Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
11/2013
11/20/2013CN203300669U Curved-surface solar cell module
11/20/2013CN203300647U Integrated chip and mainboard
11/20/2013CN203300646U Multi-bowl integrated LED (Light Emitting Diode) structure
11/20/2013CN203300645U Single-phase rectifying bridge
11/20/2013CN203300644U Double-base island packaging form structure based on gate-associated transistor
11/20/2013CN203300643U Three-dimensionally packaged SDRAM memory
11/20/2013CN203300642U Three-dimensionally packaged DDR1 SDRAM memory
11/20/2013CN203300625U Semiconductor surge suppressor package body structure
11/20/2013CN203298006U LED light source module illuminating in circular face mode
11/20/2013CN103403866A High-frequency module
11/20/2013CN103401438A Novel surface-mounted bridge-type rectifier and manufacturing method thereof
11/20/2013CN103400930A High-efficiency wide-optical angle LED (Light-Emitting Diode) module silicone lens structure and manufacturing method
11/20/2013CN103400925A LED array device for micro-displaying and lighting
11/20/2013CN103400924A Miniature flexible LED array device and preparation method
11/20/2013CN103400836A Proximity sensor packaging structure and manufacturing method thereof
11/20/2013CN103400835A Integrated packaging method for LED (light emitting diode) module
11/20/2013CN103400834A Transparent-electrode flexible LED micro-display array chip
11/20/2013CN103400833A Led module and manufacturing method thereof
11/20/2013CN103400832A Power semiconductor device
11/20/2013CN103400831A All-crimping type insulated gate bipolar transistor (IGBT) module and assembling method thereof
11/20/2013CN103400830A Multilayer chip stacking structure and implementation method thereof
11/20/2013CN103400814A Flexible substrate packaging structure and filling method thereof
11/20/2013CN103400810A Semiconductor chip laminating and packaging structure and manufacturing method thereof
11/20/2013CN102543985B Semiconductor packaging device and semiconductor substrate structure thereof
11/20/2013CN102270633B High-power flip-chip array LED chip and manufacturing method thereof
11/20/2013CN101894901B Package for multiple light emitting diodes
11/20/2013CN101887891B Electronic apparatus, high-voltage power source and printed circuit board
11/20/2013CN101887888B Power semiconductor module including substrates spaced from each other
11/19/2013US8587109 Stacked microelectronic dies and methods for stacking microelectronic dies
11/19/2013US8587102 Vertical system integration
11/14/2013WO2013170122A1 Ramp-stack chip package with variable chip spacing
11/14/2013WO2013168711A1 Power module, mounting structure of connection terminal in power module, and connection terminal
11/14/2013WO2013168354A1 Three-dimensional integrated circuit having stabilization structure for power supply voltage, and method for manufacturing same
11/14/2013WO2013168037A1 Remote phosphor and led package
11/14/2013WO2013167399A1 Optoelectronic component and method for producing an optoelectronic component
11/14/2013US20130302209 High Efficiency Solid-State Light Source and Methods of Use and Manufacture
11/14/2013US20130300905 Semiconductor module, mos type solid-state image pickup device, camera and manufacturing method of camera
11/14/2013US20130300497 Reconfigurable integrated circuit
11/14/2013US20130299999 Distributed semiconductor device methods, apparatus, and systems
11/14/2013DE202013104510U1 Halbleiterstapel für Umrichter mit Snubber-Kondensatoren Semiconductor stack for inverter with snubber capacitors
11/14/2013DE102013104952A1 Halbleiterpackages und Verfahren zu deren Ausbildung Semiconductor packages and methods of training
11/14/2013DE102013100611A1 Integrally-formed multi-layer light emitting device has lead frame with conductive rods arranged in sleeve, so that rod ends are extended from sleeve, and rods are connected to light emitting chip by metal-wire bonding
11/14/2013DE102012208033A1 Hybrid integriertes Bauteil und Verfahren zu dessen Herstellung Hybrid integrated component and method for its production
11/14/2013DE102012208032A1 Hybrid integriertes Bauteil Hybrid integrated component
11/14/2013DE102012208031A1 +Hybrid integriertes Bauteil und Verfahren zu dessen Herstellung + Hybrid integrated component and method for its production
11/14/2013DE102012208030A1 Mikromechanischer Inertialsensor und Verfahren zu dessen Herstellung Micromechanical inertial sensor and method for its production
11/14/2013DE102012207678A1 Vorrichtung zum formen einer gehäusestruktur für eine mehrzahl von elektronischen bauteilen und gehäusestruktur für eine mehrzahl von elektronischen bauteilen An apparatus for forming a housing structure for a plurality of electronic components and housing structural components for a plurality of electronic
11/13/2013EP2662894A2 Light-emitting diode arrangement, in particular for illumination purposes and method for producing an arrangement of light emitting diodes
11/13/2013EP2662893A1 Semiconductor device and manufacturing method thereof
11/13/2013EP2661772A1 Led arrangement for generating white light
11/13/2013CN203288647U LED lamp bead having uniform light emission and LED light fixture
11/13/2013CN203288644U Distributed high-voltage LED (Light-Emitting Diode) module group
11/13/2013CN203288592U Multi-primary color combined COB (chip on board)
11/13/2013CN203288591U White light emitting diode (LED) with blue and green substrate
11/13/2013CN203288590U LED light bar
11/13/2013CN203288589U Combined ultrathin diode
11/13/2013CN203288588U Chip stacking structure with pins
11/13/2013CN203288587U Power semiconductor module system
11/13/2013CN203288576U System with power semiconductor module and driving device
11/13/2013CN103390716A Light source adopting LED chip packaging technology
11/13/2013CN103390681A GaN-Based Optocoupler
11/13/2013CN103390615A Packaging method of LED (light emitting diode) serving as camera flashlight and correcting method and correcting device for starting LED flashlight for photographing
11/13/2013CN103390614A Micro flexible LED area array device with high luminance uniformity
11/13/2013CN103390613A Densely arranged LED area array device with high luminance uniformity and preparation method
11/13/2013CN103390612A Semiconductor device, semiconductor device module and method of fabricating semiconductor device
11/13/2013CN103390600A Semiconductor package and fabrication method thereof
11/13/2013CN103390594A Multichip flip-chip encapsulation module and related manufacturing method
11/13/2013CN101840912B 半导体装置及其制造方法 Semiconductor device and manufacturing method
11/12/2013US8582852 Dual-spectrum heat pattern separation algorithm for assessing chemotherapy treatment response and early detection
11/12/2013US8581660 Power transistor partial current sensing for high precision applications
11/12/2013US8581395 Hybrid integrated circuit device and electronic device
11/12/2013US8581198 Apparatus and method for detecting radiation
11/12/2013DE202012012767U1 Leistungshalbleitermodulsystem Power semiconductor module system
11/12/2013CA2536799C Semiconductor package and method of manufacturing the same
11/12/2013CA2351822C Light extractor apparatus
11/07/2013WO2013165652A1 Sensor array package
11/07/2013WO2013164737A1 Pixelated single phosphor leds for white light generation
11/07/2013WO2013164589A1 Apparatus and method for monitoring led colour mix
11/07/2013WO2013164588A1 Apparatus and method for monitoring led efficiency
11/07/2013WO2013164015A1 A display integrated semitransparent sensor system and use thereof
11/07/2013WO2013112691A3 Light-emitting dies incorporating wavelength-conversion materials and related methods
11/07/2013US20130294042 Methods and apparatus for connecting planar power electronics devices
11/07/2013US20130292853 Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices
11/07/2013US20130292840 Stacked memory allowing variance in device interconnects
11/07/2013DE102013104463A1 Chip-Einbettungsgehäuse und Verfahren zum Bilden eines Chip-Einbettungsgehäuses Chip embedding housing and method of forming a chip embedding housing
11/07/2013DE102013104337A1 Halbleitergehäuse und Verfahren zu seiner Herstellung Semiconductor package and method for its preparation
11/07/2013DE102012219568B3 Power semiconductor module manufacturing method, involves connecting semiconductor components with two conductors, respectively, and breaking insulant body along recesses that extend between connection and utilizable regions
11/07/2013DE102012218868B3 Power semiconductor module has first and second power semiconductor components that are arranged on common side with respect to first and second direct current (DC) voltage load power connection elements
11/07/2013DE102012217905B3 3-Level-Stromrichterhalbbrücke 3-level inverter half bridge
11/07/2013DE102012207566A1 Lighting device e.g. floor lamp has upper layer and bottom layer that are attached over specific side of semiconductor light source in light radiation pattern
11/07/2013DE102012207563A1 Lamp device i.e. incandescent lamp retrofitlamp, for illuminating room, has plate-like lamp modules including semiconductor light sources, and curved printed circuit board accommodated between upper and lower layers of multi-layer retainer
11/07/2013DE102012103983A1 Leuchtdiodenanordnung insbesondere zu Beleuchtungszwecken und Verfahren zur Herstellung einer Leuchtdiodenanordnung LED arrangement, in particular for illumination purposes and methods of producing a light emitting diode arrangement
11/07/2013DE102012001769B4 Gebondete gestapelte wafer Bonded wafer stacked
11/06/2013EP2660863A1 Power semiconductor module
11/06/2013EP2660858A1 Semiconductor module, mould device, and mould-forming method
11/06/2013EP2659510A2 Opto-electronic modules and methods of manufacturing the same
11/06/2013CN203277500U LED light source module group
11/06/2013CN203277498U Lighting assembly and pedestal thereof
11/06/2013CN203277496U White package for light-emitting diode (LED) of horizontal type electrode structure with sapphire at bottom thereof
11/06/2013CN203277495U All light beam angle luminescence LED light source module
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