Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
08/2013
08/14/2013EP2626896A1 Semiconductor device and method of producing semiconductor device
08/14/2013EP2625927A1 Light-emitting diode module comprising a first component and a second component and method for producing said module
08/14/2013EP2625712A2 Radiant heat circuit board, heat generating device package having the same, and backlight unit
08/14/2013DE112010005855T5 Warmweisslicht-LED-Chip mit großer Helligkeit und hoher Farbwiedergabe Warm White Light LED chip with high brightness and high color rendering
08/14/2013DE102013202212A1 Zweistufig gemoldeter Sensor Two-stage gemoldeter sensor
08/14/2013DE102012223039A1 Surface mount device LED module e.g. electrically EPROM for fastening on circuit board in spotlight or retrofit LED lamp, has metallic layer applied on carrier with high reflection degree, and oxide layer provided over metallic layer
08/14/2013DE102012202102A1 Lighting device has reflecting partition wall which is arranged between volume emitter LED chips which are arranged on common substrate
08/14/2013DE102012201885A1 Electrical power module, has control device and cooling body firmly coupled with each other in heat conductive manner by coupling layer, where coupling layer electrically insulates control device from cooling body
08/14/2013DE102012101160A1 Light source module has shield that is arranged between adjacent semiconductor chips and is opaque to emitted radiation to reduce optical crosstalk between semiconductor chips
08/14/2013DE102012101102A1 Optoelektronisches Halbleiterbauelement und Anordnung mit einer Mehrzahl von derartigen Bauelementen An optoelectronic semiconductor device and assembly having a plurality of such devices
08/14/2013DE102012002605A1 Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils und optoelektronisches Halbleiterbauteil A method for producing an optoelectronic semiconductor component and optoelectronic semiconductor component
08/14/2013CN203135694U IGBT module parallel-connection-output current equalization structure
08/14/2013CN203134865U Six-cup type LED lamp
08/14/2013CN203134856U LED light emitting device
08/14/2013CN203134794U A novel packaging structure used for a LED light source module
08/14/2013CN203134793U Novel LED chip
08/14/2013CN203134792U Combined LED module group
08/14/2013CN203134791U Stack packaging structure of semiconductor
08/14/2013CN203134788U COB packaging structure of photosensitive IC
08/14/2013CN203134777U Diode
08/14/2013CN203131720U High-power ultraviolet light-emitting diode (LED) lamp packaging structure
08/14/2013CN203131514U Efficient light-emitting light emitting diode (LED) light source and LED lamp using same
08/14/2013CN203131498U Light emitting diode (LED) lamp source based on chip on board (COB) substrate
08/14/2013CN103250249A Opto-electronic semiconductor component, method for producing same and use of such a component
08/14/2013CN103250247A Support for an optoelectronic semiconductor chip, and semiconductor chip
08/14/2013CN103250243A Semiconductor device
08/14/2013CN103250242A Semiconductor device and method for manufacturing semiconductor device
08/14/2013CN103247749A Multiple-chip encapsulation structure and manufacturing method thereof
08/14/2013CN103247747A LED (light emitting diode) and manufacturing method thereof
08/14/2013CN103247746A Method and apparatus for light source
08/14/2013CN103247738A Light-emitting module
08/14/2013CN103247613A Enhanced Flash multi-chip packaged chip, and communication method and packaging method thereof
08/14/2013CN103247612A Enhanced FLASH chip and method for encapsulating chip
08/14/2013CN103247611A Enhanced FLASH chip and method for encapsulating chip
08/14/2013CN103247610A Optoelectronic apparatuses and methods for manufacturing optoelectronic apparatuses
08/14/2013CN103247609A Package structure for semiconductor light emitting device
08/14/2013CN103247608A Light source module
08/14/2013CN103247607A Light emitting diode
08/14/2013CN103247590A Semiconductor chip, method for manufacturing a semiconductor chip, device and method for manufacturing a device
08/14/2013CN103247589A Semiconductor packages and methods of manufacturing the same
08/14/2013CN103247582A Semiconductor surge suppressor lead package structure
08/14/2013CN103247544A Package-on-package type semiconductor packages and methods for fabricating the same
08/14/2013CN103246553A Enhanced Flash chip and method for packaging same
08/14/2013CN102437153B Luminescent light source and display panel thereof
08/14/2013CN102201398B Resin sealed semiconductor device and manufacturing method therefor
08/14/2013CN102054787B Stack type package structure and manufacture method thereof
08/14/2013CN102005438B Semiconductor package and method of manufacturing the same
08/14/2013CN101978494B Voltage source converter
08/14/2013CN101261985B Methods of forming packaged semiconductor light emitting devices having multiple optical elements by compression molding
08/13/2013US8508952 Electrical assembly
08/13/2013US8508639 Semiconductor module, MOS type solid-state image pickup device, camera and manufacturing method of camera
08/13/2013US8506147 Light source and vehicle lamp
08/08/2013WO2013116631A1 Light emitting laminate and method of making thereof
08/08/2013WO2013116623A1 Bidirectional light sheet
08/08/2013WO2013116364A1 Link emission control
08/08/2013WO2013115780A1 Hybrid electro-optical package for an opto-electronic engine
08/08/2013WO2013115395A1 Switching element unit
08/08/2013US20130203217 Semiconductor device
08/08/2013US20130200530 Semiconductor Packages Including a Plurality of Stacked Semiconductor Chips
08/08/2013DE102012106660A1 PCB mit einer individuellen refektierenden Struktur und Verfahren zum Herstellen eines LED Pakets, das diese verwendet PCB with an individual refektierenden structure and method for manufacturing an LED package that uses this
08/08/2013DE102012104220A1 Gestapelte Substratstruktur Stacked substrate structure
08/08/2013DE102006059501B4 Halbleitervorrichtung mit Halbleiterelement, Isolationssubstrat und Metallelektrode A semiconductor device having the semiconductor element, insulation substrate and metal electrode
08/07/2013EP2624320A1 Led module
08/07/2013EP2624297A1 Power semiconductor module and method for manufacturing same
08/07/2013EP2624294A1 Circuit board for large-capacity module peripheral circuit and large-capacity module containing peripheral circuit using said circuit board
08/07/2013EP2624290A2 Interposers, electronic modules, and methods for forming the same
08/07/2013EP2624289A2 Interposers, electronic modules, and methods for forming the same
08/07/2013EP1742265B1 Coolant cooled type semiconductor device
08/07/2013CN203118998U Package substrate based on flip chip and LED chip comprising package substrate
08/07/2013CN203118988U Packaging structure of multi-chip high-color-rendering COB
08/07/2013CN203118947U Embedded storage device
08/07/2013CN203118946U Embedded storing device
08/07/2013CN203118945U High-luminous-efficiency light-emitting diode (LED) high-power device packaging structure
08/07/2013CN203118944U Sealing structure of light-emitting diode (LED) lamp
08/07/2013CN203118943U COB lamp source board structure
08/07/2013CN203118942U High voltage silicon stack for microwave equipment
08/07/2013CN203115556U Double-emitting-angle light-emitting diode (LED) lamp
08/07/2013CN103238269A Power conversion device
08/07/2013CN103238213A Tilt bare chip stack body
08/07/2013CN103236491A LED (light emitting diode) ceramic COB (chip on board) light source fluorescent lamp and preparation method thereof
08/07/2013CN103236483A Light emitting diode encapsulation structure and light emitting diode encapsulation method
08/07/2013CN103236428A RPMC-comprising (replay protection monotonic counter-comprising) enhanced flash chip and packaging method thereof
08/07/2013CN103236427A LED with luminous front and rear sides
08/07/2013CN103236426A Equal-directional array type rectifier bridge stack
08/07/2013CN103236425A DRAM (dynamic random access memory) double-chip stacking and packaging structure and packaging technology
08/07/2013CN103236424A Wafer level packaging structure and packaging method
08/07/2013CN103236423A Hybrid lighting white light device
08/07/2013CN103236422A Intelligent power module and manufacturing method thereof
08/07/2013CN102254903B Light emitting diode package, light emitting diode module, and light emitting diode lamp
08/07/2013CN102136508B Solar cell module
08/07/2013CN102034528B System encapsulation integrated circuit for providing input reference voltage thereby
08/07/2013CN102027592B Substrate for power module, power module, and method for producing substrate for power module
08/07/2013CN101988656B White light-emitting diode (LED) backlight source and manufacturing method thereof
08/07/2013CN101872833B LED signal lamp, PCB (Printed Circuit Board) substrate structure thereof and light source assembly
08/07/2013CN101621043B Standing chip scale package
08/06/2013US8504950 Modular array defined by standard cell logic
08/06/2013US8502484 Power stage for driving an electric machine
08/06/2013US8502395 Semiconductor device and a method of manufacturing the same
08/06/2013US8502239 High power allngan based multi-chip light emitting diode
08/06/2013US8502147 Microbolometer detector layer
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