 07/31/2013 | CN203103299U Highly reliable high-voltage diode for automobile igniter |
| 07/31/2013 | CN203103298U IGBT (Insulated Gate Bipolar Transistor) device with grid protection |
| 07/31/2013 | CN203103287U Flat multichip packaging piece with stamping frame with square groove |
| 07/31/2013 | CN203102764U Mask for LED (light emitting diode) display module and LED device as well as LED display module |
| 07/31/2013 | CN103229408A Electrical power convertor apparatus |
| 07/31/2013 | CN103229297A Circuit device |
| 07/31/2013 | CN103229296A Stackable semiconductor chip with edge features and method of fabricating and processing same |
| 07/31/2013 | CN103229295A Power module |
| 07/31/2013 | CN103228975A Segmented spotlight having narrow beam size and high lumen output |
| 07/31/2013 | CN103227275A Wiring substrate, light emitting device, and manufacturing method of wiring substrate |
| 07/31/2013 | CN103227273A Wiring substrate, light emitting device, and manufacturing method of wiring substrate |
| 07/31/2013 | CN103227272A Wiring substrate, light emitting device, and manufacturing method of wiring substrate |
| 07/31/2013 | CN103227264A A light emitting apparatus |
| 07/31/2013 | CN103227252A Power-saving light emitting diode |
| 07/31/2013 | CN103227170A Stacked type semiconductor structure and manufacturing method thereof |
| 07/31/2013 | CN103227169A Light emitting device |
| 07/31/2013 | CN103227168A LED chip on board (COB) structure compatible with different wavelengths |
| 07/31/2013 | CN103227159A Semiconductor package and mobile device including same |
| 07/31/2013 | CN102354693B Capsulation structure of surface light source including a plurality of reflection cups |
| 07/31/2013 | CN102104037B Luminous device with integrated circuit and manufacturing method thereof |
| 07/31/2013 | CN102017138B Die stacking system and method |
| 07/31/2013 | CN101354755B Semiconductor device and method for manufacturing the same |
| 07/30/2013 | US8497732 Three-dimensional semiconductor integrated circuit |
| 07/30/2013 | US8497704 Methods and structure for source synchronous circuit in a system synchronous platform |
| 07/30/2013 | US8497656 Solar powered umbrella table |
| 07/30/2013 | US8497140 Encapsulant layer for photovoltaic module, photovoltaic module and method for manufacturing regenerated photovoltaic cell and regenerated transparent front face substrate |
| 07/30/2013 | US8496356 High efficiency solid-state light source and methods of use and manufacture |
| 07/25/2013 | WO2013108657A1 Manufacturing method for semiconductor device |
| 07/25/2013 | WO2013108143A1 Semiconductor light emitting device lamp that emits light at large angles |
| 07/25/2013 | WO2013106973A1 Package-on-package semiconductor chip packaging structure and technology |
| 07/25/2013 | US20130189813 Computer readable medium encoded with a program for fabricating a 3d integrated circuit structure |
| 07/25/2013 | US20130187211 Multi-Layer Integrated Circuit Package |
| 07/25/2013 | DE112012000149T5 Interner Verdrahtungsaufbau eines Halbleiterbauelements Internal wiring structure of a semiconductor device |
| 07/25/2013 | DE112011103147T5 Multi-Chip-LED-Vorrichtungen The multi-chip LED devices |
| 07/25/2013 | DE102012200973A1 Leuchte und verfahren zur herstellung einer leuchte Lamp and method of manufacturing a light |
| 07/25/2013 | DE102012101412A1 Optoelectronic semiconductor device for use as flash-unit in e.g. mobile telephone, has two chips arranged downstream of two conversion elements, respectively, where color temperature of light emitted from device is adjustable |
| 07/24/2013 | EP2618482A1 Power amplifier, asymmetric doherty power amplifier device and base station |
| 07/24/2013 | EP2618389A2 Diodes, printable compositions of a liquid or gel suspension of diodes or other two-terminal integrated circuits, and methods of making same |
| 07/24/2013 | EP2618374A2 Semiconductor device with die stack arrangement including staggered die and efficient wire bonding |
| 07/24/2013 | EP2618369A2 Diodes, printable compositions of a liquid or gel suspension of diodes or other two-terminal integrated circuits, and methods of making same |
| 07/24/2013 | EP2617781A2 Diodes, printable compositions of a liquid or gel suspension of diodes or other two-terminal integrated circuits, and methods of making same |
| 07/24/2013 | EP2617057A1 Method for combining leds in a packaging unit and packaging unit having a multiplicity of leds |
| 07/24/2013 | EP2617054A2 Staged via formation from both sides of chip |
| 07/24/2013 | CN203085649U LED illuminating element |
| 07/24/2013 | CN203085648U Cob |
| 07/24/2013 | CN203085530U LED illuminating element |
| 07/24/2013 | CN203085529U Packing structure of transparent composite ceramic substrate |
| 07/24/2013 | CN203085528U Waterproof anticorrosion heat radiation high insulation LED ceramic integrated light source |
| 07/24/2013 | CN203085515U Semiconductor packaging body |
| 07/24/2013 | CN103222053A 电路装置 Circuit device |
| 07/24/2013 | CN103222040A Adhesive composition, method for manufacturing semiconductor device, and semiconductor device |
| 07/24/2013 | CN103221834A Integrated circuit for and method of testing die -o -die bonding |
| 07/24/2013 | CN103219455A Light emitting diode (LED) module and backlight module |
| 07/24/2013 | CN103219374A Semiconductor device and power supply device |
| 07/24/2013 | CN103219334A Flash memory packaging chip |
| 07/24/2013 | CN103219333A Enhancement type Flash chip, encapsulating method and instruction execution method |
| 07/24/2013 | CN103219332A Photoelectric element |
| 07/24/2013 | CN103219331A One-way high voltage (HV) light-emitting diode (LED) chip |
| 07/24/2013 | CN103219330A 半导体器件 Semiconductor devices |
| 07/24/2013 | CN103219329A Light-emitting diode device and manufacturing method thereof |
| 07/24/2013 | CN103219328A 3-d integrated circuit lateral heat dissipation |
| 07/24/2013 | CN103219327A Integrating passive components on spacer in stacked dies |
| 07/24/2013 | CN103219326A Multi-layered semiconductor apparatus |
| 07/24/2013 | CN103219325A Multi-dimensional integrated circuit structures and methods of forming the same |
| 07/24/2013 | CN103219324A Stackable semiconductor chip packaging structure and process thereof |
| 07/24/2013 | CN103219313A 半导体装置 Semiconductor device |
| 07/24/2013 | CN103219308A Multichip module with reroutable inter-die communication |
| 07/24/2013 | CN103219299A Integrated circuit package assembly and method of forming the same |
| 07/24/2013 | CN102347316B Three-dimensional integrated circuit structure |
| 07/24/2013 | CN102157507B White LED integration module packaging structure with adjustable color temperature and color rendering indexes |
| 07/24/2013 | CN102136431B Light emitting diode package and manufacturing method thereof |
| 07/24/2013 | CN101937911B Light-emitting diode packaging structure and backlight module |
| 07/23/2013 | US8493090 Multiplexer-based interconnection network |
| 07/23/2013 | US8493089 Programmable logic circuit using three-dimensional stacking techniques |
| 07/18/2013 | WO2013106173A1 Stackable microelectronic package structures |