Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
12/2013
12/04/2013CN203325905U AC drive COB-packaged LED module
12/04/2013CN203325904U Matrix-type radiating LED light source module
12/04/2013CN203325903U Novel single-phase rectifier bridge
12/04/2013CN203325902U Rectification module
12/04/2013CN203325901U Bi-directional three-terminal solid discharge tube
12/04/2013CN203325900U Multi-connected semiconductor crystal block
12/04/2013CN203325472U DRAM and semiconductor packaging part
12/04/2013CN203322771U Light-emitting assembly
12/04/2013CN103430636A Through wiring substrate, electronic device package, and electronic component
12/04/2013CN103430308A Structures and methods for electrically and mechanically linked monolithically integrated transistor and MEMS/NEMS devices
12/04/2013CN103430307A Semiconductor device and method for manufacturing same
12/04/2013CN103430306A Semiconductor module and manufacturing method therefor
12/04/2013CN103427638A Switching power supply capable of avoiding coupling effect
12/04/2013CN103427409A Surge protector
12/04/2013CN103427010A UV irradiation apparatus and ultraviolet irradiation head
12/04/2013CN103427009A Light emitting device
12/04/2013CN103426989A Semiconductor light emitting device and manufacturing method thereof, light emitting module, and illumination apparatus
12/04/2013CN103426963A Concentrated photovoltaic/quantum well thermoelectric power source
12/04/2013CN103426876A 光电转换装置 The photoelectric conversion device
12/04/2013CN103426875A Flexible LED (light-emitting diode) micro-display array device with transparent electrodes and preparation method
12/04/2013CN103426874A Ultrathin high-voltage transient voltage suppressor diode and application thereof
12/04/2013CN103426873A Multi-chip package and method of manufacturing same
12/04/2013CN103426872A Semiconductor packaging part and manufacturing method thereof
12/04/2013CN103426871A High-density hybrid stacked package structure and production method thereof
12/04/2013CN103426870A Semiconductor package and manufacturing method thereof
12/04/2013CN103426869A Stacking encapsulation part and manufacturing method thereof
12/04/2013CN103426840A Switching device with freewheel diode
12/04/2013CN103426633A Capacitance structure
12/04/2013CN103426452A Memory cascade and packaging methods, and device thereof
12/04/2013CN103424568A Electronic module and method for manufacturing electronic module
12/04/2013CN103423669A Novel integrated LED refrigerator lamp
12/04/2013CN103420324A 混合集成的构件 Hybrid integrated components
12/04/2013CN102822401B Method for assembling at least one chip using fabric, and fabric including chip device
12/04/2013CN102106194B Ceramic package substrate with recessed device
12/04/2013CN101986429B Chip package and forming method thereof
12/04/2013CN101667569B 光电转换装置 The photoelectric conversion device
12/03/2013US8598908 Built in system bus interface for random access to programmable logic registers
12/03/2013US8598650 Semiconductor device and production method therefor
12/03/2013DE202006021231U1 Leistungshalbleitermodul The power semiconductor module
11/2013
11/28/2013WO2013177134A1 Substrate-less stackable package with wire-bond interconnect
11/28/2013WO2013176832A1 Tilted emission led array
11/28/2013WO2013175714A1 Semiconductor device and method for manufacturing same
11/28/2013WO2013174583A1 Light diode device
11/28/2013WO2013174099A1 Chip stack encapsulation structure
11/28/2013WO2013085731A3 Formation of uniform phosphor regions for broad-area lighting systems and|phosphor placement tool
11/28/2013US20130314647 Display apparatus capable of controlling light transmittance and method of manufacturing the same
11/28/2013US20130313712 Multi-Chip Package and Method of Manufacturing Thereof
11/28/2013US20130313709 Interconnection of a packaged chip to a die in a package utilizing on-package input/output interfaces
11/28/2013US20130313511 Memory cell array and variable resistive memory device including the same
11/28/2013DE102013105352A1 Mehrchip-Verpackung und Verfahren zu deren Herstellung A multi-chip packaging and processes for their preparation
11/28/2013DE102013008858A1 Kapazitätsstruktur Capacitance structure
11/28/2013DE102012104494A1 Leuchtdiodenvorrichtung Light emitting diode device
11/28/2013DE102009019030B4 Halbleiterbauelement mit einem Träger und einem strukturierten Dielektrikum A semiconductor device comprising a carrier and a structured dielectric
11/28/2013DE102008034164B4 Modul mit Leistung-Halbleiterchip und Verfahren Module with a power semiconductor chip and method
11/28/2013DE102006060768B4 Gehäusebaugruppe, DBC-Plantine im Wafermaßstab und Vorrichtung mit einer Gehäusebaugruppe für Geräte mit hoher Leistungsdichte A housing assembly, DBC Plantine wafer-scale device having a housing assembly and for devices with high power density
11/27/2013EP2666193A1 Led package comprising encapsulation
11/27/2013CN203312362U Paster LED package capable of enhancing display effects
11/27/2013CN203312293U Thyristor assembly modularized mounting structure of flash welding machine
11/27/2013CN203312292U Miniaturized full-color surface mounting LED
11/27/2013CN203312291U Super-small-size glue-pouring paster LED packaging
11/27/2013CN103415938A 光电子半导体器件 Optoelectronic semiconductor device
11/27/2013CN103415935A Led having vertical contacts redistributed for flip chip mounting
11/27/2013CN103413884A LED encapsulation structure and encapsulation method
11/27/2013CN103413806A Pyroelectric sensor packaging structure
11/27/2013CN103413805A Manufacturing technology of LED lamp filament with adjustable light
11/27/2013CN103413804A Method for manufacturing light-variable light-emitting component
11/27/2013CN103413803A Hybrid integrated circuit and manufacturing method thereof
11/27/2013CN103413795A Semiconductor device packing structure and semiconductor device packing technological process
11/27/2013CN102231369B High-power heat-dissipation module
11/27/2013CN102194951B Light emitting diode, light emitting diode package, and lighting system
11/27/2013CN101904005B Optoelectronic component and production method for optoelectronic component
11/26/2013US8593178 CMOS logic circuit
11/26/2013US8593176 One phase logic
11/26/2013US8592964 Apparatus and method for high density multi-chip structures
11/26/2013US8592856 LED lamps
11/26/2013US8592831 Integrated circuit device
11/21/2013WO2013172814A1 Microelectronic package utilizing multiple bumpless build-up structures and through-silicon vias
11/21/2013WO2013172786A1 Assembly of wafer stacks
11/21/2013WO2013172291A1 Power module semiconductor device
11/21/2013WO2013172183A1 Power module
11/21/2013WO2013171996A1 Power semiconductor module
11/21/2013WO2013171946A1 Method for manufacturing semiconductor device and semiconductor device
11/21/2013WO2013171924A1 Multichannel dc-dc converter
11/21/2013WO2013171882A1 Semiconductor module and semiconductor device
11/21/2013WO2013171136A1 Electronic power module arrangement
11/21/2013WO2013171121A1 Power electronic devices
11/21/2013WO2013170523A1 Switching device having freewheeling diode
11/21/2013US20130307614 Method and Apparatus for Improving the Performance of a DAC Switch Array
11/21/2013US20130307611 Multi-chip package and operating method thereof
11/21/2013US20130307576 System and Method for Testing an Integrated Circuit
11/21/2013DE102013105030A1 Lichtemittierende Hableitervorrichtung mit Multi-Zellenarray und Herstellungsverfahren davon, lichtemittierendes Modul und Beleuchtungsvorrichtung Light emitting Hableitervorrichtung with multi-cell array and manufacturing method thereof, light-emitting module and lighting device
11/21/2013DE102013104742A1 Verdrahtungselement und Halbleitermodul mit demselben Wiring member and the semiconductor module with the same
11/21/2013DE102013103916A1 Housing comprises chip formed in first region, molding composition formed in second region, first- and second polymer layers, several connecting structures formed between polymer layers, metal-insulator-metal capacitor, and metal bump
11/20/2013EP2665095A1 Power electronic devices
11/20/2013EP2665093A1 Cooler
11/20/2013EP2664224A1 Method of transferring and electrically joining a high density multilevel thin film to a circuitized and flexible organic substrate and associated devices
11/20/2013EP2664044A1 Arc fault mitigation for photovoltaic systems
11/20/2013EP2664000A2 Method for embedding a led network
11/20/2013CN203300699U LED lamp bead support and LED combination lamp
11/20/2013CN203300696U Light-emitting diode and high-altitude screen
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