Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
10/2013
10/16/2013CN101425508B 芯片堆叠封装 Chip Stacking
10/15/2013US8558608 Poly silicon resistor, reference voltage circuit comprising the same, and manufacturing method of poly silicon resistor
10/15/2013US8558393 Semiconductor device
10/15/2013US8558369 Integrated circuit packaging system with interconnects and method of manufacture thereof
10/15/2013US8555495 Method for packaging circuits
10/10/2013WO2013151508A1 Reflowable opto-electronic module
10/10/2013WO2013151411A1 Light emitting diode components and methods for emitting a desired light beam pattern
10/10/2013WO2013150890A1 Semiconductor device
10/10/2013WO2013150772A1 Power converter
10/10/2013WO2013150470A1 White light emitting module
10/10/2013WO2013149772A1 Light-emitting semiconductor component and method for producing a light-emitting semiconductor component
10/10/2013US20130264722 Multilayered semiconductor device, printed circuit board, and method of manufacturing multilayered semiconductor device
10/10/2013DE112011103926T5 Halbleitervorrichtung und Verfahren zum Herstellen einer Halbleitervorrichtung A semiconductor device and method of manufacturing a semiconductor device
10/10/2013DE10245933B4 Einrichtung zur Erzeugung eines gebündelten Lichtstroms Means for generating a bundled light flux
10/10/2013DE102013103351A1 Elektronikmodul Electronics module
10/10/2013DE102013103119A1 Pcb-basierter fensterrahmen für hf-leistungspackage Pcb-based window frame for hf-performance package
10/10/2013DE102012205571A1 Beleuchtungsvorrichtung Lighting device
10/10/2013DE102012204408B4 Led-chip mit temperaturabhängiger wellenlänge und leuchtvorrichtung mit solchem led-chip Led chip with temperature-dependent wavelength and light device with such led chip
10/09/2013EP2648219A2 Light-emitting device
10/09/2013EP2648215A2 Method and apparatus providing integrated circuit system with interconnected stacked device wafers
10/09/2013EP2647047A1 Semiconductor device with stacked power converter
10/09/2013EP2647046A1 Stacked microelectronic assembly having interposer connecting active chips
10/09/2013EP2647044A1 Microelectronic assembly with plural stacked active chips having through - silicon vias formed in stages
10/09/2013EP2395550B1 Method for recognising and evaluating shadowing
10/09/2013CN203233352U EPS DC motor drive circuit module
10/09/2013CN203232869U A LED display module with high contrast
10/09/2013CN203232868U 智能功率模块 Intelligent Power Module
10/09/2013CN103348469A Three-dimensional power supply module having reduced switch node ringing
10/09/2013CN103348468A Semiconductor module and semiconductor module manufacturing method
10/09/2013CN103348467A 半导体装置 Semiconductor device
10/09/2013CN103346241A Packaging structure of white LED lamp
10/09/2013CN103346238A Surface mounting type LED support, LED device and LED display screen
10/09/2013CN103346154A Quantum dot light-emitting diode and preparation method thereof, and display device
10/09/2013CN103346153A White LED light-emitting device with adjustable colors
10/09/2013CN103346152A Adjustable 380-780nm wavelength COB packing technique
10/09/2013CN103346151A Packaging structure of combined LED lamp bead
10/09/2013CN103346150A Eight-layer stackable chip encapsulation structure and manufacturing process thereof
10/09/2013CN103346134A Coaxial through-chip connection
10/09/2013CN102361027B Semiconductor detector and manufacture method thereof
10/08/2013US8552551 Adhesive/spacer island structure for stacking over wire bonded die
10/08/2013US8552545 Manufacturing method for semiconductor device, semiconductor device and semiconductor chip
10/03/2013WO2013148925A1 Die stacking with coupled electrical interconnects to align proximity interconnects
10/03/2013WO2013148102A1 Conduction cooling of multi-channel flip chip based panel array circuits
10/03/2013WO2013146212A1 Semiconductor device, and method for manufacturing semiconductor device
10/03/2013WO2013145918A1 Power semiconductor module and power conversion device using same
10/03/2013WO2013145881A1 Power semiconductor module
10/03/2013WO2013145620A1 Semiconductor device
10/03/2013WO2013145619A1 Semiconductor device and method for manufacturing semiconductor device
10/03/2013WO2013145555A1 Integrated device
10/03/2013WO2013145471A1 Method for manufacturing power module, and power module
10/03/2013WO2013144927A1 Optical cavity including a light emitting device and wavelength converting material
10/03/2013WO2013144858A1 Pre-rotated overmolded bidirectional spreading lens for stretched leadframe architecture
10/03/2013WO2013144798A1 Optical cavity including a light emitting device and wavelength converting material
10/03/2013US20130257527 Providing Voltage Isolation On A Single Semiconductor Die
10/03/2013US20130257481 Tree based adaptive die enumeration
10/03/2013US20130257379 Semiconductor device for battery control and battery pack
10/03/2013US20130256918 Device
10/03/2013US20130256915 Packaging substrate, semiconductor package and fabrication method thereof
10/03/2013US20130256914 Package on package structures and methods for forming the same
10/03/2013US20130256908 Inter-die connection within an integrated circuit formed of a stack of circuit dies
10/03/2013US20130256857 Semiconductor Packages and Methods of Formation Thereof
10/03/2013US20130256852 Stacked Semiconductor Package
10/03/2013US20130256807 Integrated Dual Power Converter Package Having Internal Driver IC
10/02/2013EP2645418A2 Light emitting module and lighting system
10/02/2013EP2645417A1 Semiconductor module
10/02/2013EP2645416A1 Stacked module
10/02/2013EP2643852A1 Led module with common color conversion material for at least two led chips
10/02/2013EP1333502B1 Surface-mount package for an optical sensing device
10/02/2013DE112010006032T5 Leistungsmodul Power module
10/02/2013DE102013103132A1 Eine Chipanordnung, ein Verfahren zum Bilden einer Chipanordnung, ein Chipgehäuse, ein Verfahren zum Bilden eines Chipgehäuses A chip arrangement, a method of forming a die assembly, a die package, a method of forming a chip package
10/02/2013DE102013103085A1 Mehrfachchip-Leistungshalbleiterbauteil Multi-chip power semiconductor component
10/02/2013DE102013103011A1 Eine Chipanordnung und ein Verfahren zum Bilden einer Chipanordnung A chip assembly and a method for forming a chip assembly
10/02/2013DE102013102973A1 Halbleiterpackages und Verfahren zu deren Ausbildung Semiconductor packages and methods of training
10/02/2013DE102013005364A1 Electronic module for motor car, has recess that is provided in a direction perpendicular to main extension plane of printed circuit board provided with integrated circuit
10/02/2013DE102012205381A1 LED-Leuchtvorrichtung mit minzefarbenen und bernsteinfarbenen Leuchtdioden LED lighting device with mint colored and amber LEDs
10/02/2013DE102012205240A1 Method for manufacturing substrate for power semiconductor component e.g. MOSFET for power converter, involves arranging electroplating ridges in recesses formed in bottom metallization layer of insulating material portion
10/02/2013DE102012205209A1 Method for determination of temperature gradient of switch of power semiconductor switch module of power converter, involves determining temperature function, and determining gradient of switch by Fourier inverse transformation of function
10/02/2013CN203225275U LED packaging structure
10/02/2013CN203225271U Efficient solar cell panel
10/02/2013CN103339725A Compliant interconnects in wafers
10/02/2013CN103339724A 功率半导体模块 Power semiconductor module
10/02/2013CN103337579A Glass ceramic transparent base plate double-face stereo luminescent LED packaging
10/02/2013CN103337496A LED integration package structure based on two-sided silicon substrate and production method of structure
10/02/2013CN103337495A Color temperature adjustable white-light LED
10/02/2013CN102169879B Highly integrated wafer fan-out packaging structure
10/02/2013CN101740415B Integrated circuit structure and method of forming same
10/01/2013US8547701 Electronics module and method for manufacturing the same
10/01/2013US8547137 Integrated circuit device and data transmission system
10/01/2013US8546954 Stacked semiconductor package having electrical connections or varying heights between substrates, and semiconductor device including the stacked semiconductor package
09/2013
09/26/2013WO2013141154A1 Semiconductor module having heat dissipating fin
09/26/2013WO2013141091A1 Laminated semiconductor apparatus and method for manufacturing same
09/26/2013WO2013140928A1 Semiconductor device
09/26/2013WO2013140704A1 Power conversion apparatus
09/26/2013WO2013140663A1 Semiconductor module and method for manufacturing same
09/26/2013WO2013140654A1 Semiconductor module
09/26/2013WO2013139373A1 Switch module and associated method
09/26/2013US20130252378 3D Semiconductor Package Interposer with Die Cavity
09/26/2013US20130252377 Process For Fabricating Multi-Die Semiconductor Package With One Or More Embedded Die Pads
09/26/2013US20130252376 Forming die backside coating structures with coreless packages
09/26/2013US20130251494 Wh (wafer-holder) process
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