| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 09/12/2013 | WO2013043599A3 Pv conduit solar wire management system |
| 09/12/2013 | US20130234340 Vertically stackable dies having chip identifier structures |
| 09/12/2013 | US20130234317 Packaging Methods and Packaged Semiconductor Devices |
| 09/12/2013 | US20130234257 Package configurations for low emi circuits |
| 09/12/2013 | DE202010018033U1 Lichtsystem mit erhöhter Effizienz Light system with increased efficiency |
| 09/12/2013 | DE102013203919A1 Halbleitergehäuse und Verfahren zu ihrer Herstellung Semiconductor packages and methods for their preparation |
| 09/11/2013 | EP2637224A2 Light Emitting Device, And Illumination Apparatus And System Using Same |
| 09/11/2013 | EP2637206A2 Lighting device |
| 09/11/2013 | EP2637205A1 Semiconductor device and manufacturing method of same |
| 09/11/2013 | EP2635841A2 Lighting device with multiple emitters and remote lumiphor |
| 09/11/2013 | EP2492957B1 Switching assembly |
| 09/11/2013 | CN203192862U Bidirectional semiconductor cold-hot chip |
| 09/11/2013 | CN203192854U 发光二极管模块及照明装置 Light-emitting diode module and illumination device |
| 09/11/2013 | CN203192850U LED minute surface light source body |
| 09/11/2013 | CN203192797U Light-emitting device and lighting device |
| 09/11/2013 | CN203192796U 发光二极管装置 Light-emitting diode device |
| 09/11/2013 | CN203192795U Full-color surface mounted element and support |
| 09/11/2013 | CN203192794U Light source module |
| 09/11/2013 | CN203192793U Multi-way valve-driving VMOS mixed membrane integrated chip |
| 09/11/2013 | CN103299501A Arc fault mitigation for photovoltaic systems |
| 09/11/2013 | CN103299422A Remote phosphor LED device with broadband output and controllable color |
| 09/11/2013 | CN103299421A Semiconductor device and method for producing a semiconductor device |
| 09/11/2013 | CN103299420A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 09/11/2013 | CN103299410A Electronic component module and electronic component element |
| 09/11/2013 | CN103299408A Manufacturing method for electronic component module, and electronic component module |
| 09/11/2013 | CN103296866A Semiconductor module with switching elements |
| 09/11/2013 | CN103296177A Light-emitting device, lighting device, light-emitting device assembly and method for manufacturing light-emitting device |
| 09/11/2013 | CN103296175A LED light source module capable of emitting light at all beam angles |
| 09/11/2013 | CN103296019A Semiconductor device and method for manufacturing semiconductor device |
| 09/11/2013 | CN103296018A Optoelectronic apparatuses with post-molded reflector cups and methods for manufacturing the same |
| 09/11/2013 | CN103296017A Light-emitting device |
| 09/11/2013 | CN103296016A 半导体模块 Semiconductor Modules |
| 09/11/2013 | CN103296015A Die stacking system and method |
| 09/11/2013 | CN103296014A Fan-out wafer level semiconductor chip three-dimensional stacking packaging structure and technology |
| 09/11/2013 | CN103295988A System-in-package with integrated socket |
| 09/11/2013 | CN103295920A Noninsulated type power module and packaging process thereof |
| 09/11/2013 | CN102291003B Intelligent power module for three-phase bridge type drive |
| 09/11/2013 | CN102208865B Bridge-driven IPM (intelligent power module) circuit for three-phase electric machine |
| 09/11/2013 | CN102054821B Packaging structure with internal shield and manufacturing method thereof |
| 09/11/2013 | CN101958314B Manufacture method and usage of folded system-in-package |
| 09/11/2013 | CN101677096B 半导体器件 Semiconductor devices |
| 09/10/2013 | US8533639 Optical proximity correction for active region design layout |
| 09/10/2013 | US8531019 Heat dissipation methods and structures for semiconductor device |
| 09/10/2013 | US8530278 Semiconductor device and a manufacturing method of the same |
| 09/06/2013 | WO2013128205A1 Circuit board assembly |
| 09/06/2013 | WO2012101488A9 Led package comprising encapsulation |
| 09/05/2013 | DE102013102062A1 Weißlichtemitter mit einer verkapselten Leuchtstofffolie und Verfahren zum Herstellen desselben White light emitter thereof with an encapsulated phosphor sheet and methods for making |
| 09/05/2013 | DE102012203281A1 Switching arrangement, has resilient positioning elements provided away from lower part of two-part housing of driver device, and fixing electronic printed circuit board on support elements of lower part by resilient force |
| 09/05/2013 | DE102012101818A1 Optoelektronisches Modul und Verfahren zur Herstellung eines optoelektronischen Moduls An opto-electronic module and method for producing an optoelectronic module |
| 09/04/2013 | EP2634805A1 Light-emitting device assembly and lighting device |
| 09/04/2013 | EP2634804A1 Semiconductor device |
| 09/04/2013 | EP2634803A1 Wirelessly communicating among vertically arranged integrated circuits (ICs) in a semiconductor package |
| 09/04/2013 | EP2634802A1 Single package imaging and inertial navigation sensors, and methods of manufacturing the same |
| 09/04/2013 | EP2634796A2 Semiconductor device and manufacturing method thereof |
| 09/04/2013 | EP2633554A1 Laminate support film for fabrication of light emitting devices and method its fabrication |
| 09/04/2013 | CN203179953U Integrated large power LED device |
| 09/04/2013 | CN203179883U Circuit packaging structure |
| 09/04/2013 | CN203179882U LED lamp |
| 09/04/2013 | CN203179881U Base, LED bracket and LED |
| 09/04/2013 | CN203179880U LED tube |
| 09/04/2013 | CN203179879U Led封装 Led package |
| 09/04/2013 | CN203179878U Self-adhesive diode module |
| 09/04/2013 | CN203176832U 光源装置 The light source device |
| 09/04/2013 | CN103283304A Light-emitting diode module comprising a first component and a second component and method for producing said module |
| 09/04/2013 | CN103283139A 半导体装置 Semiconductor device |
| 09/04/2013 | CN103283047A Phosphor reflector assembly for remote phosphor led device |
| 09/04/2013 | CN103283023A Integrated digital-and radio-frequency system-on-chip devices with integral passive devices in package substrates, and methods of making same |
| 09/04/2013 | CN103283022A Insulating structure for power module and power conversion device using power module |
| 09/04/2013 | CN103283021A Led arrangement for generating white light |
| 09/04/2013 | CN103283020A Optimized semiconductor packaging in a three-dimensional stack |
| 09/04/2013 | CN103283019A Semiconductor device |
| 09/04/2013 | CN103280950A Intelligent power module for three-phase bridge type driving |
| 09/04/2013 | CN103280949A Intelligent power module for three-phase bridge type drive |
| 09/04/2013 | CN103280510A LED (light-emitting diode) packaging structure and packaging method thereof |
| 09/04/2013 | CN103280506A Artificial blue and violet light type photosynthetic light-conversion glass plane light source |
| 09/04/2013 | CN103280444A Packaging chip, synchronizing method and packaging method for chips of enhanced Flash |
| 09/04/2013 | CN103280443A Multi-primary-color combined COB and manufacturing method thereof |
| 09/04/2013 | CN103277761A Method for manufacturing LED light source G4 light |
| 09/04/2013 | CN103277759A Mains supply power-supplying LED integrated light source |
| 09/04/2013 | CN102110676B Semiconductor device and dc-to-dc converter |
| 09/04/2013 | CN102064161B Optimized power package structure of intelligent power module |
| 09/04/2013 | CN102034798B Packaging structure and packaging process |
| 09/04/2013 | CN101978493B Semiconductor assembly having reduced thermal spreading resistance and methods of making same |
| 09/04/2013 | CN101834244B Light emitting device, light emitting device package and lighting system including the same |
| 09/03/2013 | US8526671 Threat detection sensor |
| 09/03/2013 | US8525552 Semiconductor integrated circuit device having a plurality of standard cells for leakage current suppression |
| 09/03/2013 | US8525551 Semiconductor device |
| 09/03/2013 | US8525546 Majority dominant power scheme for repeated structures and structures thereof |
| 09/03/2013 | US8525317 Integrated chip package having intermediate substrate with capacitor |
| 09/03/2013 | US8524534 Semiconductor device and manufacturing method thereof |
| 08/29/2013 | WO2013126679A1 Semiconductor power modules and devices |
| 08/29/2013 | WO2013126269A1 Method for package-on-package assembly with wire bonds to encapsulation surface |
| 08/29/2013 | WO2013087101A8 Substrate-supported circuit parts with free-standing three-dimensional structures |
| 08/29/2013 | WO2013045364A3 Layered composite of a substrate film and of a layer assembly comprising a sinterable layer made of at least one metal powder and a solder layer |
| 08/29/2013 | WO2012154665A3 Lighting devices having remote lumiphors that are excited by lumiphor-converted semiconductor excitation sources |
| 08/29/2013 | US20130226334 Multiple-points measurement |
| 08/29/2013 | US20130222401 Semiconductor package, and information processing apparatus and storage device including the semiconductor packages |
| 08/29/2013 | US20130221470 Multi-chip package for imaging systems |
| 08/29/2013 | DE112011103941T5 Halbleitervorrichtung Semiconductor device |
| 08/29/2013 | DE102013101857A1 Halbleitermodul mit Schaltelementen A semiconductor module with switching elements |