| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 01/29/2014 | EP2690658A1 Power semiconductor module and power unit device |
| 01/29/2014 | EP2689458A1 Patterned uv sensitive silicone-phosphor layer over leds |
| 01/29/2014 | EP2689457A1 Differential infrared imager for gas plume detection |
| 01/29/2014 | EP2538761B1 Intelligent Power Module and related assembling method |
| 01/29/2014 | EP1438744B1 Method of forming a raised contact for a substrate |
| 01/29/2014 | CN203416153U Vehicle motor controller power module |
| 01/29/2014 | CN203415623U 发光装置及照明装置 Light emitting device and illumination device |
| 01/29/2014 | CN203415577U Embedded LED device and light-emitting device |
| 01/29/2014 | CN203415576U Multi-chip LED integration light source |
| 01/29/2014 | CN203415575U A LED with multiple primary colors |
| 01/29/2014 | CN203415574U Thermal-sensitive Darlington triode |
| 01/29/2014 | CN203415564U Protective quick-connect bidirectional triode thyristor module |
| 01/29/2014 | CN203413560U LED (light-emitting diode) lamp and lamp filament thereof |
| 01/29/2014 | CN103548361A Semiconductor device and microphone |
| 01/29/2014 | CN103548137A 混合光源 Hybrid light source |
| 01/29/2014 | CN103545417A 白光发光二极管 White light emitting diode |
| 01/29/2014 | CN103545305A Power module |
| 01/29/2014 | CN103545304A Structure and method for packaging light-emitting diode and drive chips |
| 01/29/2014 | CN103545303A IC package and assembly |
| 01/29/2014 | CN103545302A Three-dimensional integration scheme for infrared focal plane array and digital storage control chip |
| 01/29/2014 | CN103545301A LED component |
| 01/29/2014 | CN103545300A Light-emitting diode package structure |
| 01/29/2014 | CN103545299A High-voltage rectification silicon stack |
| 01/29/2014 | CN103545298A Power semiconductor module with at least one stress-reducing adjustment element |
| 01/29/2014 | CN103545297A Multi-chip overlapping and packing structure and manufacturing method thereof |
| 01/29/2014 | CN103545285A Semicondutor module and method for determining a current flowing through a load connection |
| 01/29/2014 | CN103545282A Insulated gate bipolar thyristor module and electrode power terminal |
| 01/29/2014 | CN103545281A Semiconductor device |
| 01/29/2014 | CN103545280A Multi-chip package |
| 01/29/2014 | CN103545226A Wafer-level semiconductor device and method for packaging same |
| 01/29/2014 | CN102299168B 功率用半导体装置 Power semiconductor device |
| 01/29/2014 | CN102194802B Electronic assembly body |
| 01/29/2014 | CN102110673B Wafer level MMCM (microwave multichip module) packaging structure using photosensitive BCB (benzocyclobutene) as dielectric layer and method |
| 01/28/2014 | US8637973 Packaged microelectronic components with terminals exposed through encapsulant |
| 01/28/2014 | US8637765 Single junction type cigs thin film solar cell and method for manufacturing the thin film solar cell |
| 01/28/2014 | US8637759 Notch filter for triple junction solar cells |
| 01/28/2014 | US8637332 Micro-reflectors on a substrate for high-density LED array |
| 01/23/2014 | WO2014014066A1 Method for bending semiconductor module terminal |
| 01/23/2014 | WO2014014012A1 Power semiconductor module |
| 01/23/2014 | WO2014013705A1 Semiconductor module |
| 01/23/2014 | WO2014012395A1 Stereo light-emitting device composed of flip-chip light-emitting unit array and manufacturing method therefor |
| 01/23/2014 | WO2014012346A1 Stereoscopic wrapped and encapsulated led chip |
| 01/23/2014 | US20140024174 Using an optically transparent solid material as a support structure for attachment of a semiconductor material to a substrate |
| 01/23/2014 | US20140021639 Vertical System Integration |
| 01/23/2014 | US20140021630 High performance ic chip having discrete decoupling capacitors attached to its ic surface |
| 01/23/2014 | DE112011105178T5 Halbleitervorrichtung Semiconductor device |
| 01/23/2014 | DE102013107787A1 Chipbaugruppe und verfahren zum herstellen einer chipbaugruppe Chip package and method of fabricating a chip package |
| 01/23/2014 | DE102013107593A1 Eingebetteter ic-baustein und verfahren zur herstellung eines eingebetteten ic-bausteins Embedded IC module and process for the preparation of an embedded IC module |
| 01/23/2014 | DE102012204085B4 Halbleitervorrichtung mit Wärmeverteiler und Lotlage und Verfahren zum Herstellen einer solchen A semiconductor device comprising heat spreader and brazing filler metal sheet and method for producing such |
| 01/23/2014 | DE102012106607A1 Method for sealing solar modules e.g. electrical functioning unencapsulated solar modules, in industrial environment, involves dimensioning length of semi-finished product by cross-cutting, where semi-finished product is sealed |
| 01/23/2014 | DE102009030958B4 Halbleiteranordnung mit einem Verbindungselement und Verfahren zur Herstellung einer solchen A semiconductor device comprising a connecting element and methods for producing such |
| 01/22/2014 | EP2688367A1 Led module, tube type lamp, and luminaire |
| 01/22/2014 | EP2688101A1 Method for electrically connecting vertically positioned substrates |
| 01/22/2014 | EP2688100A1 Semiconductor module and manufacturing method therefor |
| 01/22/2014 | EP2687070A1 Electro-static shielding apparatus, electronic device, and method for manufacturing said electro-static shielding apparatus |
| 01/22/2014 | EP2686892A1 Led having vertical contacts redistributed for flip chip mounting |
| 01/22/2014 | EP2686880A1 Led component |
| 01/22/2014 | CN203406287U Light emitting diode using phosphor powder |
| 01/22/2014 | CN203406286U Full-color light emitting diode with improved pins |
| 01/22/2014 | CN203406285U Full-color light emitting diode |
| 01/22/2014 | CN203406284U Light-emitting apparatus |
| 01/22/2014 | CN203406283U Display apparatus |
| 01/22/2014 | CN203406282U Emitter-packaging structure |
| 01/22/2014 | CN203406281U Three-dimensionally packaged MRAM memory with capacity of 512K x 40bit |
| 01/22/2014 | CN203406280U Three-dimensionally packaged SDRAM memory with capacity of 512M x 8bit |
| 01/22/2014 | CN103534805A 功率模块 Power Modules |
| 01/22/2014 | CN103534804A Apparatus and method for hybrid photovoltaic device having multiple, stacked, heterogeneous, semiconductor junctions |
| 01/22/2014 | CN103534796A Semiconductor device and method for manufacturing semiconductor device |
| 01/22/2014 | CN103532368A 智能功率模块 Intelligent Power Module |
| 01/22/2014 | CN103531687A A light emitting diode array |
| 01/22/2014 | CN103531671A Production process of light-emitting diode and light-emitting diode |
| 01/22/2014 | CN103531584A Light emitting device package |
| 01/22/2014 | CN103531583A A light emitting diode array module |
| 01/22/2014 | CN103531582A 半导体单元 Semiconductor unit |
| 01/22/2014 | CN103531581A 多芯片模块 A multi-chip module |
| 01/22/2014 | CN103531572A Wafer-level packaged optical subassembly and transceiver module having same |
| 01/22/2014 | CN103531545A Gallium-nitride element capable of restoring performance |
| 01/22/2014 | CN103530679A Semiconductor device and method of manufacturing the same |
| 01/22/2014 | CN103529635A LED (light emitting diode) plane light source for engine sheet clamp of digital color film processing machine |
| 01/22/2014 | CN103523741A Hybrid integrated component and method for the manufacture thereof |
| 01/22/2014 | CN102458019B Cct modulating method and led light source module |
| 01/22/2014 | CN102326251B Method for bonding high heat conductive insulating resin |
| 01/22/2014 | CN101324305B Light-emitting diode arrays and methods of manufacture |
| 01/21/2014 | US8635570 Self-configuring components on a device |
| 01/21/2014 | US8633762 Integrated circuit chip and transmitting /receiving system including the same |
| 01/21/2014 | US8633580 Integrated void fill for through silicon via |
| 01/21/2014 | US8632745 Method and apparatus for controlling stoichiometry in multicomponent materials |
| 01/21/2014 | DE202013105809U1 Leistungshalbleitermodul und Kontaktierungsanordnung Power semiconductor module and contacting arrangement |
| 01/16/2014 | WO2014011281A1 Methods for flip chip stacking |
| 01/16/2014 | WO2014010220A1 Submount, sealed semiconductor element, and method for fabricating same |
| 01/16/2014 | WO2014009939A1 Led illuminaton source |
| 01/16/2014 | WO2014009458A1 Electric machine |
| 01/16/2014 | US20140017821 On-SOI integrated circuit comprising a triac for protection against electrostatic discharges |
| 01/16/2014 | US20140015110 Semiconductor device and stacked semiconductor package having the same |
| 01/16/2014 | DE102013208142A1 Halbleitervorrichtung Semiconductor device |
| 01/16/2014 | DE102012212086A1 Verfahren zum herstellen einer komponente eines optoelektronischen bauelements und verfahren zum herstellen eines optoelektronischen bauelements A method of manufacturing a component of an optoelectronic device and methods of manufacturing an optoelectronic component |
| 01/16/2014 | DE102012106272A1 Arrangement of optoelectronic component e.g. LED, has coupling element whose electrical resistance is higher and lower than that of optoelectronic component, so that heat is applied to coupling element by heating resistor |
| 01/16/2014 | DE102012105176A1 Optoelektronischer Halbleiterchip The optoelectronic semiconductor chip |
| 01/16/2014 | DE102011003205B4 Halbleitervorrichtungsmodul Semiconductor device module |
| 01/16/2014 | DE102009061268B3 Verfahren zur Herstellung eines Halbleiterbauelementes A process for producing a semiconductor device |