Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
02/2014
02/26/2014CN203456455U 发光二极管显示屏 LED display
02/26/2014CN203456454U Integrated LED?structure capable of giving out light of any color
02/26/2014CN203456453U LED with all faces shining
02/26/2014CN203456439U 混合集成电路模块 Hybrid IC module
02/26/2014CN103609107A Autostereoscopic display apparatus having optical magnification
02/26/2014CN103608922A Method for producing a plurality of optoelectronic semiconductor components in combination, semiconductor component produced in such a way, and use of said semiconductor component
02/26/2014CN103608921A LED array having embedded LED and method therefor
02/26/2014CN103608920A LED array comprising scattering portions on LEDs and method of manufacturing same
02/26/2014CN103606622A LED integrated-type light source
02/26/2014CN103606546A Optical device
02/26/2014CN103606545A LED flexible board light source module and manufacturing method thereof
02/26/2014CN102254881B 半导体装置 Semiconductor device
02/26/2014CN102237461B Light emitting device, light emitting device package and lighting system
02/26/2014CN102136472B Semiconductor apparatus module
02/25/2014US8659135 Semiconductor device stack and method for its production
02/20/2014WO2014028670A1 THIN SUBSTRATE PoP STRUCTURE
02/20/2014WO2014028066A1 Flexible sized die for use in multi-die integrated circuit
02/20/2014WO2014027536A1 Dc-dc converter device
02/20/2014WO2014027535A1 Semiconductor device and electronic device
02/20/2014WO2014026941A1 Semiconductor component and process for fabricating a semiconductor component
02/20/2014WO2013181244A3 High utilization photo-voltaic device
02/20/2014US20140051231 Method for permanently bonding wafers
02/20/2014US20140048954 Stacked microelectronic assembly with tsvs formed in stages with plural active chips
02/20/2014US20140048930 Conductive bump, semiconductor chip and stacked semiconductor package using the same
02/20/2014DE102012214491A1 Leuchtmodul und Verfahren zur Herstellung eines derartigen Leuchtmoduls Light-emitting module and method of manufacturing such a light-emitting module
02/20/2014DE102012214488A1 Herstellen eines bandförmigen Leuchtmoduls Producing a band-shaped light-emitting module
02/20/2014DE102012214487A1 Band-shaped light emitting module e.g. LED module has two portions that are formed separately and bonded directly, so that shining tape encapsulated into polymeric material of first portion is formed downstream to second portion
02/20/2014DE102012214484A1 Verfahren zum Herstellen eines bandförmigen Leuchtmoduls A method of manufacturing a band-shaped light-emitting module
02/20/2014DE102012214478A1 Flexible strip-shaped lighting module, has portion formed with polymer mass, attached with another portion over adhesive layer and located optically downstream to lighting strip, where adhesive layer rests on semiconductor light sources
02/20/2014DE102012207310B4 Halbleitervorrichtung Semiconductor device
02/20/2014DE102012107578A1 Optoelectronic component for light generation in optical position measuring device, has LED chip for emitting light, and masking article arranged above LED chip to mask light emitted by LED chip
02/20/2014DE102009042319B4 Verfahren zur Herstellung eines Sensorknoten-Moduls A method for producing a sensor node module
02/19/2014EP2699055A2 Light-emitting module and luminaire
02/19/2014EP2698817A1 Semiconductor device and method for manufacturing semiconductor device
02/19/2014CN203445150U High-heat-radiation LED lamp based on COB technology
02/19/2014CN203445117U Led封装结构及汽车车灯 Led package structure and car headlights
02/19/2014CN203445116U Planar silicon diode array
02/19/2014CN103594615A 大功率led模组 High power led module
02/19/2014CN103594464A COB packaging structure of light-emitting diode
02/19/2014CN103594463A Integrated LED displaying packaging module with LED chips arranged in wafers in inverted mode
02/19/2014CN103594462A LED integration packaging structure and packaging method thereof
02/19/2014CN103594461A Diodes, printable compositions of a liquid or gel suspension of diodes or other two-terminal integrated circuits, and methods of making same
02/19/2014CN103594460A Diodes, printable compositions of a liquid or gel suspension of diodes or other two-terminal integrated circuits, and methods of making same
02/19/2014CN103594459A LED lamp heat dissipation chip binding frame method with good cooling performance
02/19/2014CN103594458A Lining plate structure
02/19/2014CN103594449A Circuit board of IGBT module
02/19/2014CN103594446A IGBT module and span bridge electrode used for same
02/19/2014CN103594443A Bonded structure for package and substrate
02/19/2014CN103594388A Contact pads with sidewall spacers and method of making contact pads with sidewall spacers
02/19/2014CN103594386A Laminated packaging composition and making method thereof
02/19/2014CN102456682B LED (light emitting diode) lamp structure
02/19/2014CN102297351B LED (light emitting diode) light source module and manufacturing method thereof
02/19/2014CN102244053B Semiconductor light emitting device and power semiconductor device
02/19/2014CN102237301B Semiconductor device and manufacture method for the same
02/19/2014CN102005443B Light-emitting diode (LED) packaging structure and manufacturing method thereof
02/18/2014US8654807 Electrical devices formed using ternary semiconducting compounds
02/18/2014US8653655 Semiconductor device and manufacturing method thereof
02/18/2014US8653647 Plastic package and method of fabricating the same
02/18/2014US8653637 Stack type semiconductor package apparatus
02/13/2014WO2014024796A1 Semiconductor device and method for producing same
02/13/2014WO2014024622A1 Power module
02/13/2014WO2014024611A1 Method for producing semiconductor device
02/13/2014WO2014024250A1 Wiring board, method for manufacturing same, and semiconductor device
02/13/2014WO2014024108A1 Led package and manufacturing method
02/13/2014WO2013009871A8 Memory module in a package
02/13/2014US20140045280 Method for packaging circuits
02/13/2014US20140043885 Semiconductor device
02/13/2014US20140043148 Three-dimensional integrated circuit and method for wireless information access thereof
02/13/2014US20140042644 Flip-chip, face-up and face-down wirebond combination package
02/13/2014US20140042639 Apparatus, system, and method for wireless connection in integrated circuit packages
02/13/2014US20140042637 Low-impedance power delivery for a packaged die
02/13/2014US20140042623 System in package and method of fabricating same
02/13/2014US20140042601 Multi-chip stacking of integrated circuit devices using partial device overlap
02/13/2014US20140042578 Solid-state imaging apparatus and camera using the same
02/13/2014DE112011105247T5 Leistungsmodul Power module
02/13/2014DE10238037B4 Halbleitereinrichtung mit Gehäuse und Halterung A semiconductor device comprising housing and bracket
02/13/2014DE102013215049A1 Infrarotsensor Infrared sensor
02/13/2014DE102012218786B3 Method for manufacturing band shaped lighting device utilized for deformable LED tape, involves applying preformed walls on carrier, filling regions filled with filling compound above carrier beside one of walls, and curing filling compound
02/13/2014DE102012214219A1 LED module used in e.g. medical endoscope, has optical diffusing layer with minimal absorption function, that is arranged in optical path with aperture, and support side portion that is mounted with carrier with light sources
02/13/2014DE102012214216A1 Organisches Leuchtdiodenmodul und Verfahren zu dessen Herstellung An organic light emitting diode module and method for its production
02/13/2014DE102009044639B4 Bauelement mit einem Halbleiterchip und Verfahren zur Herstellung eines Moduls mit gestapelten Bauelementen Component having a semiconductor chip and method of manufacturing a module with stacked components
02/13/2014DE102008045614B4 Kontaktierung eines halbleiterbauelements oder halbleitermoduls mit einem vorgespannten drahtbauteil und verfahren zur kontaktierung Contacting a semiconductor component or semiconductor module with a prestressed wire member and method for contacting
02/13/2014DE102008012570B4 Leistungshalbleitermodul-System, Leistungshalbleitermodulanordnung und Verfahren zur Herstellung einer Leistungshalbleitermodulanordnung Power semiconductor module system, the power semiconductor module assembly and method of manufacturing a power semiconductor module assembly
02/13/2014DE102006010761B4 Halbleitermodul Semiconductor module
02/12/2014EP2695205A2 Method and apparatus for integrating an infrared (ir) photovoltaic cell on a thin film photovoltaic cell
02/12/2014EP2695192A1 Induced thermal gradients
02/12/2014EP2695188A2 High density microelectronics packaging
02/12/2014CN203434200U High-power full-angle uniform light-emitting LED light bar with separated fluorescent powder and chip
02/12/2014CN203434157U Full-color LED chip suitable for high-resolution LED display screen
02/12/2014CN203434156U 360-degree-luminescence LED device
02/12/2014CN203434155U COB surface light source
02/12/2014CN203434154U 方形整流桥 Square rectifier bridge
02/12/2014CN203434148U 半导体装置 Semiconductor device
02/12/2014CN103582946A Package-on-package assembly with wire bond to encapsulation surface
02/12/2014CN103579456A COB area light source and glue blocking wall manufacturing method thereof
02/12/2014CN103579453A 发光装置 Light-emitting device
02/12/2014CN103579452A LED light source capable of stimulating fluorescent powder on multiple faces
02/12/2014CN103579385A Solar cell combined power generation device
02/12/2014CN103579217A Power module packaged in ultra-small mode and packaging method thereof
02/12/2014CN103579216A Optical package module
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