Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
08/2013
08/29/2013DE102012202928A1 Lichtquelle mit led-chip und leuchtstoffschicht Light source having the LED chip and the phosphor layer
08/29/2013DE102012202927A1 Lichtquelle mit led-chip und leuchtstoffschicht Light source having the LED chip and the phosphor layer
08/29/2013DE102012200329B4 Halbleiteranordnung mit einem Heatspreader und Verfahren zur Herstellung einer Halbleiteranordnung A semiconductor device with a heat spreader and method of manufacturing a semiconductor device
08/29/2013DE102012108284A1 Three-dimensional integrated circuit, has switching circuits formed adjacent to one side of substrate, and polygon-shaped silicon plated-through holes extended from former side to another side and arranged at tip of polygon part
08/29/2013DE102009051627B4 Mehrschichtverstärkermodul Multilayer amplifier module
08/29/2013DE102006036798B4 Elektronisches Bauteil und Verfahren zum Herstellen Electronic component and methods for making
08/28/2013EP2631946A1 Semiconductor power module
08/28/2013EP2631945A2 Microelectronic package with terminals on dielectric mass
08/28/2013EP2631944A2 Semiconductor package with integrated electromagnetic shielding
08/28/2013EP2631943A2 System-in-package with integrated protection socket
08/28/2013EP2631942A1 Semiconductor device and production method for same
08/28/2013EP2631895A1 Display unit including a backlighting device
08/28/2013EP2630657A1 Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristics
08/28/2013EP2630656A1 Method of making a multi-chip module having a reduced thickness and related devices
08/28/2013CN203165942U LED chip integration and packaging substrate
08/28/2013CN203165941U LED lamp bead with built-in protection chip
08/28/2013CN203165933U Surface mounted type LED
08/28/2013CN203165896U LED/OLED integrated lighting module
08/28/2013CN203165895U Four-cup type light-emitting diode (LED) lamp
08/28/2013CN203165894U Standardized LED PCB module design and module connection structure
08/28/2013CN203165893U RGB (Red Green Blue) tri-color LED (Light-Emitting Diode) packaging structure
08/28/2013CN203165892U Same directional array type bridge rectifiers
08/28/2013CN203165891U Semiconductor module
08/28/2013CN203165890U Thyristor module of built-in temperature sensor
08/28/2013CN203165889U Igbt module
08/28/2013CN203165888U Silicon chain module
08/28/2013CN203165887U Power device string vertical arrangement mechanical pressing structure
08/28/2013CN203165882U Stacked package structure
08/28/2013CN103270591A Intermediate for electronic component mounting structure, electronic component mounting structure, and method for manufacturing electronic component mounting structure
08/28/2013CN103270590A Power/ground layout for chips
08/28/2013CN103268875A Multi-wafer encapsulating structure
08/28/2013CN102290399B Stacking type chip packaging structure and method
08/28/2013CN102157453B Stack-type package structure and manufacturing method thereof
08/28/2013CN102130266B Packaging structure and light emitting diode packaging structure
08/28/2013CN102067309B Power semiconductor module
08/28/2013CN101958312B Electronic control unit
08/28/2013CN101755336B Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods
08/27/2013US8519493 Semiconductor device having multiple substrates
08/27/2013US8519413 Organic light emitting diode display
08/22/2013WO2013123255A1 Bipolar multistate nonvolatile memory
08/22/2013WO2013123204A1 Integrated circuit package
08/22/2013WO2013052398A3 Stub minimization for assemblies without wirebonds to package substrate
08/22/2013US20130217183 Stacked microfeature devices and associated methods
08/22/2013US20130215569 Integrated circuit chip, mobile device including the same, and method for operating the mobile device
08/22/2013US20130214842 Power system, power module therein and method for fabricating power module
08/22/2013US20130214674 Light-emitting apparatus package, light-emitting apparatus, backlight apparatus, and display apparatus
08/22/2013US20130214431 Fine-Pitch Package-on-Package Structures and Methods for Forming the Same
08/22/2013US20130214401 System and Method for Fine Pitch PoP Structure
08/22/2013DE112006004099B4 Elektronisches Bauelement und Verfahren zu dessen Herstellung An electronic device and method for its production
08/22/2013DE102013101524A1 Leuchtdiodenvorrichtung Light emitting diode device
08/22/2013DE102012222871A1 Leistungsmodul und Klimagerät Power module and air conditioner
08/22/2013DE102012202555A1 Led-anordnung Led arrangement
08/22/2013DE102012202353A1 Leuchtmodul-Leiterplatte Light module circuit board
08/22/2013DE102010000407B4 Halbleiter-Package mit einem aus Metallschichten bestehenden Band und Verfahren zum Herstellen eines derartigen Halbleiter-Package The semiconductor package with a band consisting of metal layers and method for manufacturing such a semiconductor package
08/22/2013DE102008033651B4 Verfahren zur Herstellung eines Leistungshalbleitermoduls Method for producing a power semiconductor module
08/22/2013DE102006060429B4 Elektrisches Bauelement mit Leadframe-Strukturen Electrical component with leadframe structures
08/21/2013EP2629591A1 Light-emitting element mounting package, light-emitting element package, and method of manufacturing the same
08/21/2013EP2629320A2 Mask structure and method for defect-free heteroepitaxial deposition
08/21/2013EP2629002A2 Lighting apparatus
08/21/2013EP2628195A1 Pec biasing technique for leds
08/21/2013EP2381478B1 Method of manufacturing an integrated circuit device
08/21/2013CN203150616U LED light source COB packaging structure
08/21/2013CN203150601U LED (light emitting diode)
08/21/2013CN203150544U A (n-x)th generation DRAM developed on the basis on an nth generation DRAM
08/21/2013CN203150543U Igbt module
08/21/2013CN203150542U Wick plate
08/21/2013CN203150541U LED light source based on COB packaging
08/21/2013CN203150540U Light emitting diode packaging structure
08/21/2013CN103262269A Water resistant led devices and led display including the same
08/21/2013CN103262239A Semiconductor device with stacked power converter
08/21/2013CN103262238A Circuit device
08/21/2013CN103262237A Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristic
08/21/2013CN103258821A Enhancement type Flash chip with hard reset function and chip encapsulating method
08/21/2013CN103258820A Reinforced SPI port Flash chip and chip packing method
08/21/2013CN103258819A LED multi-cup integrated COB package implementation method
08/21/2013CN103258818A System and method for fine pitch POP structure
08/21/2013CN102456677B Packaging structure for ball grid array and manufacturing method for same
08/21/2013CN102427075B LED apparatus and field sequential display
08/21/2013CN102272924B Radiation substrate for power LED and power LED product and manufacturing method thereof
08/21/2013CN102163596B Integrated circuit device and its forming method
08/21/2013CN102067310B Stacking of wafer-level chip scale packages having edge contacts and manufacture method thereof
08/21/2013CN101958291B Electronic control unit
08/21/2013CN101447441B Integrated circuit package system including die having relieved active region
08/20/2013US8514013 Integrated circuit device having a plurality of integrated circuit chips and an interposer
08/20/2013US8513978 Power routing in standard cell designs
08/20/2013US8513977 Data holding circuit
08/20/2013US8513058 Semiconductor device and method for producing the same
08/20/2013US8511855 Configuration of multiple LED module
08/15/2013WO2013119309A1 Stacked die assembly with multiple interposers
08/15/2013WO2013118076A1 Low cost encapsulated light-emitting device
08/15/2013WO2013117760A1 Light emitting diode chip
08/15/2013WO2013117648A1 An led light source and an illuminating device comprising the led light source
08/15/2013WO2013052466A3 Stub minimization for multi-die wirebond assemblies with orthogonal windows
08/15/2013WO2013052441A3 Stub minimization for wirebond stacked assemblies without windows
08/15/2013US20130207249 Assembly having stacked die mounted on substrate
08/15/2013US20130207246 Packaging an Integrated Circuit Die
08/15/2013US20130207137 COB-Typed LED Light Board
08/15/2013US20130207065 Bipolar multistate nonvolatile memory
08/14/2013EP2626901A1 Semiconductor light emitting apparatus, image displaying apparatus, mobile terminal, head-up display apparatus, image projector, head-mounted display apparatus, and image forming apparatus
08/14/2013EP2626900A2 Solid-state light emitting device
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