Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
03/2014
03/06/2014WO2014034321A1 Power semiconductor module
03/06/2014WO2014033977A1 Semiconductor device
03/06/2014WO2014033879A1 Power module
03/06/2014WO2014033382A1 Body for pressing a part against a surface
03/06/2014WO2014033152A1 Housing, electronic assembly, housing composite, method for producing a housing and method for producing an electronic assembly
03/06/2014WO2014032938A1 Optoelectronic semiconductor component, and method for producing an optoelectronic semiconductor component
03/06/2014WO2014032702A1 Light-emitting device and method for manufacturing a light- emitting device
03/06/2014WO2013066920A3 Broad-area lighting systems and methods of its fabrication
03/06/2014US20140063744 Vertically Stacked Power FETS and Synchronous Buck Converter Having Low On-Resistance
03/06/2014US20140062586 Double through silicon via structure
03/06/2014US20140062547 Core voltage reset systems and methods with wide noise margin
03/06/2014US20140061949 Heterogeneous annealing method and device
03/06/2014US20140061946 Semiconductor Package Including Interposer with Through-Semiconductor Vias
03/06/2014US20140061895 Multi-Chip Module and Method of Manufacture
03/06/2014US20140061690 Light emitting device having surface-modified quantum dot luminophores
03/06/2014DE202006021263U1 Lichtemissionsvorrichtung und Anpassungsvorrichtung für diese The light emission device and adjustment device for this
03/06/2014DE102013216714A1 Licht emittierende Struktur und Beleuchtungseinheiten, aus denen diese besteht Light emitting structure and lighting units that make up this
03/06/2014DE102012215656A1 Leistungshalbleitermodul und Verfahren zur Herstellung eines Leistungshalbleitermoduls The power semiconductor module and method of producing a power semiconductor module
03/06/2014DE102012215651A1 Verbindungselement zur elektrisch leitenden Verbindung einer ersten Leistungselektronikeinrichtung mit einer zweiten Leistungselektronikeinrichtung Connecting element for electrically conductive connection to a first power electronic device to a second power electronic device
03/06/2014DE102012215514A1 Verfahren zum Herstellen eines LED-Moduls und LED-Modul A method for manufacturing an LED module and LED module
03/06/2014DE102012108160A1 Optoelektronisches Halbleiterbauelement und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements An optoelectronic semiconductor device and method for producing an optoelectronic semiconductor component,
03/05/2014EP2704538A2 Electronic apparatus comprising a processor and a memory, and method of optimizing the number of de-coupling capacitors in an electronic apparatus
03/05/2014EP2704195A2 Light emitting diode
03/05/2014EP2704194A1 Semiconductor power module and method for manufacturing the same
03/05/2014EP2704193A1 Semiconductor device and manufacturing method thereof
03/05/2014EP2704187A1 Method for producing electrical through hole interconnects and corresponding devices
03/05/2014EP2702619A1 Led light source
03/05/2014CN203466224U Voltage reduction and heat dissipation-integrated silicon chain module
03/05/2014CN203466214U Strip-shaped LED module capable of being used in parallel and in series
03/05/2014CN203466213U Led packaging structure and lamp
03/05/2014CN203466190U COB light source based on light conversion body
03/05/2014CN203466189U Micro-size SMD LED light
03/05/2014CN203466188U Novel bar-shaped COB device
03/05/2014CN203466187U Thermoelectric module
03/05/2014CN103620779A Opto-electronic modules and methods of manufacturing the same
03/05/2014CN103620778A Flip-chip, face-up and face-down centerbond memory wirebond assemblies
03/05/2014CN103620777A Methods and arrangements relating to semiconductor packages including multi-memory dies
03/05/2014CN103620776A Semiconductor device
03/05/2014CN103620775A Stacked chip-on-board module with edge connector
03/05/2014CN103620774A Flip-chip, face-up and face-down wirebond combination package
03/05/2014CN103620773A Multiple die face-down stacking for two or more die
03/05/2014CN103620772A Multi-chip module with stacked face-down connected dies
03/05/2014CN103620771A Semiconductor device
03/05/2014CN103620770A Stress-aware design for integrated circuits
03/05/2014CN103620769A Semiconductor device
03/05/2014CN103620768A Lead frame and power module
03/05/2014CN103620765A Heat sink for cooling of power semiconductor modules
03/05/2014CN103620763A Power semiconductor module and method of manufacturing same
03/05/2014CN103620762A Semiconductor device
03/05/2014CN103620298A Light guide
03/05/2014CN103618529A Modularized thyristor valve block for solid combination switch device
03/05/2014CN103618039A Method for packaging LED light source with 360-degree light-emitting angle
03/05/2014CN103617994A 5050 miniwatt packaging eight-pin lamp bead
03/05/2014CN103617993A Encapsulating method of LED light source adjustable in color temperature, color rendering index and brightness
03/05/2014CN102569224B Circuit carrier with high heat dissipation performance and related circuit modules
03/05/2014CN102347319B Package-on-package structures with reduced bump bridging
03/05/2014CN102024712B Packaging structure and method for manufacturing same
03/05/2014CN101840896B Flip-chip high-heat-radiation spheroidal array encapsulation structure
03/05/2014CN101783303B Laser bonding for stacking semiconductor substrates
03/04/2014US8665013 Monolithic integrated circuit chip integrating multiple devices
03/04/2014US8664974 Operational time extension
03/04/2014US8664666 Semiconductor device and process for fabricating the same
02/2014
02/27/2014WO2014030760A1 Device and method of manufacturing the same
02/27/2014WO2014030659A1 Insulating substrate、multilayer ceramic insulating substrate, joined structure of power semiconductor device and insulating substrate, and power semiconductor module
02/27/2014WO2014030458A1 Power semiconductor module
02/27/2014WO2014030254A1 Semiconductor device
02/27/2014WO2014029804A1 Optoelectronic component and method for producing an optoelectronic component
02/27/2014WO2014029773A1 Light-emitting diode arrangement for generating white light
02/27/2014WO2014029733A2 Optoelectronic sensor, optoelectronic component comprising an optoelectronic sensor and method for operating an optoelectronic sensor
02/27/2014US20140059325 Integrated circuit apparatus, three-dimensional integrated circuit, three-dimensional processor device, and process scheduler, with configuration taking account of heat
02/27/2014US20140054799 Three-Dimensional Multichip Module
02/27/2014US20140054772 Semiconductor packages including through electrodes and methods of manufacturing the same
02/27/2014US20140054761 On-Chip Heat Spreader
02/27/2014DE112012002165T5 Leistungshalbleitermodul und Verfahren zu dessen Herstellung The power semiconductor module and method for its production
02/27/2014DE102013210972A1 Halbleiterbauelement Semiconductor device
02/27/2014DE102013108967A1 Verfahren und Herstellung eines Elektronikmoduls und Elektronikmodul Processes and manufacturing an electronic module and electronic module
02/27/2014DE102013104111A1 Method for forming package-on-package (POP) semiconductor device of electronic product, involves stacking die portion on substrate, where thermal expansion coefficients of die portion and substrate are different relative to carrier
02/27/2014DE102013013856A1 LED for use in e.g. daytime running lamp of vehicle, has dielectric layer made from dielectric material e.g. plastic, glass or ceramics, and forming light exit surface of LED, where layer is directly arranged on phosporous element
02/27/2014DE102012214887A1 LED-Flächenstrahler LED Floodlight
02/27/2014DE102012107829A1 Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements Optoelectronic component and process for producing an optoelectronic component
02/27/2014DE102011002026A1 Halbleitermodul mit Schaltelementen A semiconductor module with switching elements
02/26/2014EP2701215A1 Light-emitting apparatus, backlight unit, liquid crystal display apparatus, and illumination apparatus
02/26/2014EP2701213A1 White light source and white light source system using same
02/26/2014EP2701193A2 Light emitting device
02/26/2014EP2701192A1 Semiconductor device, inverter device provided with semiconductor device, and in-vehicle rotating electrical machine provided with semiconductor device and inverter device
02/26/2014EP2701191A2 Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof
02/26/2014EP2701189A1 Method for self-assembly of substrates and devices obtained thereof
02/26/2014EP2700101A1 Improvements in or relating to thyristor clamped assemblies
02/26/2014EP2700100A1 Flip-chip, face-up and face-down centerbond memory wirebond assemblies
02/26/2014EP2700099A1 Multi-chip module with stacked face-down connected dies
02/26/2014EP2700098A1 Multiple die face-down stacking for two or more die
02/26/2014EP2700097A1 Flip-chip, face-up and face-down wirebond combination package
02/26/2014EP2700096A1 Stacked chip-on-board module with edge connector
02/26/2014CN203457060U Miniature semi-conductor bridge rectifier
02/26/2014CN203456504U 发光二极管显示装置 Light-emitting diode display device
02/26/2014CN203456501U COB packaging structure based on LED wafer structure
02/26/2014CN203456459U Infrared receiver module
02/26/2014CN203456458U Heat radiation type high-power LED apparatus
02/26/2014CN203456457U SMD LED structure characterized by polycrystalline packaging
02/26/2014CN203456456U LED structure characterized by polycrystalline packaging
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