Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
03/2014
03/27/2014US20140082936 Method of manufacturing a wiring substrate
03/27/2014DE102013103578A1 Gehäuseanordnung und Verfahren zum Herstellen derselben Housing assembly and method of manufacturing the same
03/27/2014DE102013103489A1 Wärmeableitung durch Dichtungsringe in 3DIC-Struktur Heat dissipation by sealing rings in 3DIC structure
03/27/2014DE102012222772A1 Organisches optoelektronisches Bauelement Organic optoelectronic component
03/27/2014DE102012217609A1 Optoelectronic semiconductor device i.e. LED, has support substrate embedded in mold body, and optoelectronic semiconductor chip arranged above top side of substrate, where top side of substrate flushingly terminates with mold body top side
03/27/2014DE102012217521A1 Optoelektronisches Bauelement Optoelectronic component
03/27/2014DE102012216949A1 Carrier for interconnecting electro technical component e.g. switching or driving device of electric motor vehicle component, has control signal conductor strip and high current conductor strips that are formed in electric lines
03/27/2014DE102012109146A1 Ringlichtmodul und Verfahren zur Herstellung eines Ringlichtmoduls Ring light module and method of producing a ring light module
03/27/2014DE102012109131A1 Optoelektronische Bauelementevorrichtung, Verfahren zum Herstellen einer optoelektronischen Bauelementevorrichtung und Verfahren zum Betreiben einer optoelektronischen Bauelementevorrichtung Optoelectronic Devices device, method of manufacturing an opto-electronic device components and methods of operating an opto-electronic device components
03/27/2014DE102012109107A1 Circuit arrangement for use in motor vehicle headlight, has conduction path to be separated from another conduction path and including carrier contact region, over which bond is connected with element contact region of component element
03/27/2014DE102012109104A1 Beleuchtungseinrichtung, Hinterleuchtung für ein Display oder einen Fernseher und Display oder Fernseher Lighting device backlighting for a display or a display or TV and TV
03/27/2014DE102012109028A1 Optoelektronisches Halbleiterbauteil und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils An optoelectronic semiconductor device and method for producing an optoelectronic semiconductor component,
03/27/2014DE102012107796A1 Light-emitting semiconductor component e.g. LED chip has semiconductor chip whose characteristic wavelength is smaller than another characteristic wavelength and forward voltage has greater temperature dependence than forward voltage
03/26/2014EP2711981A1 Circuit substrate for large-capacity module periphery circuit, and large-capacity module including periphery circuit employing circuit substrate
03/26/2014CN203504514U MOS chip parallel current sharing integrated switch and packaging module thereof
03/26/2014CN203503709U Circuit board and light emitting product
03/26/2014CN203503707U Paster LED
03/26/2014CN203503656U Surface-mount-device type photoelectric coupler black ceramic packaging shell
03/26/2014CN203503655U Four-passage isolation type firing circuit
03/26/2014CN203503654U High-brightness dimmable COB light source
03/26/2014CN203503653U Light-emitting diode chip
03/26/2014CN203503652U Multi-color-temperature LED lamp bead
03/26/2014CN203503651U Novel high power LED light source
03/26/2014CN203503643U Power module free of bending of power terminals
03/26/2014CN103688355A Integrated circuit design using through silicon vias
03/26/2014CN103688352A Semiconductor device and method for manufacturing semiconductor device
03/26/2014CN103682151A Photovoltaic cell module
03/26/2014CN103682144A Organic light emitting device and power supply device thereof
03/26/2014CN103682066A Light-emitting diode module and manufacturing method thereof
03/26/2014CN103682056A Optical structure and illumination device with optical structure
03/26/2014CN103682041A 发光装置 Light-emitting device
03/26/2014CN103682035A Wiring board, light-emitting device, and method of manufacturing wiring board
03/26/2014CN103681894A Solar cell module and manufacturing method thereof
03/26/2014CN103681723A Light emitting diode
03/26/2014CN103681649A Proximity sensor package and packing method thereof
03/26/2014CN103681648A Electrical circuit and method for producing electrical circuit
03/26/2014CN103681647A Packaging structure and manufacturing method thereof
03/26/2014CN103681646A Stacked semiconductor devices and method of making same
03/26/2014CN103681645A Three-dimensional semiconductor package device having enhanced security
03/26/2014CN103681644A High voltage LED with improved heat dissipation and light extraction
03/26/2014CN103681643A LED packaging method and LED packaging device
03/26/2014CN103681642A Fast recovery rectification diode parallel connection modules
03/26/2014CN103681641A Stacked semiconductor device and printed circuit board
03/26/2014CN103681640A Laminated semiconductor device and method for manufacturing same
03/26/2014CN103681639A A system-level packaging structure and a packaging method thereof
03/26/2014CN103681638A Organic semiconductor illumination device
03/26/2014CN103681637A Semiconductor device
03/26/2014CN103681591A Semiconductor device
03/26/2014CN103681584A Semiconductor device having a clip contact
03/26/2014CN103681572A Multi-chip module power clip
03/26/2014CN103681561A Passive devices in package-on-package structures and methods for forming the same
03/26/2014CN103681552A Semiconductor power module and method for manufacturing the same
03/26/2014CN103681536A Semiconductor device and manufacturing method thereof
03/26/2014CN103681517A Thermal interface material for use in chip stacks
03/26/2014CN103681371A Silica-based wafer level fan-out encapsulation method and silica-based wafer level fan-out encapsulation structure
03/26/2014CN103681358A Chip package substrate and chip package structure and manufacturing methods thereof
03/26/2014CN103680340A Integrated LED display encapsulated module suitable for ultrahigh display density
03/26/2014CN103672771A Light-emitting device and method of manufacturing the same
03/26/2014CN102437154B Forming method of spheroid optical coupler transmission medium
03/26/2014CN102349169B LED module for modified lamps and modified LED lamp
03/26/2014CN102254877B Power module without metal baseplate
03/26/2014CN102208402B High-color-rendering light-emitting diode (LED) chip module, white light LED device and manufacturing method thereof
03/26/2014CN102201380B 半导体装置 Semiconductor device
03/26/2014CN102201349B Circuit component built-in module and manufacturing method therefor
03/26/2014CN102169937B Light emitting diode, light emitting diode package, method of manufacturing light emitting diode and illumination system
03/25/2014US8683414 Semiconductor integrated circuit device with independent power domains
03/25/2014US8680913 Configurable clock network for programmable logic device
03/25/2014US8680533 Light-emitting device having light-emitting elements with a shared electrode
03/25/2014US8677929 Method and apparatus for masking solar cell substrates for deposition
03/20/2014WO2014042264A1 Connection terminal for power module
03/20/2014WO2014042165A1 Semiconductor device and method for manufacturing semiconductor device
03/20/2014WO2014041936A1 Semiconductor device, method for attaching heat dissipating member to semiconductor device, and method for manufacturing semiconductor device
03/20/2014WO2014041722A1 Semiconductor device
03/20/2014WO2014041684A1 Method for manufacturing semiconductor device
03/20/2014WO2014040993A1 Optoelectronic semiconductor device and carrier assembly
03/20/2014WO2014040614A1 Method for producing an optoelectronic device and optoelectronic device
03/20/2014US20140082345 Semiconductor device
03/20/2014US20140080256 Method for manufacturing package structure with electronic component
03/20/2014US20140080236 Multichip light emitting diode (led) and method of manufacture
03/20/2014US20140077395 Integrated circuit device
03/20/2014US20140077393 Apparatus and method for high density multi-chip structures
03/20/2014US20140077390 Electronic apparatus
03/20/2014US20140077382 Semiconductor packages having warpage compensation
03/20/2014US20140077381 Semiconductor Device and Method of Forming FO-WLCSP with Multiple Encapsulants
03/20/2014DE202013104219U1 Rand-Beleuchtung und Direkt-Beleuchtung kombinierendes Hintergrundlichtmodul Edge lighting and direct lighting a combining backlight module
03/20/2014DE202013010994U1 Lichtemittierendes Bauelement, das eine Fläche besitzt, die in einer sphärischen Form ausgeführt ist The light emitting device having a surface which is executed in a spherical shape
03/20/2014DE202012011948U1 LED-Modul mit Flächenverguß LED module with Flächenverguß
03/20/2014DE102013110087A1 Lichtemittierende-Vorrichtungs-Baugruppe und Scheinwerfer für Fahrzeug mit derselben Light Emitting Device assembly and headlight for car with the same
03/20/2014DE102013109095A1 Halbleitergehäusevorrichtung mit passiven energiebauteilen Semiconductor package device with passive energy ponents
03/20/2014DE102012216738A1 Optoelektronisches bauelement Opto-electronic-device
03/20/2014DE102012216618A1 Anordnung von mindestens zwei Wafern zum Detektieren von elektromagnetischer Strahlung und Verfahren zum Herstellen der Anordnung Arrangement of at least two wafers for detecting electromagnetic radiation and methods of making the arrangement
03/20/2014DE102012216552A1 LED lighting device manufacturing method, involves covering LED chip with converter layer, filling matrix material in converter layer, roughening surface of LED chip, and applying adhesion promoter on surface of LED chip
03/20/2014DE102012108879A1 Optoelektronischer Halbleiterchip mit mehreren nebeneinander angeordneten aktiven Bereichen The optoelectronic semiconductor chip with a plurality of adjacently disposed active areas
03/20/2014DE102012108627A1 Optoelektronische Halbleitervorrichtung und Trägerverbund Optoelectronic semiconductor device and carrier assembly
03/20/2014DE102012107668A1 Bauelementanordnung Component arrangement
03/20/2014DE102010035980B4 Anschlusseinrichtung für ein Leistungshalbleitermodul Connection device for a power semiconductor module
03/20/2014DE102010033374B4 Einrichtung zur elektrischen Verbindung einer Leistungsbaugruppe mit Terminalflächenelementen Means for electrically connecting a power module with the terminal surface elements
03/19/2014EP2709177A2 Lead configuration for and in a light emitting device
03/19/2014EP2709174A2 Light emitting device
03/19/2014EP2709149A1 Semiconductor device and manufacturing method thereof
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