| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 12/18/2013 | CN103456728A Light emitting element and light emitting device thereof |
| 12/18/2013 | CN103456727A Multichip package structure |
| 12/18/2013 | CN103456726A LED package, LED displayer and LED package manufacturing method |
| 12/18/2013 | CN103456725A Emitter package and light emitting device displayer |
| 12/18/2013 | CN103456724A Packaging structure of semiconductor device |
| 12/18/2013 | CN103456705A Structure and method for packaging stackable integrated chips |
| 12/18/2013 | CN103456688A Interposer die for semiconductor packaging |
| 12/18/2013 | CN103453357A Light emitting assembly |
| 12/18/2013 | CN103453352A Light source module |
| 12/18/2013 | CN103453351A Light-emitting module |
| 12/18/2013 | CN102158275B Photoreceiving device |
| 12/18/2013 | CN102142507B LED package |
| 12/18/2013 | CN102130102B Electronic device and method of producing same |
| 12/18/2013 | CN102125469B Toothbrush with severable electrical connections |
| 12/17/2013 | US8609983 Interconnection sheet, solar cell with interconnection sheet, solar cell module, and interconnection sheet roll |
| 12/17/2013 | US8609975 Electronic devices including transparent conductive coatings including carbon nanotubes and nanowire composites, and methods of making the same |
| 12/17/2013 | US8609974 Solar to electrical energy conversion using the streaming potential |
| 12/17/2013 | US8609537 Integrated void fill for through silicon via |
| 12/17/2013 | US8609463 Integrated circuit package system employing multi-package module techniques |
| 12/12/2013 | WO2013184880A1 Use of conformal coating elastic cushion to reduce through silicon vias (tsv) stress in 3-dimensional integration |
| 12/12/2013 | WO2013181768A1 Precast mold cavity stereoscopic package module having wire layout |
| 12/12/2013 | US20130328188 Semiconductor device and manufacturing method thereof |
| 12/12/2013 | US20130328144 Semiconductor device, manufacturing method therefor, and electronic apparatus |
| 12/12/2013 | US20130328109 Structures and methods for electrically and mechanically linked monolithically integrated transistor and mems/nems devices |
| 12/12/2013 | US20130328068 Devices, systems, and methods related to distributed radiation transducers |
| 12/12/2013 | US20130328046 Semiconductor device and a method of manufacturing the same |
| 12/12/2013 | US20130326873 Method of fabricating multi-chip stack package structure having inner layer heat-dissipating board |
| 12/12/2013 | DE112012001049T5 Getriebesteuervorrichtung und elektronische Schaltungsvorrichtung Transmission control apparatus, and electronic circuit device |
| 12/12/2013 | DE102010000694B4 Leistungshalbleitermodul mit Druckkontaktfedern Power semiconductor module with pressure contact springs |
| 12/11/2013 | EP2672789A2 Ultrathin buried die module and method of manufacturing thereof |
| 12/11/2013 | EP2672513A1 Multichip package structure for generating a symmetrical and uniform light-blending source |
| 12/11/2013 | EP2672511A1 Method for creating a 3D stacked multichip module |
| 12/11/2013 | EP2672299A1 Gap member, lens and lighting device having the same |
| 12/11/2013 | EP2671250A1 Method for manufacturing two substrates connected by at least one mechanical and electrically conductive connection and the structure obtained |
| 12/11/2013 | CN203339225U Non-encapsulation chip LED lighting illumination structure |
| 12/11/2013 | CN203339216U Surface mounting type LED support, LED device and LED display screen |
| 12/11/2013 | CN203339165U Double-channel surface-mounted high-speed photoelectric coupler |
| 12/11/2013 | CN203339164U Six-channel surfaced-mounted high-speed optoelectronic coupler |
| 12/11/2013 | CN203339163U Double-channel surface-mounted high-speed photoelectric coupler |
| 12/11/2013 | CN203339162U Eight-layer stack-type chip packaging structure |
| 12/11/2013 | CN203339161U Radio frequency chip system grade packaging structure |
| 12/11/2013 | CN203339160U Eight-layer stack-type chip packaging structure |
| 12/11/2013 | CN203339150U Eight-layer stack-type chip packaging structure |
| 12/11/2013 | CN203336288U Substrate-shared optical engine structure |
| 12/11/2013 | CN103443943A Led package comprising encapsulation |
| 12/11/2013 | CN103443920A Light-emitting device |
| 12/11/2013 | CN103443919A Three-dimensional integrated circuit laminate and interlayer filler material for three-dimensional integrated circuit laminate |
| 12/11/2013 | CN103443918A Method of manufacturing semiconductor device |
| 12/11/2013 | CN103443917A 冷却器 Cooler |
| 12/11/2013 | CN103443528A LED-based modular assembly |
| 12/11/2013 | CN103441210A LED packaging structure and LED packaging method |
| 12/11/2013 | CN103441207A All-angle even-light-emitting high-power LED lamp bar with fluorescent powder and chips separated |
| 12/11/2013 | CN103441163A 太阳能面板 Solar panels |
| 12/11/2013 | CN103441124A Stacking packaging method of voltage regulator and corresponding stacking packaging device |
| 12/11/2013 | CN103441123A LED and display device |
| 12/11/2013 | CN103441122A High-voltage TVS diode |
| 12/11/2013 | CN103441121A High-voltage TVS composite chip diode |
| 12/11/2013 | CN103441120A Piled integrated circuit |
| 12/11/2013 | CN103435001A Hybrid integrated circuit device and packaging method |
| 12/11/2013 | CN102326239B Method of producing semiconductor chip stack, and semiconductor device |
| 12/11/2013 | CN102254905B 半导体发光装置 The semiconductor light emitting device |
| 12/11/2013 | CN102169873B Semiconductor packing structure applied to power switcher circuit |
| 12/11/2013 | CN102097336B 半导体结构及其制造方法 The semiconductor structure and a method of manufacturing |
| 12/11/2013 | CN101877348B System and method for embedded chip package with chips stacked in an interconnecting laminate |
| 12/11/2013 | CN101740554B Power semiconductor module with control function and integrated converter |
| 12/10/2013 | US8605920 Condenser microphone having flexure hinge diaphragm and method of manufacturing the same |
| 12/10/2013 | US8604508 LED lamps |
| 12/10/2013 | US8604348 Method of making a connection component with posts and pads |
| 12/10/2013 | US8604332 Electronic devices including transparent conductive coatings including carbon nanotubes and nanowire composites, and methods of making the same |
| 12/10/2013 | US8603838 Method for producing a contact for solar cells |
| 12/10/2013 | US8601815 Method for generating, transmitting and receiving power |
| 12/05/2013 | WO2013180300A1 Aluminum wire for power semiconductor, semiconductor device using said aluminum wire, and searching method for said aluminum wire |
| 12/05/2013 | WO2013179879A1 Semiconductor module and semiconductor module manufacturing method |
| 12/05/2013 | WO2013179638A1 Semiconductor module and production method for same |
| 12/05/2013 | WO2013179547A1 Power semiconductor device |
| 12/05/2013 | WO2013178529A2 Network of electronic devices assembled on a flexible support and communication method |
| 12/05/2013 | US20130322025 Semiconductor module and method for manufacturing the same |
| 12/05/2013 | US20130321082 Semiconductor apparatus comprised of two types of transistors |
| 12/05/2013 | US20130321074 Semiconductor integraged circuit having compatible mode selection circuit |
| 12/05/2013 | US20130321073 Power Supply Circuit with Positive and Negative Feedback Loops |
| 12/05/2013 | US20130320818 Semiconductor device, inverter device provided with semiconductor device, and in-vehicle rotating electrical machine provided with semiconductor device and inverter device |
| 12/05/2013 | US20130320571 Semiconductor device and manufacturing method thereof |
| 12/05/2013 | US20130320535 Three-dimensional system-level packaging methods and structures |
| 12/05/2013 | US20130320341 Three dimensional memory structure |
| 12/05/2013 | US20130320197 Semiconductor device and sensing system |
| 12/05/2013 | DE102012209325A1 Optoelektronisches Modul und Verfahren zur Herstellung eines optoelektronischen Moduls An opto-electronic module and method for producing an optoelectronic module |
| 12/05/2013 | DE102012209266A1 Schaltungsanordnung und Herstellungsverfahren hierfür Circuit and manufacturing method thereof |
| 12/05/2013 | DE102012209131A1 Leuchtvorrichtung mit halbleiterlichtquellen und gemeinsamem diffusor Lighting device with semiconductor light sources and common diffuser |
| 12/05/2013 | DE102012209034A1 Elektronikmodul sowie Verfahren zur Herstellung eines solchen Elektronikmoduls, sowie elektronisches Steuergerät mit einem solchen Elektronikmodul Electronics module and to methods for producing such electronics module, as well as electronic control device with such a electronics module |
| 12/05/2013 | DE102012209033A1 Elektronikmodul sowie Verfahren zur Herstellung eines solchen Elektronikmoduls, sowie elektronisches Steuergerät mit einem solchen Elektronikmodul Electronics module and to methods for producing such electronics module, as well as electronic control device with such a electronics module |
| 12/05/2013 | DE102009055882B4 Leistungshalbleitervorrichtung Power semiconductor device |
| 12/04/2013 | EP2669965A2 Semiconductor light emitting device |
| 12/04/2013 | EP2669947A2 Sapphire substrate configured to form light emitting diode chip providing light in multi-directions, light emitting diode chip, and illumination device |
| 12/04/2013 | EP2669946A2 Light emitting element, illumination device and device frame thereof |
| 12/04/2013 | EP2669945A1 Interposer die for semiconductor packaging |
| 12/04/2013 | EP2669944A2 Semiconductor package and stacked semiconductor package |
| 12/04/2013 | EP2669938A2 Semiconductor device with an oxide solder flow prevention area on a substrate and corresponding manufacturing method |
| 12/04/2013 | EP2669936A1 Discrete semiconductor device package and manufacturing method |
| 12/04/2013 | EP2668442A1 Led-based modular assembly |
| 12/04/2013 | CN203325967U Light-emitting device |