Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
10/2013
10/24/2013DE102012206447A1 Led-modul Led module
10/24/2013DE102012007727A1 Solid-state LED lamp assembly used in street lighting, has crossbar that is projected beyond side face of respective solid state LED and is partially connected with side face of solid state LED
10/23/2013EP2654075A2 Method for permanently connecting two metal surfaces
10/23/2013EP2654074A2 Method for permanently connecting two metal surfaces
10/23/2013EP2652786A2 Apparatus and method for hybrid photovoltaic device having multiple, stacked, heterogeneous, semiconductor junctions
10/23/2013EP2652785A1 Support for an optoelectronic semiconductor chip, and semiconductor chip
10/23/2013EP2652783A1 Enhanced stacked microelectronic assemblies with central contacts
10/23/2013CN203250779U Light emitting diode packaging structure
10/23/2013CN203250737U LED area source
10/23/2013CN103370788A Semiconductor device and method for manufacturing same
10/23/2013CN103370787A Power semiconductor module, power semiconductor module manufacturing method, and power conversion apparatus
10/23/2013CN103370786A 功率半导体模块 Power semiconductor module
10/23/2013CN103370785A Enhanced stacked microelectronic assemblies with central contacts
10/23/2013CN103370784A Simultaneous wafer bonding and interconnect joining
10/23/2013CN103370783A Void-free wafer bonding using channels
10/23/2013CN103370779A Carrier substrate and method for producing semiconductor chips
10/23/2013CN103369873A Packaging structure and redistribution layer substrate and formation method thereof
10/23/2013CN103367622A Full-angle luminous LED (light emitting diode) support frame as well as LED lamp post comprising support frame and preparation method of LED lamp post
10/23/2013CN103367607A Method for packaging LED light source
10/23/2013CN103367601A Semiconductor board, semiconductor device and producing method of semiconductor device
10/23/2013CN103367600A Light emitting lamp
10/23/2013CN103367397A Semiconductor substrate, semiconductor chip having same, and stacked semiconductor package
10/23/2013CN103367351A LED module multilayer stacking structure based on silicon substrate and manufacturing method
10/23/2013CN103367350A Electronic module
10/23/2013CN103367349A Stacked module
10/23/2013CN103367348A Method and apparatus providing integrated circuit system with interconnected stacked device wafers
10/23/2013CN103367347A Light emitting diode packaging construction and lamps
10/23/2013CN103367346A Novel high-power LED light source and implementation method thereof
10/23/2013CN103367345A Light-emitting device
10/23/2013CN103367344A Connecting plate sheet material, light emitting diode encapsulation product and light emitting diode light bar
10/23/2013CN103367343A Light-emitting module
10/23/2013CN103367342A Stacked and combined light emitting diode
10/23/2013CN103367341A IGBT (Insulated Gate Bipolar Translator) lining plate structure
10/23/2013CN103367340A 窗式球栅阵列封装结构 Window ball grid array package
10/23/2013CN103367339A Chip-packaging method and chip-packaging structure
10/23/2013CN103367338A Chip arrangement, a method for forming a chip arrangement, a chip package and a method for forming a chip package
10/23/2013CN103367305A Electric connection structure of IGBT (Insulated Gate Bipolar Transistor) device
10/23/2013CN103367303A High-power IGBT (Insulated Gate Bipolar Transistor) module with integrated gate pole resistor layout
10/23/2013CN103367282A Semiconductor chip and packaging structure and formation method of packaging structure
10/23/2013CN103367272A 半导体模块 Semiconductor Modules
10/23/2013CN103367269A Separation mixed substrate for radio frequency application
10/23/2013CN103367265A Multilayered semiconductor device, printed circuit board, and method of manufacturing multilayered semiconductor device
10/23/2013CN103367176A Manufacturing method for semiconductor device
10/23/2013CN103366798A DRAM (Dynamic Random Access Memory) and production method as well as semiconductor packaging component and packaging method
10/23/2013CN103363363A Light-emitting diode light bar
10/23/2013CN102130104B Light emitting device and method of manufacture
10/23/2013CN102005448B Light emitting device
10/23/2013CN101930957B Power semiconductor device package and fabrication method
10/23/2013CN101630681B Power device having single-chip integrated RC buffer
10/23/2013CN101414600B Cooling mechanism for stacked die package, and method of manufacturing stacked die package containing same
10/22/2013US8564702 Solid-state imaging apparatus and camera using the same
10/22/2013US8563850 Tandem photovoltaic cell and method using three glass substrate configuration
10/22/2013US8563427 Semiconductor chip with conductive diffusion regions, method for manufacturing the same, and stack package using the same
10/17/2013WO2013154909A1 Translators coupleable to opposing surfaces of microelectronic substrates for testing, and associated systems and methods
10/17/2013WO2013153920A1 Semiconductor device
10/17/2013WO2013153742A1 Semiconductor device
10/17/2013WO2013153717A1 Electronic apparatus and method for manufacturing same
10/17/2013WO2013153172A1 Optoelectronic semiconductor component
10/17/2013WO2013052321A3 Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate
10/17/2013US20130273693 Off-chip vias in stacked chips
10/17/2013US20130271208 Group iii-n transistors for system on chip (soc) architecture integrating power management and radio frequency circuits
10/17/2013US20130270718 Printed circuit board having embedded dies and method of forming same
10/17/2013US20130270682 Methods and Apparatus for Package on Package Devices with Reversed Stud Bump Through Via Interconnections
10/17/2013DE102013103301A1 Electronic package-on-package device for manufacturing semiconductor assembly utilized for manufacturing electronic components, has seal layers arranged between substrates, and solder connection for providing coupling between substrates
10/17/2013DE102012224355A1 Leistungsmodul Power module
10/17/2013DE102012206271A1 Flüssigkeitsgekühlte Anordnung mit anreihbaren Leistungshalbleitermodulen und mindestens einer Kondensatoreinrichtung und Leistungshalbleitermodul hierzu Liquid-cooled arrangement with attachable power semiconductor modules and at least one capacitor device and power semiconductor module for this purpose
10/17/2013DE102012206264A1 Anreihbares flüssigkeitsgekühltes Leistungshalbleitermodul und Anordnung hiermit Alignable liquid-cooled power semiconductor module and assembly hereby
10/17/2013DE102012206077A1 Led-modul mit schutzfolie Led module with protection film
10/17/2013DE102012103198A1 Carrier device for light module arrangement, has holding elements comprising holding part for fastening carrier part at mounting surface of lamp, where holding elements encase carrier projection that is used as latch part
10/16/2013EP2650918A1 Light emitting module
10/16/2013EP2650917A2 Multilayered semiconductor device, printed circuit board, and method of manufacturing multilayered semiconductor device
10/16/2013EP2650907A2 Methods and devices for fabricating and assembling printable semiconductor elements
10/16/2013EP2650880A1 Data Storage and Stackable Configurations
10/16/2013EP2649647A1 Opto-electronic semiconductor component, method for producing same and use of such a component
10/16/2013EP2649646A2 Microelectromechanical sensor module and corresponding production method
10/16/2013EP2649643A2 Compliant interconnects in wafers
10/16/2013CN203242661U Semiconductor substrate and semiconductor device
10/16/2013CN203242657U Electricity-saving light emitting diode
10/16/2013CN203242623U Low light decay high light efficiency multi-chip combined LED module
10/16/2013CN203242622U Light source assembly
10/16/2013CN203242621U Led发光装置 Led light-emitting device
10/16/2013CN103354949A Pin attachment
10/16/2013CN103354235A Thyristor converter valve assembly
10/16/2013CN103354234A Thyristor converter valve assembly
10/16/2013CN103354233A Thyristor valve section and pressing device thereof
10/16/2013CN103354232A Parallel sub-module for VSC-HVDC (voltage source converter high voltage direct current)
10/16/2013CN103354231A IGBT power unit and sub-module for VSC-HVDC (voltage source converter high voltage direct current)
10/16/2013CN103354227A Stack packaging device
10/16/2013CN103354226A Stack packaging device
10/16/2013CN103353585A Switch locked type Hall hybrid integrated circuit
10/16/2013CN103353065A Optical engine structure with same substrate
10/16/2013CN102437151B Full-color SMD LED (Surface Mounted Device Light Emitting Diode) bracket structure and packaging product device thereof
10/16/2013CN102376696B Three-friction-force piezoelectric stepper pushed by two embedded piezoelectric tubes, and stepping scanner
10/16/2013CN102227807B Radiation-emitting semiconductor chip and its manufacture method
10/16/2013CN102169876B Resin-sealed electronic control device and method of fabricating the same
10/16/2013CN102157511B Optocoupler devices
10/16/2013CN102130226B Light emitting device and method of manufacture
10/16/2013CN101859862B 发光装置 Light-emitting device
10/16/2013CN101711430B Assemblage of radiofrequency chips
10/16/2013CN101641801B Assembly and method for generating mixed light
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