| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 01/01/2014 | CN203377247U LED packaging structure without welding |
| 01/01/2014 | CN103493200A Semiconductor device, inverter device provided with semiconductor device, and in-vehicle rotating electrical machine provided with semiconductor device and inverter device |
| 01/01/2014 | CN103493199A Method and apparatus for integrating an infrared (IR) photovoltaic cell on a thin film photovoltaic cell |
| 01/01/2014 | CN103492911A Led (light-emitting diode) luminous source module |
| 01/01/2014 | CN103490755A MOS (metal oxide semiconductor) chip paralleled current sharing integrated switch and packaging module thereof |
| 01/01/2014 | CN103489984A Light-emitting diode packaging structure and manufacturing method thereof |
| 01/01/2014 | CN103489858A Wafer packaging method |
| 01/01/2014 | CN103489857A White light LED light-emitting device |
| 01/01/2014 | CN103489856A Thyristor compression joint assembly for flexible direct-current transmission |
| 01/01/2014 | CN103489855A 晶圆封装结构 Wafer package |
| 01/01/2014 | CN103489854A Semiconductor device and dc-to-dc converter |
| 01/01/2014 | CN103489853A Semiconductor device and dc-to-dc converter |
| 01/01/2014 | CN103487838A Packaging structure of optical device |
| 01/01/2014 | CN103486493A Integrally packaged LED (light emitting diode) plant lighting module |
| 01/01/2014 | CN102272925B Method for producing lamps |
| 01/01/2014 | CN102222746B Light emitting device, light emitting device package and illumination system |
| 12/31/2013 | US8618873 High frequency circuit device |
| 12/31/2013 | US8618672 Three dimensional stacked chip package structure |
| 12/27/2013 | WO2013192194A1 Microelectronic assembly tolerant to misplacement of microelectronic elements therein |
| 12/27/2013 | WO2013190925A1 Electronic component module |
| 12/27/2013 | WO2013189756A1 Substrate for mounting multiple power transistors thereon and power semiconductor module |
| 12/26/2013 | US20130344819 Versatile communication system and method of implementation using heterogeneous integration |
| 12/26/2013 | US20130344655 Method of producing semiconductor device |
| 12/26/2013 | US20130344653 Stackable electronic package and method of fabricating same |
| 12/26/2013 | US20130344642 Textured transparent film having pyramidal patterns that can be associated with photovoltaic cells |
| 12/26/2013 | US20130343022 Single layer low cost wafer level packaging for sff sip |
| 12/26/2013 | US20130341805 Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices |
| 12/26/2013 | US20130341804 Simultaneous wafer bonding and interconnect joining |
| 12/26/2013 | US20130341803 Method to enable controlled side chip interconnection for 3d integrated packaging system |
| 12/25/2013 | EP2677541A1 Method for wire bonding a power semiconductor chip and the corresponding device |
| 12/25/2013 | EP2677539A1 Semiconductor device and process for manufacture thereof |
| 12/25/2013 | EP2528095B1 High performance electronic system with first and second subsystem |
| 12/25/2013 | CN203367362U LED light source module with high luminous efficiency and based on gold thread binding |
| 12/25/2013 | CN203367280U Sensor circuit assembly |
| 12/25/2013 | CN203367279U LED line light source |
| 12/25/2013 | CN203367278U White light LED light source device |
| 12/25/2013 | CN203367277U A cylindrical LED filament |
| 12/25/2013 | CN203367276U Combined packaging structure of LED lamp beads |
| 12/25/2013 | CN203367275U Single-sided light emitting LED light source and double-sided light emitting LED light source |
| 12/25/2013 | CN203367274U LED packaging structure |
| 12/25/2013 | CN203367273U Small-power field effect pair transistor |
| 12/25/2013 | CN203367272U Field effect geminate transistor |
| 12/25/2013 | CN203367261U 功率模块 Power Modules |
| 12/25/2013 | CN103477451A Method for producing at least one optoelectronic semiconductor component |
| 12/25/2013 | CN103477434A An interposer having an inductor |
| 12/25/2013 | CN103477429A Semiconductor device and manufacturing method thereof |
| 12/25/2013 | CN103477428A Semiconductor device and manufacturing method thereof |
| 12/25/2013 | CN103474565A Connection of light emitting diode unit and insulation heat conduction substrate |
| 12/25/2013 | CN103474556A Mechanical packaging LED device and mechanical packaging method |
| 12/25/2013 | CN103474501A Selective emitter gallium antimonide infrared battery and manufacturing method thereof |
| 12/25/2013 | CN103474425A High-luminescence-uniformity miniaturized flexible LED area array device and preparation method thereof |
| 12/25/2013 | CN103474424A Red chip direct packaging LED light source |
| 12/25/2013 | CN103474423A High luminous efficiency LED integrated light source and LED lamp |
| 12/25/2013 | CN103474422A Single-phase rectifier bridge |
| 12/25/2013 | CN103474421A High-yield semiconductor device |
| 12/25/2013 | CN103474420A Three dimensional integrated circuit structures and hybrid bonding methods for semiconductor wafers |
| 12/25/2013 | CN103474410A Power semiconductor packaging piece and wire bonding method thereof |
| 12/25/2013 | CN103474361A Packaging process and packaging structure of embedded substrate with active chip embedment function |
| 12/25/2013 | CN102270626B Polycrystal-encapsulated light-emitting diode |
| 12/25/2013 | CN102244072B Light emitting device module |
| 12/25/2013 | CN101999169B Broadband light emitting device lamps for providing white light output |
| 12/25/2013 | CN101859762B Semiconductor device and manufacturing method thereof |
| 12/24/2013 | US8613901 Titanium oxide nano tube material and method for manufacturing the same |
| 12/24/2013 | DE10344631B4 Elektronische Schaltungsanordnung Electronic circuitry |
| 12/24/2013 | DE102013106459A1 Elektrothermische Kühlvorrichtungen und Verfahren zu ihrer Herstellung Electrothermal cooling devices and processes for their preparation |
| 12/24/2013 | DE102013105995A1 Elektronisches-Bauelemente-Package und Verfahren zur Herstellung eines Elektronisches-Bauelemente-Package The electronic components package and method for producing a electronic-components-Package |
| 12/24/2013 | DE102008011810B4 Lichtemittierendes Bauteil und Verwendung sowie Herstellungsverfahren eines solchen The light-emitting device and manufacturing method and use of such |
| 12/19/2013 | WO2013187992A1 Wafer level packages of high voltage units for implantable medical devices and corresponding fabrication methods |
| 12/19/2013 | WO2013187120A1 Semiconductor device |
| 12/19/2013 | WO2013187117A1 High frequency module |
| 12/19/2013 | WO2013186119A1 Semiconductor light source with a first and a second led chip and a first and a second fluorescent substance |
| 12/19/2013 | WO2013186035A1 Optoelectronic semiconductor chip |
| 12/19/2013 | US20130334707 Apparatus, system, and method for wireless connection in integrated circuit packages |
| 12/19/2013 | US20130334696 Bumpless build-up layer package design with an interposer |
| 12/19/2013 | DE102013106113A1 Halbleitermodule und Verfahren zu ihrer Herstellung Semiconductor modules and methods for their preparation |
| 12/19/2013 | DE102012210306A1 Method for manufacturing substrate for e.g. MOSFET for rectifying and inverting electric voltage and current, involves applying metallization layer on insulating material, and electrodepositing metal layer on metallization layer |
| 12/19/2013 | DE102012210261A1 Power semiconductor module for controlling electromotor, has set of coils directly arranged beside conductor path or current conductor, and another set of coils directly arranged beside another conductor path or another current conductor |
| 12/19/2013 | DE102012210052A1 Hybrid integriertes Bauteil und Verfahren zu dessen Herstellung Hybrid integrated component and method for its production |
| 12/19/2013 | DE102012210049A1 Hybrid integriertes Bauteil und Verfahren zu dessen Herstellung Hybrid integrated component and method for its production |
| 12/19/2013 | DE102012105208A1 Halbleiterlichtquelle Semiconductor light source |
| 12/19/2013 | DE102010014940B4 Leistungshalbleitermodul mit Anschlusselementen Power semiconductor module with connecting elements |
| 12/19/2013 | DE102009057145B4 Druckkontaktiertes Leistungshalbleitermodul mit teilweise bandartigen Lastanschlusselementen Pressure-contacted power semiconductor module with partial band-like load connection elements |
| 12/18/2013 | EP2674973A1 Power semiconductor module |
| 12/18/2013 | EP2673803A2 Power semiconductor module |
| 12/18/2013 | EP2673801A1 Contact system comprising a connecting means and method |
| 12/18/2013 | EP1402572B1 Method for producing miniature amplifier and signal processing unit |
| 12/18/2013 | CN203351662U High luminous efficiency LED blue light COB light source |
| 12/18/2013 | CN203351647U Led packaging structure |
| 12/18/2013 | CN203351596U Light emitting diode packaging structure |
| 12/18/2013 | CN203351595U A LED packaging structure |
| 12/18/2013 | CN203351594U Light emitting diode |
| 12/18/2013 | CN203351593U LED chip combination |
| 12/18/2013 | CN203351592U LED highly color developing white light emitting device for common illumination |
| 12/18/2013 | CN203351587U Semiconductor device |
| 12/18/2013 | CN203351143U LED displayer |
| 12/18/2013 | CN103460656A Multichip module for communications |
| 12/18/2013 | CN103460382A Induced thermal gradients |
| 12/18/2013 | CN103460381A Improvements in or relating to thyristor clamped assemblies |
| 12/18/2013 | CN103456863A Light emitting device |
| 12/18/2013 | CN103456729A LED display screen |