Patents
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
09/2013
09/26/2013US20130250529 Pulse signal output circuit and shift register
09/26/2013US20130248900 Light-emitting device having light-emitting elements
09/26/2013US20130248895 Light emitting device
09/26/2013DE102012218304A1 Leistungshalbleitervorrichtungsmodul Power semiconductor device module
09/26/2013DE102012204489A1 Component e.g. valve component, for e.g. electromechanical transmission of motor car, has contact element whose portion with reduced cross-section is formed as shaft and extends from central region of head up to support structure
09/26/2013DE102012204408A1 LED chip e.g. indium gallium aluminum phosphide chip, for use as thin film surface radiator chip in LED module of LED retrofit lamp, has filter applied on chip, where transmittance of filter partially increases with increasing wavelength
09/26/2013DE102009057146B4 Druckkontaktiertes Leistungshalbleitermodul mit Hybriddruckspeicher Pressure-contacted power semiconductor module with hybrid accumulator
09/25/2013EP2642535A2 Semiconductor light emitting device and method for manufacturing the same
09/25/2013EP2642521A2 Light emitting device
09/25/2013EP2642519A2 Phosphor composition for a luminaire
09/25/2013EP2642518A2 Semiconductor light emitting device and method for manufacturing same
09/25/2013EP2642517A1 Semiconductor device
09/25/2013EP2641270A1 Multichip module for communications
09/25/2013CN203218329U Novel waterproof SMD (surface mounted device) LED
09/25/2013CN203218327U Paster type LED (Light-Emitting Diode) structure with black frame
09/25/2013CN203218261U All-angle light-emitting assembly having characteristic of excellent heat dissipation
09/25/2013CN203218260U Double-chip light emitting diode
09/25/2013CN203218259U Ultra-fast recovery high-voltage diode
09/25/2013CN203218251U Novel 48-pinned packaging structure for power management chip
09/25/2013CN103329267A Semiconductor device and method of manufacturing thereof
09/25/2013CN103329266A Stacked microelectronic assembly having interposer connecting active chips
09/25/2013CN103329264A Microelectronic assembly with plural stacked active chips having through - silicon vias formed in stages
09/25/2013CN103325924A LED lamp with large visual angle and smooth pictures
09/25/2013CN103325779A Methods of making microelectronic packages
09/25/2013CN103325778A Light-emitting device and lighting appliance
09/25/2013CN103325777A Light source device, method of driving the same, and optical tomography imaging apparatus
09/25/2013CN103325776A 发光装置 Light-emitting device
09/25/2013CN103325775A Two-direction three-end solid discharge tube
09/25/2013CN103325774A Power semiconductor device
09/25/2013CN103325773A Packing structure for integrated circuit
09/25/2013CN103325764A Support mounted electrically interconnected die assembly
09/25/2013CN103325752A Circuit package, electronic circuit package, and method for encapsulating an electronic circuit
09/25/2013CN103323916A High frequency transmission module and optical fiber connector
09/25/2013CN103322525A LED (light-emitting diode) lamp and filament thereof
09/25/2013CN103322453A Light-emitting diode (LED) light source module capable of emitting light evenly in full space
09/25/2013CN102210199B Electric circuit apparatus
09/25/2013CN102165588B Optoelectronic module having a carrier substrate and a plurality of radiation-emitting semiconductor components and method for the production thereof
09/25/2013CN102088016B Semiconductor voltage-stabilizing and rectifying integrated device
09/25/2013CN102052624B Dimmer lighting assembly and manufacturing method thereof
09/25/2013CN102027590B High frequency storing case and high frequency module
09/24/2013US8543956 Semiconductor integrated circuit and pattern layouting method for the same
09/24/2013US8543635 Digital signal processing block with preadder stage
09/24/2013US8543069 Systems, methods and apparatus for auxiliary ethernet port for wireless portable X-ray detector
09/24/2013US8542034 Semiconductor device
09/24/2013US8541887 Layered chip package and method of manufacturing same
09/19/2013WO2013138139A1 Packages and methods for packaging
09/19/2013WO2013136896A1 Semiconductor device and method for manufacturing same
09/19/2013WO2013136895A1 Semiconductor device
09/19/2013WO2013136388A1 Semiconductor device
09/19/2013WO2013136382A1 Semiconductor device
09/19/2013US20130241634 Rf calibration through-chip inductive coupling
09/19/2013US20130241081 Combination for composite layered chip package
09/19/2013DE112011104406T5 Halbleitervorrichtung Semiconductor device
09/19/2013DE102013204344A1 Halbleitervorrichtung und Verfahren zum Herstellen selbiger A semiconductor device and method of manufacturing Selbiger
09/19/2013DE102012204296A1 Electronic component, has power module and logic module electrically and mechanically connected with one another, and power module protruding power terminal and contact region from molding component
09/19/2013DE102012203891A1 Strahlungsquelleneinheit Radiation source unit
09/19/2013DE102012102122A1 Flächenlichtquelle Surface light source
09/19/2013DE102009024371B4 Verfahren zur Herstellung einer Stromrichteranordnung mit Kühleinrichtung und Stromrichteranordnung Process for the preparation of a converter arrangement with cooling device and power converter arrangement
09/18/2013EP2639832A2 Group III-V and group IV composite diode
09/18/2013EP2639831A2 Light emitting diode package
09/18/2013EP2639830A2 Spectral light distribution for a light emitting device, and illumination apparatus and luminaire using same
09/18/2013EP2639829A2 Group III-V and Group IV Composite Switch
09/18/2013EP2639828A2 Circuit support assembly
09/18/2013EP2638572A2 Compact diode/thyristor rectifier architecture allowing high power
09/18/2013EP2223300B1 Data storage and stackable configurations
09/18/2013CN203205419U Unidirectional HV LED chip
09/18/2013CN203205418U LED with front and back sides shining
09/18/2013CN203205417U Iron sealing common-anode diode power device with aluminum cooling fin
09/18/2013CN203205416U Integrated packaged LED light source component
09/18/2013CN203205408U Power integrated module
09/18/2013CN203205406U System-level packaging piece with integrated insertion slot
09/18/2013CN103314649A Method of transferring and electrically joining high density multilevel thin film to circuitized and flexible organic substrate and associated devices
09/18/2013CN103314437A Power semiconductor module and power unit device
09/18/2013CN103311345A Photovoltaic junction box and photovoltaic components
09/18/2013CN103311234A Light emitting diode package
09/18/2013CN103311233A Light emitting diode packaging structure
09/18/2013CN103311232A Integrated multilayer lighting device
09/18/2013CN103311231A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
09/18/2013CN103311230A Chip stack structure and method for fabricating the same
09/18/2013CN103311213A Semiconductor packaging member integrating shielding film and antenna
09/18/2013CN103311196A High-density integrated micro-nano photoelectron chip radiator based on thermoelectric cooler
09/18/2013CN103311194A Electrical power circuit assembly
09/18/2013CN102214622B 功率半导体模块 Power semiconductor module
09/18/2013CN102064159B Multi-module packaged component
09/18/2013CN102057488B Method for manufacturing semiconductor device
09/18/2013CN102017141B Surface-mounted LED module and method for producing a surface-mounted LED module
09/18/2013CN101771019B Dies, stacked structures, and systems
09/18/2013CN101707197B Omnibearing luminous LED device
09/18/2013CN101414586B Package for a power semiconductor device and package method
09/12/2013WO2013134719A1 Led array for replacing flourescent tubes
09/12/2013WO2013134237A1 Three-dimensional integrated circuit which incorporates a glass interposer and method for fabricating the same
09/12/2013WO2013133961A1 Color mixing using the reflective properties of oleds
09/12/2013WO2013133134A1 Semiconductor device and method of manufacture thereof
09/12/2013WO2013133015A1 Method and apparatus for manufacturing semiconductor device
09/12/2013WO2013132815A1 Module with embedded electronic components, electronic device, and method for manufacturing module with embedded electronic components
09/12/2013WO2013132644A1 Semiconductor module
09/12/2013WO2013132569A1 Semiconductor device
09/12/2013WO2013132389A1 Lighting module and method of manufacturing a lighting module
09/12/2013WO2013131765A1 Look-up table architecture
09/12/2013WO2013131718A1 Look-up table
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