Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
02/2014
02/12/2014CN103579215A 半导体支架 Semiconductor bracket
02/12/2014CN103579214A Light emitting chip and light emitting device having the same
02/12/2014CN103579213A Novel COB light source
02/12/2014CN103579212A Manufacturing process and product of LED emitting light comprehensively and effectively
02/12/2014CN103579211A 发光二极管封装 Light emitting diode package
02/12/2014CN103579210A Connection method of LED unit and heat dissipation substrate
02/12/2014CN103579209A Alternative 3D stacking scheme for DRAMs atop GPUs
02/12/2014CN103579208A Three-dimensional integrated circuits and fabrication thereof
02/12/2014CN103579207A Stacked packaging device and manufacturing method thereof
02/12/2014CN103579206A Stacked packaging device and manufacturing method thereof
02/12/2014CN103579205A Integrated system and method of making the integrated system
02/12/2014CN103579183A Interposer system and method
02/12/2014CN103579172A 功率用半导体装置模块 Power semiconductor device module
02/12/2014CN103579171A Semiconductor packaging piece and manufacturing method thereof
02/12/2014CN103579147A Equipotential electrode for converter valve
02/12/2014CN103579087A Manufacturing method of three-dimensional integrated circuit structure and three-dimensional integrated circuit structure
02/12/2014CN103579029A Package structure and the method of making same
02/12/2014CN103579015A Semiconductor package and method for forming the same
02/12/2014CN103578250A Three-dimensional integrated circuit and method for wireless information access thereof
02/12/2014CN102468278B Multi-chip stacking and packaging structure
02/12/2014CN102365739B Optoelectronic semiconductor component and display device
02/12/2014CN102197347B Wafer level buck converter
02/12/2014CN101452925B 半导体器件 Semiconductor devices
02/12/2014CN101171683B Multi-chip module and method of manufacture
02/11/2014US8648951 Semiconductor module, MOS type solid-state image pickup device, camera and manufacturing method of camera
02/11/2014US8648654 Integrated circuit and method for generating a layout of such an integrated circuit
02/11/2014US8648253 Machine and process for continuous, sequential, deposition of semiconductor solar absorbers having variable semiconductor composition deposited in multiple sublayers
02/06/2014WO2014022675A1 Multiple die face-down stacking for two or more die
02/06/2014WO2014022485A1 Reconstituted wafer-level microelectronic package
02/06/2014WO2014022418A1 Incorporation of passives and fine pitch through via for package on package
02/06/2014WO2014021112A1 Switching element unit
02/06/2014WO2014021077A1 Multilayer substrate and power module using multilayer substrate
02/06/2014WO2014020806A1 Cooling structure and power converter
02/06/2014WO2014020787A1 Electronic component module and mounting body therefor
02/06/2014WO2014020648A1 Electronic device
02/06/2014WO2014019861A1 Optoelectronic semiconductor component with sapphire flip-chip
02/06/2014WO2014019745A1 Power semiconductor clamping stack
02/06/2014WO2014019384A1 Power module and encapsulation method thereof
02/06/2014US20140035892 Incorporation of passives and fine pitch through via for package on package
02/06/2014US20140035166 Semiconductor device stack with bonding layer and wire retaining member
02/06/2014US20140035121 Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristics
02/06/2014US20140035114 Semiconductor package structure and method
02/06/2014US20140035093 Integrated Circuit Interposer and Method of Manufacturing the Same
02/06/2014US20140034104 Vertically integrated systems
02/06/2014US20140033519 Through silicon via repair
02/06/2014DE102013215124A1 Halbleitereinheit Semiconductor unit
02/06/2014DE102013209116A1 Leistungshalbleitervorrichtungsmodul Power semiconductor device module
02/06/2014DE102013206480A1 Halbleiterbauelement und Verfahren zum Herstellen eines Halbleiterbauelements A semiconductor device and method of manufacturing a semiconductor device
02/06/2014DE102013108075A1 Chip-Gehäuse und Verfahren zur Herstellung eines Chip-Gehäuses Chip package and method of manufacturing a chip package
02/06/2014DE102012213555A1 Method for manufacturing DCB substrate for e.g. power semiconductor component in power converter, involves electroplating metal film on metallization layer and around cover so as to form pocket at desired position of power component
02/06/2014DE102012106982A1 Verfahren zur Herstellung eines Leuchtmittels A method for producing a bulb
02/06/2014DE102005010156B4 Verfahren zum Ausbilden einer Anordnung aus gestapelten Einzelschaltkreisen A method of forming an array of stacked individual circuits
02/05/2014EP2693477A1 Pop encapsulation structure
02/05/2014EP2693476A1 Three-dimensional integrated circuit laminate and interlayer filler material for three-dimensional integrated circuit laminate
02/05/2014EP2693475A1 Three-dimensionally mounted semiconductor device and method for manufacturing same
02/05/2014EP2693473A1 Electronic semiconductor device intended for mounting in a pressed stack assembly, and a pressed stack assembly comprising such a device
02/05/2014EP2693472A2 Power semiconductor module and its method of manufacturing
02/05/2014EP2691983A1 An interposer having an inductor
02/05/2014CN203423180U LED plane packaging device capable of realizing 360 DEG light emitting
02/05/2014CN203423179U Three-phase fully-controlled bridge silicone-controlled rectifier assembly
02/05/2014CN203423178U Three-dimensional packaged SDRAM memory with capacity of 256M*8bit
02/05/2014CN203423177U Three-dimensional packaged SDRAM having 64M*48bit capacity
02/05/2014CN203423176U Three-dimensional packaged DDR1 memory having 64M*32bit capacity
02/05/2014CN203423175U Three-dimensional packaged SDRAM having 128M*16bit capacity
02/05/2014CN203423174U Three-dimensional packaged SDRAM having 512M*32bit capacity
02/05/2014CN203423173U Three-dimensional packaged SDRAM having 256K*32bit capacity
02/05/2014CN203423172U Three-dimensional packaged SDRAM having 1M*16bit capacity
02/05/2014CN203423171U Three-dimensional packaged SDRAM having 2M*8bit capacity
02/05/2014CN203422471U Approach detector device
02/05/2014CN103563110A Method for producing an optoelectronic semiconductor component and such a semiconductor component
02/05/2014CN103563078A Diode lighting arrangement
02/05/2014CN103563077A Semiconductor device and method for manufacturing same
02/05/2014CN103563071A Wiring board and high frequency module using same
02/05/2014CN103560195A Alternating-current light-emitting device capable of increasing light extraction efficiency and manufacturing method thereof
02/05/2014CN103560131A LED display device and manufacturing method thereof
02/05/2014CN103560130A Composite chip
02/05/2014CN103560129A Double-wafer high-power LED with adjustable color rendering index
02/05/2014CN103560128A High-light effect and high-power integrated LED with even light spots
02/05/2014CN103560127A Optical device and method for manufacturing same
02/05/2014CN103560119A Three-dimensional flexible substrate packaging structure used for multi-shield chips and three-dimensional flexible substrate manufacturing method
02/05/2014CN103557454A White-light LED (Light Emitting Diode) three dimensional light source module allowing light emitting in 360 degrees
02/05/2014CN102468279B Integrated circuit device and method for preparing same
02/05/2014CN102165589B Production process for surface-mounting ceramic LED package, surface-mounting ceramic LED package produced by said production process, and mold for producing said package
02/04/2014US8645892 Configurable circuit and mesh structure for integrated circuit
02/04/2014US8644030 Computer modules with small thicknesses and associated methods of manufacturing
02/04/2014US8643399 Asymmetric signal routing in a programmable logic device
02/04/2014US8642383 Dual-die package structure having dies externally and simultaneously connected via bump electrodes and bond wires
01/2014
01/30/2014WO2014017514A1 Composite electronic component and electronic apparatus provided with same
01/30/2014WO2014017228A1 Module
01/30/2014US20140028387 Monolithic integrated circuit chip integrating multiple devices
01/30/2014US20140027931 Stack packages using reconstituted wafers
01/30/2014US20140027895 Three-dimensional mounting semiconductor device and method of manufacturing three-dimensional mounting semiconductor device
01/30/2014US20140027794 Light emitting device for linear light source
01/30/2014DE202013105654U1 Multichip-Gehäusestruktur Multi-chip package structure
01/30/2014DE202013009024U1 Integrierte Schaltung, die auf einer Seite der Schaltung eine Quelle und einen Aufnehmer von elektromagnetischen Wellen/Strahlen hat An integrated circuit on one side of the circuit has a source and a receiver of electromagnetic waves / Radiation
01/30/2014DE102013108148A1 Elektrische Vorrichtungspackung mit einem Laminat und Verfahren zur Herstellung einer elektrischen Vorrichtungspackung mit einem Laminat An electrical device package having a laminate and process for the preparation of an electrical device package having a laminate
01/30/2014DE102012213309A1 Verfahren zum Herstellen eines Leuchtbands und Leuchtband A method of manufacturing a light-emitting and light-strip bands
01/30/2014DE102012213193A1 Anordnung von optischen halbleiterelementen Arrangement of optical semiconductor elements
01/30/2014DE102012211952A1 Leistungshalbleitermodul mit mindestens einem stressreduzierenden Anpasselement Power semiconductor module with at least one stress reducing matching element
01/30/2014DE102012106859A1 Verfahren zur Herstellung eines mehrfarbigen LED-Displays A process for producing a multi-colored LED displays
1 ... 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 ... 409