Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
11/2013
11/06/2013CN203277490U LED integrated optical source
11/06/2013CN203277489U White light packaging structure of plurality of blue light emitting diodes
11/06/2013CN203277381U LED multi-cup integration COB packaging structure
11/06/2013CN203277380U Lighting assembly and lighting apparatus
11/06/2013CN203277379U Bus bar connecting type high-performance IGBT module
11/06/2013CN203277378U A double-chip power diode with TO packaging
11/06/2013CN203277377U DRAM (dynamic random access memory) double-chip stack packaging structure
11/06/2013CN203277376U A multi-wafer packaging structure
11/06/2013CN203277354U Single-arm rectification module
11/06/2013CN203277350U Multichip package
11/06/2013CN203273323U Area light source embedded with LED (Light-Emitting Diode) protection chip
11/06/2013CN103384914A Method for embedding a LED network
11/06/2013CN103384913A Enhanced stacked microelectronic assemblies with central contacts and improved ground or power distribution
11/06/2013CN103383941A 功率半导体模块 Power semiconductor module
11/06/2013CN103383940A Semiconductor package and method for manufacturing same
11/06/2013CN103383939A Chip embedded packages and methods for forming a chip embedded package
11/06/2013CN103383457A Optical proximity sensor and manufacturing method thereof
11/06/2013CN102522398B COB (Chip On Board) integrated-packaged LED (Light-Emitting Diode) with high color-rendering index and high reliability
11/06/2013CN102299231B Light emitting diode (LED) packaging structure and manufacturing method thereof
11/06/2013CN102203938B A semiconductor device comprising an in-chip active heat transfer system
11/06/2013CN102163603B Packaging structure for system level fan-out wafer
11/06/2013CN102157510B Contact sensor packaging structure and manufacture method thereof
11/06/2013CN102074487B 半导体组装结构与其形成方法 Structure and its method of forming a semiconductor assembly
11/06/2013CN102005442B Power conversion device
11/06/2013CN101842896B Method for stacking serially-connected integrated circuits and multi-chip device made from same
11/05/2013US8576000 3D chip stack skew reduction with resonant clock and inductive coupling
11/05/2013US8575756 Power package module with low and high power chips and method for fabricating the same
11/05/2013US8575733 Semiconductor device
10/2013
10/31/2013WO2013163177A1 Thermal management floorplan for a multi-tier stacked ic package
10/31/2013WO2013162125A1 Integral optical sensor package
10/31/2013WO2013161891A1 Chip-on-wafer bonding method and bonding device, and structure comprising chip and wafer
10/31/2013WO2013161138A1 Semiconductor device and power conversion apparatus
10/31/2013WO2013160778A1 High resolution display architecture
10/31/2013WO2013160250A1 Led-based light source
10/31/2013WO2013159664A1 White light led light-emitting device and method for preparing thereof
10/31/2013WO2013052372A3 Stub minimization for multi-die wirebond assemblies with parallel windows
10/31/2013WO2013052324A3 Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate
10/31/2013WO2012130657A9 Optoelectronic component and method for operating an optoelectronic component
10/31/2013US20130286615 Printed circuit board and method of manufacturing printed circuit board
10/31/2013US20130285739 Methods, apparatus and system to support large-scale micro- systems including embedded and distributed power supply, thermal regulation, multi-distributedsensors and electrical signal propagation
10/31/2013US20130285261 Semiconductor chip stacking assemblies
10/31/2013US20130285260 Multi-chip module including stacked power devices with metal clip
10/31/2013US20130285055 Semiconductor device
10/31/2013DE112008000446B4 Halbleitermodule und Wechselrichtervorrichtung Semiconductor modules and inverter device
10/31/2013DE102013207804A1 Leistungsmodul mit direkt verbundenen, wärmeleitenden strukturen Power module directly associated with thermally conductive structures
10/31/2013DE102013207579A1 LED module i.e. chip-on-board module, for use in e.g. spotlight, has phosphor particles whose concentration decreases with gradient in region formed adjacent to another region, and phosphor layer applied on radiation surface of chip
10/31/2013DE102013201056A1 Halbleitervorrichtung Semiconductor device
10/31/2013DE102013104223A1 Halbleiter-Bauelemente und Verfahren zu deren Herstellung und Verwendung Semiconductor devices and methods for their preparation and use
10/31/2013DE102012209354A1 LED-Modul LED module
10/31/2013DE102012206966A1 LED-basierte Lichtquelle LED-based light source
10/31/2013DE102012206854A1 Hybrid integriertes Bauteil und Verfahren zu dessen Herstellung Hybrid integrated component and method for its production
10/31/2013DE102012202785B4 Halbleitervorrichtung mit Halbleitermodul, Kühleinheit und Federbauteil A semiconductor device comprising semiconductor module cooling unit and spring member
10/30/2013EP2658000A1 Substrate, light-emitting device, and illumination device
10/30/2013EP2657968A1 Package structure of high-power led light source module
10/30/2013EP2657967A2 Light emitting module
10/30/2013EP2657966A1 Insulating structure for power module and power conversion device using power module
10/30/2013EP2656385A1 Integrated digital- and radio-frequency system-on-chip devices with integral passive devices in package substrates, and methods of making same
10/30/2013EP2656383A1 Simultaneous wafer bonding and interconnect joining
10/30/2013EP2656117A1 Led (light emitting diode) luminous source module
10/30/2013CN203260628U Packaging structure for light emitting diode
10/30/2013CN203260627U Packaging structure of light emitting diode
10/30/2013CN203260579U SMD (Surface Mounted Device) packaging apparatus for single LED lamp bead with six chips in series
10/30/2013CN203260578U Four-pin LED packaging structure
10/30/2013CN203260577U 半导体装置 Semiconductor device
10/30/2013CN203260576U Igbt module
10/30/2013CN103379806A In-line liquid cooled semiconductor module and assembly with the same
10/30/2013CN103378108A Method and apparatus for packaging image sensor
10/30/2013CN103378081A Semiconductor light emitting device and production method thereof
10/30/2013CN103378080A 发光模块 The light emitting module
10/30/2013CN103378079A Multiple-chip array type chip-on-board (COB) inversely-installed eutectic packaging structure and method
10/30/2013CN103378078A Lighting device and method for generating white light
10/30/2013CN103378077A LED light-emitting device
10/30/2013CN103378076A Semiconductor device, semiconductor packaging, and method of operating computer
10/30/2013CN103378075A Semiconductor memory modules and methods of fabricating the same
10/30/2013CN103378074A Chip package
10/30/2013CN103378073A 半导体结构及其制造方法 The semiconductor structure and a method of manufacturing
10/30/2013CN103378027A Liquid-cooled assembly with in-line power semiconductor modules and power semiconductor module
10/30/2013CN103378021A Power module with directly attached thermally conductive structures
10/30/2013CN103378017A High density 3D package
10/30/2013CN103378011A Optoelectronic package and method for making same
10/30/2013CN103377950A Substrate and method of producing substrate for at least one power semiconductor component
10/30/2013CN103377908A LED chip miter cutting method, LED luminous element and LED lighting device
10/30/2013CN103373697A Hybrid integrated component and method for the manufacture thereof
10/30/2013CN102510204B Insulated gate bipolar transistor (IGBT) half-bridge power module
10/30/2013CN102184914B Power semiconductor module and method for operating power semiconductor module
10/30/2013CN102169877B Circuit module, electronic device including same, and circuit module manufacturing method
10/30/2013CN101794852B Lighting emitting device package
10/30/2013CN101673729B 半导体器件 Semiconductor devices
10/29/2013US8569684 Infrared sensor control architecture
10/24/2013WO2013157467A1 Semiconductor device and cooler for semiconductor device
10/24/2013WO2013155681A1 Slope die stack
10/24/2013US20130280862 Semiconductor storage device and manufacturing method thereof
10/24/2013US20130277861 Vertically stackable dies having chip identifier structures
10/24/2013US20130277841 Rigid Interconnect Structures in Package-on-Package Assemblies
10/24/2013US20130277783 Arrangements For An Integrated Sensor
10/24/2013US20130277779 Method and structure of sensors or electronic devices using vertical mounting
10/24/2013DE102013207326A1 Hoch-Dichte-3D-Paket High-density 3D package
10/24/2013DE102013202807A1 Halbleitervorrichtung und Verfahren zum Herstellen einer Halbleitervorrichtung A semiconductor device and method of manufacturing a semiconductor device
10/24/2013DE102013103920A1 Herstellungsverfahren für Halbleiterbauelement und Halbleiterbauelement A method for manufacturing semiconductor device and semiconductor device
10/24/2013DE102012206646A1 Leuchtvorrichtung mit LED-Chip und Vergussmasse A lighting apparatus with LED chip and sealing compound
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