Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
03/2014
03/19/2014EP2709148A1 Semiconductor device and manufacturing method thereof
03/19/2014EP2707968A2 Scalable high-bandwidth connectivity
03/19/2014CN203492237U Light emitting diode control circuit, package structure of light emitting diode control circuit and system of light emitting diode control circuit
03/19/2014CN203491297U Packaging device of LED area light source
03/19/2014CN203491291U Mechanically packaged LED device
03/19/2014CN203491260U Optical module and electronic device using same
03/19/2014CN203491259U Large-power white light device for integrated packaging of LED chips
03/19/2014CN203491258U Bridge LED COB packaging device
03/19/2014CN203491257U Novel COB (Chip On Board) light source with high color rendering index
03/19/2014CN203491256U A high-voltage silicon stack diode
03/19/2014CN203491251U Sheet-type rectifier-bridge pile-packaging structure
03/19/2014CN103650362A Scalable high-bandwidth connectivity
03/19/2014CN103650318A Power semiconductor module and electric power conversion device using same
03/19/2014CN103650140A Wafer scale packaging platform for transceivers
03/19/2014CN103650139A Lighting device
03/19/2014CN103650138A Semiconductor device and semiconductor device manufacturing method
03/19/2014CN103650137A Power semiconductor module
03/19/2014CN103650136A Three-dimensional integrated circuit having stabilization structure for power supply voltage, and method for manufacturing same
03/19/2014CN103650135A Expanded semiconductor chip and semiconductor device
03/19/2014CN103650134A Semiconductor device
03/19/2014CN103650131A Semiconductor device
03/19/2014CN103650129A Chip stacking
03/19/2014CN103649697A Integral optical sensor package
03/19/2014CN103646943A Wafer packaging structure
03/19/2014CN103646942A Semiconductor packaging structure applied to power switcher circuit
03/19/2014CN103642441A Adhesive composition, method for manufacturing semiconductor device, and semiconductor device
03/19/2014CN102263040B Method for encapsulating semiconductor electronic component
03/18/2014US8674756 Power cut-off technique for semiconductor device
03/18/2014US8674507 Wafer level processing method and structure to manufacture two kinds of interconnects, gold and solder, on one wafer
03/18/2014US8674496 System and method for fine pitch PoP structure
03/18/2014US8674356 Electrically measurable on-chip IC serial identifier and methods for producing the same
03/13/2014WO2014039833A2 Integrated led based illumination device
03/13/2014WO2014038299A1 Power semiconductor module
03/13/2014WO2014038066A1 Power semiconductor device
03/13/2014WO2014037829A1 Laser de-bond of carrier wafer from device wafer
03/13/2014WO2014037739A1 Led package
03/13/2014WO2014037738A1 Led thermal management
03/13/2014WO2014037112A1 Measuring module for remission photometric analysis and method for the production thereof
03/13/2014WO2014036939A1 Warm white light-emitting diode and manufacturing method thereof
03/13/2014US20140073089 Chip package and manufacturing method thereof
03/13/2014US20140070899 Cancelling supply noise in a voltage controlled oscillator circuit
03/13/2014US20140070880 Semiconductor device
03/13/2014US20140070386 Semiconductor Package with Connecting Plate for Internal Connection
03/13/2014DE112012002724T5 Leiterrahmen und Leistungsmodul Ladder frame and power module
03/13/2014DE102013109825A1 System und Verfahren für einen kernlosen Transformator System and method for a coreless transformer
03/13/2014DE102013108987A1 Halbleitervorrichtungsbaugruppe und Verfahren für die Bildung einer Baugruppe hiervon A semiconductor device assembly and method for forming an assembly thereof,
03/13/2014DE102012214828A1 ANORDNUNG ZUR ERZEUGUNG VON WEIßEM LICHT ARRANGEMENT FOR THE PRODUCTION OF WHITE LIGHT
03/13/2014DE102012108522A1 Method for manufacturing semiconductor stack for stacking semiconductor chips with components for three-dimensional integration of electronic circuit, involves arranging through-contacts in aperture after connecting stack components
03/13/2014DE102012106566A9 Leistungshalbleiterchip mit zwei Metallschichten auf einer Fläche Power semiconductor chip with two metal layers on a surface
03/13/2014DE102004008148B4 Sensor mit Membran und Verfahren zur Herstellung des Sensors Sensor with membrane and method of manufacturing the sensor
03/12/2014EP2706572A2 Light emitting device
03/12/2014EP2706570A2 Light emitting diode
03/12/2014EP2705534A2 Wafer scale packaging platform for transceivers
03/12/2014EP2705533A1 Package-on-package assembly with wire bonds to encapsulation surface
03/12/2014DE202013011466U1 Elektronische Anzeige, die auf der nanohalbleiterkristallbasierten beziehungsweise auantenpunktbasierten, lichtemittierenden Diode (kurz QLED) basiert Electronic display, the (short QLED) based on the nano semiconductor crystal based or auantenpunktbasierten, light-emitting diode
03/12/2014DE202009018878U1 Lichtemissionsvorrichtungsbaugruppe Light-emitting device assembly
03/12/2014CN203481230U Intelligent power module
03/12/2014CN203481229U Series-parallel COB light source module group
03/12/2014CN203481228U LED packaging structure and bulb
03/12/2014CN203481227U Lead frame structure of light-emitting module group
03/12/2014CN203481226U Large power crimping type IGBT device
03/12/2014CN203481216U Three-phase full-bridge fast-recovery rectifier module
03/12/2014CN103635999A Semiconductor device
03/12/2014CN103635998A Power semiconductor housing with contact mechanism
03/12/2014CN103635744A Luminaire with a potting compound
03/12/2014CN103635739A Lighting module for modular lighting system
03/12/2014CN103633229A Light emitting diode module and making method thereof
03/12/2014CN103633228A Light emitting package and method for manufacturing light emitting package
03/12/2014CN103633224A LED (light-emitting diode) light source module and production process thereof
03/12/2014CN103633219A Light-emitting diode element
03/12/2014CN103633171A High-current bypass diode for concentrating photovoltaic system
03/12/2014CN103633081A High-isolation voltage electric-light-electric isolation structure
03/12/2014CN103633080A LED (light emitting diode) lamp with flexible substrate and manufacturing method
03/12/2014CN103633079A Light emitting device
03/12/2014CN103633078A Press fitting device for flat power semiconductor devices
03/12/2014CN103633077A Power module
03/12/2014CN103633076A Chip type package on encapsulating piece
03/12/2014CN103633075A Package-on-package semiconductor device
03/12/2014CN103633074A Packaging structure for million sets of encoding transmitting chips
03/12/2014CN103633073A Detachable SiP (system in package) structure capable of being assembled
03/12/2014CN103633048A Three-dimensional memory (3D-M) with reading/writing voltage generator chip
03/12/2014CN103633044A Semiconductor device
03/12/2014CN103633002A Physical design symmetry and integrated circuits enabling three dimentional (3d) yield optimization for wafer to wafer stacking
03/12/2014CN103632699A Three-dimensional memory containing address/data converter chip
03/12/2014CN103629576A High-voltage integration driving LED (Light Emitting Diode) light source
03/12/2014CN102623447B Light-emitting diode module
03/12/2014CN102315210B Semiconductor device including semiconductor packages stacked on one another
03/12/2014CN102270631B Light-emitting device
03/12/2014CN101958255B Method for ultra thin wafer handling and processing and product of thin wafer handling and processing
03/12/2014CN101728371B Integrated circuit structure
03/12/2014CN101553922B Microelectronic package structure and method for manufacturing same
03/12/2014CN101350334B Semiconductor assembly having housing
03/11/2014US8671369 Quantum Karnaugh map
03/11/2014US8669781 Semiconductor device
03/06/2014WO2014035951A1 Co-support circuit panel and microelectronic packages
03/06/2014WO2014035950A1 Co-support system and microelectronic assembly
03/06/2014WO2014035533A1 Ultra slim rf package for ultrabooks and smart phones
03/06/2014WO2014034691A1 Chip stack, semiconductor devices having the same, and manufacturing methods for chip stack
03/06/2014WO2014034411A1 Electric power semiconductor device
03/06/2014WO2014034323A1 Electrical circuit device and method for producing electrical circuit device
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