| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
|---|
| 01/15/2014 | EP2685496A2 Light emitting apparatus |
| 01/15/2014 | EP2685494A1 Cooler |
| 01/15/2014 | EP2685491A2 3D IC method and device |
| 01/15/2014 | CN203398164U Full-angle luminous LED bracket, and LED lamppost with same |
| 01/15/2014 | CN203398162U Extensible integrated packaging light source |
| 01/15/2014 | CN203398113U Radiating ceramic packaged LED light source |
| 01/15/2014 | CN203398112U High-voltage LED lamp bead |
| 01/15/2014 | CN203398111U LED package, LED plant light supplementing lamp and LED module group |
| 01/15/2014 | CN203398110U LED light source combination of fixed-type and fixed-specification packaging |
| 01/15/2014 | CN203398109U Light emitting device and illumination device |
| 01/15/2014 | CN203398107U 混合集成电路装置 Hybrid integrated circuit device |
| 01/15/2014 | CN203395801U Bulb lamp and substrate chip light source |
| 01/15/2014 | CN103515519A Light emitting diode and method of manufacturing the same |
| 01/15/2014 | CN103515373A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 01/15/2014 | CN103515372A Photosensor chip package structure |
| 01/15/2014 | CN103515371A Integrated optical sensor package |
| 01/15/2014 | CN103515370A Power semiconductor package and manufacturing method thereof |
| 01/15/2014 | CN103515369A LED module substrate |
| 01/15/2014 | CN103515368A Encapsulating method of light emitting diode |
| 01/15/2014 | CN103515367A Light emitting diode packaging structure |
| 01/15/2014 | CN103515366A LED integrated optical source and connection method thereof |
| 01/15/2014 | CN103515365A Large power crimping type IGBT device |
| 01/15/2014 | CN103515364A Power module package and method for manufacturing the same |
| 01/15/2014 | CN103515363A Method and apparatus of wafer level package for heterogeneous integration technology |
| 01/15/2014 | CN103515362A Package on package device and method of packaging semiconductor die |
| 01/15/2014 | CN103515361A Packaging element having stack structure and manufacturing method thereof |
| 01/15/2014 | CN103515360A Solar cell module and ribbon assembly applied to the same |
| 01/15/2014 | CN103515347A Assembly structure |
| 01/15/2014 | CN103515340A Power module package and method for manufacturing the same |
| 01/15/2014 | CN103515334A Chip package, method for forming the same, and method for forming semiconductor structure |
| 01/15/2014 | CN102623445B Rectifier bridge arm |
| 01/15/2014 | CN102403275B Package on package structure and fabricating method for same |
| 01/15/2014 | CN102290409B Light-emitting apparatus |
| 01/14/2014 | US8629558 Techniques for packaging multiple device components |
| 01/14/2014 | US8629476 Light-emitting apparatus package, light-emitting apparatus, backlight apparatus, and display apparatus |
| 01/14/2014 | US8627617 Photovoltaic module mounting assembly |
| 01/09/2014 | WO2014008428A1 Parallel plate slot emission array |
| 01/09/2014 | WO2014006814A1 Semiconductor device |
| 01/09/2014 | WO2014006724A1 Semiconductor device |
| 01/09/2014 | US20140009221 Vertical hall sensor circuit comprising stress compensation circuit |
| 01/09/2014 | US20140008773 Integrated Antenna Structure |
| 01/09/2014 | US20140008769 Semiconductor Device and Method of Forming Cavity Adjacent to Sensitive Region of Semiconductor Die Using Wafer-Level Underfill Material |
| 01/09/2014 | DE102013213205A1 Halbleitereinheit Semiconductor unit |
| 01/09/2014 | DE102013213204A1 Halbleitereinheit Semiconductor unit |
| 01/09/2014 | DE102013106936A1 Chip-Baustein und Verfahren zu seiner Herstellung Chip package and process for its preparation |
| 01/09/2014 | DE102012211553A1 Housing for LED light module, has plate-like inner region serving as assembled coverage areas comprising sorting regions surrounded by separation lines, where separation lines are formed at side turned towards semiconductor light module |
| 01/08/2014 | EP2682987A2 Light emitting device package |
| 01/08/2014 | EP2682986A1 Power semiconductor module, power semiconductor module manufacturing method, and power conversion apparatus |
| 01/08/2014 | EP2682985A1 Semiconductor module and semiconductor module manufacturing method |
| 01/08/2014 | CN203386779U Photovoltaic terminal box and photovoltaic assembly |
| 01/08/2014 | CN203386752U Integrated block for analog quantity conversion circuit |
| 01/08/2014 | CN203386751U Silicon-based multiple module-group layer superposing LED (Light-Emitting Diode) structure |
| 01/08/2014 | CN203386750U Improved-type six-chip LED package structure |
| 01/08/2014 | CN203386749U Saving-type dual-core wire bonding mode LED packaging structure |
| 01/08/2014 | CN203386748U Heat-dissipation ceramic-packaged LED light source |
| 01/08/2014 | CN203386739U Liquid-cooled apparatus and integration power semiconductor module |
| 01/08/2014 | CN103503183A Led光源 Led light |
| 01/08/2014 | CN103503136A Patterned UV sensitive silicone-phosphor layer over LEDs |
| 01/08/2014 | CN103503135A Differential infrared imager for gas plume detection |
| 01/08/2014 | CN103503132A 半导体装置 Semiconductor device |
| 01/08/2014 | CN103503122A 半导体装置 Semiconductor device |
| 01/08/2014 | CN103500743A Full-angle white light LED light emitting device |
| 01/08/2014 | CN103500742A LED plane package device capable of emitting light at 360 degrees |
| 01/08/2014 | CN101946318B Semiconductor element module and method for manufacturing the same |
| 01/08/2014 | CN101840911B Semiconductor device, transmission system, method for manufacturing semiconductor device, and method for manufacturing transmission system |
| 01/07/2014 | US8624667 High electron mobility transistors with multiple channels |
| 01/07/2014 | US8624627 Method and device for low power control |
| 01/07/2014 | US8624372 Semiconductor component comprising an interposer substrate |
| 01/07/2014 | US8623704 Adhesive/spacer island structure for multiple die package |
| 01/07/2014 | US8621926 Wiring substrate, piezoelectric oscillator and gyrosensor |
| 01/03/2014 | WO2014004700A1 Mems die and methods with multiple-pressure sealing |
| 01/03/2014 | WO2014004067A1 Semiconductor package with air pressure sensor |
| 01/03/2014 | WO2014004009A1 Semiconductor package with mechanical fuse |
| 01/03/2014 | WO2014002663A1 Interposer, printed circuit board, and semiconductor device |
| 01/03/2014 | WO2014002637A1 Semiconductor device and semiconductor device manufacturing method |
| 01/03/2014 | WO2014002625A1 Semiconductor device |
| 01/03/2014 | WO2014002442A1 Semiconductor device and semiconductor device connection structure |
| 01/03/2014 | WO2014001068A1 Lighting device, lighting arrangement comprising lighting device and method for operating a lighting device |
| 01/03/2014 | WO2014001019A1 Light-emitting diode module and motor vehicle headlight |
| 01/03/2014 | WO2014000988A1 Optoelectronic component and method for producing an optoelectronic component |
| 01/03/2014 | WO2014000328A1 Solar device and fastening mechanism thereof |
| 01/02/2014 | US20140004647 Method Of Forming 3D Integrated Microelectronic Assembly With Stress Reducing Interconnects |
| 01/02/2014 | US20140003002 Semiconductor Device |
| 01/02/2014 | US20140002184 Apparatus for mixed signal interface circuitry and associated methods |
| 01/02/2014 | US20140002183 Apparatus and method for extending bandwidth and suppressing phase errors in multi-phase signals |
| 01/02/2014 | US20140001653 Package-on-package device and method of fabricating the same |
| 01/02/2014 | US20140001623 Microelectronic structure having a microelectronic device disposed between an interposer and a substrate |
| 01/02/2014 | US20140001612 Multiple Die Packaging Interposer Structure and Method |
| 01/02/2014 | DE102013106577A1 Package-in-Packages und Verfahren zu ihrer Herstellung Package in packages and methods for their preparation |
| 01/02/2014 | DE102012211446A1 Semiconductor module, has bonding wire bonded at load terminal and connected with upper contact piece, and explosion protection unit arranged between load terminals and upper contact piece and embedded in bonding wire at specific length |
| 01/02/2014 | DE102012210743A1 Lighting device e.g. LED-lighting module, has light sensor arranged at distance opposite to semiconductor light sources that are designed with different colors, and photoconductive optic arranged upstream of light sensor |
| 01/02/2014 | DE102012105677A1 Leuchtdiodenmodul und Kfz-Scheinwerfer Light emitting diode module and vehicle headlights |
| 01/02/2014 | DE102012105619A1 Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements Optoelectronic component and process for producing an optoelectronic component |
| 01/02/2014 | DE102007050433B4 Halbleitermodul, Verfahren zum Herstellen eines Halbleitermoduls und Board mit einem Halbleitermodul A semiconductor module, method for manufacturing a semiconductor module and board with a semiconductor module |
| 01/02/2014 | DE102006012429B4 Halbleitervorrichtung Semiconductor device |
| 01/01/2014 | EP2680053A1 Lighting device |
| 01/01/2014 | CN203377265U LED packaging structure |
| 01/01/2014 | CN203377262U LED (light-emitting diode) package module capable of being connected in parallel or in series |
| 01/01/2014 | CN203377258U Bicrystal patch LED encapsulation structure for raising light-emitting efficiency |
| 01/01/2014 | CN203377252U Chip LED with LED drive IC |