Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
04/2014
04/09/2014EP2717313A2 Large area LED-lighting device
04/09/2014EP2717300A1 Semiconductor device
04/09/2014CN203536467U LED device having transition substrate
04/09/2014CN203536436U High-brightness low-luminous decay and high anti-static light emitting diode
04/09/2014CN203536435U Subminiature packaged power supply module
04/09/2014CN203536434U LED device and LED display module
04/09/2014CN203536433U LED module substrate
04/09/2014CN203536432U Photoelectric module of surface-mounted type integrated power LED
04/09/2014CN103718292A Thin film structure for high density inductors and redistribution in wafer level packaging
04/09/2014CN103715346A LED lighting unit and manufacturing method thereof
04/09/2014CN103715334A Lighting device
04/09/2014CN103715333A Illumination component package structure
04/09/2014CN103715330A Covering type circuit structure for interconnection luminescence semiconductor
04/09/2014CN103715191A Lighting device
04/09/2014CN103715190A Luminescence device
04/09/2014CN103715189A Lighting device and illuminating device
04/09/2014CN103715188A LED emitter with improved white color appearance
04/09/2014CN103715187A Multi-chip packaging structure for generating symmetrical uniform mixed light source
04/09/2014CN103715186A Multi-chip packaging structure for generating symmetrical uniform mixed light source
04/09/2014CN103715185A Diode and manufacturing method thereof
04/09/2014CN103715184A Three-dimensional multi-chip storage system packaging structure based on flexible base board and manufacturing method thereof
04/09/2014CN103715183A Semiconductor device
04/09/2014CN103715182A Thin film solar cell assembly and preparation method thereof
04/09/2014CN103715167A Semiconductor device, apparatus of estimating lifetime, method of estimating lifetime
04/09/2014CN103715166A Apparatus and method for a component package
04/09/2014CN103715106A Intelligent power module manufacturing method and intelligent power module
04/09/2014CN103713331A Proximity sensor and circuit layout method thereof
04/09/2014CN102479888B Method for filling and sealing fluorescent layer in groove space defined by two optical lenses and stripper loops
04/09/2014CN102412358B Packaging substrate
04/09/2014CN102098876B Manufacturing process for circuit substrate
04/09/2014CN101996978B Chip package body and forming method thereof
04/09/2014CN101908532B Thin double-faced display OLED (Organic Light Emitting Diode) device and manufacturing method thereof
04/09/2014CN101859757B Stack light-emitting diode chip structure and manufacturing method thereof
04/09/2014CN101604724B Light emitting elements, light emitting devices including light emitting elements and methods for manufacturing such light emitting elements and/or devices
04/08/2014US8692355 Minute capacitance element and semiconductor device using the same
04/08/2014US8692173 Solar tracking sensor array
04/03/2014WO2014052273A1 PoP STRUCTURE WITH ELECTRICALLY INSULATING MATERIAL BETWEEN PACKAGES
04/03/2014WO2014052138A1 Interposer having embedded memory controller circuitry
04/03/2014WO2014051804A1 Film interposer for integrated circuit devices
04/03/2014WO2014050389A1 Power semiconductor module
04/03/2014WO2014050278A1 Power semiconductor module
04/03/2014WO2014049807A1 Semiconductor device and power conversion apparatus using same
04/03/2014WO2014049154A2 Optoelectronic component with protective circuit
04/03/2014WO2014049033A1 Optoelectronic assembly and method for operating an optoelectronic assembly
04/03/2014WO2014048902A1 Optoelectronic component, method for producing an optoelectronic component and optoelectronic component device
04/03/2014WO2014048832A1 Optoelectronic device
04/03/2014WO2014048830A1 Optoelectronic component
04/03/2014WO2014048699A1 Optoelectronic semiconductor component and method for producing said component
04/03/2014US20140092598 Method for embedding a led network
04/03/2014US20140091479 Semiconductor device with stacked semiconductor chips
04/03/2014US20140091460 Semiconductor device and method of fabricating the same
04/03/2014DE19964481B4 MOS-Halbleiteranordnung mit Schutzeinrichtung unter Verwendung von Zenerdioden MOS semiconductor device with protection device using Zener diodes
04/03/2014DE102012217967A1 Konfokales Mikroskop mit frei einstellbarer Probenabtastung Confocal microscope with freely adjustable sample scanning
04/03/2014DE102012217957A1 Verfahren zur Herstellung einer Mikro-LED-Matrix, Mikro-LED-Matrix und Verwendung einer Mikro-LED-Matrix A process for producing a micro-LED matrix, micro-LED array and using a micro-LED matrix
04/03/2014DE102012217932A1 Optoelectronic component has LEDs whose contact surfaces are electrically contacted with the contact surfaces of Zener diodes that are electrically connected in series, such that the LEDs are electrically connected in series
04/03/2014DE102012216148A1 Electronic circuit device for use in electronic commutated electromotor, has electrical conductive connection unit extending between electrical bonding surfaces and electrically connected with one another
04/03/2014DE102012109274A1 Optoelektronisches Bauelement, Verfahren zum Herstellen eines optoelektronischen Bauelementes, Verfahren zum Betreiben eines optoelektronischen Bauelementes Optoelectronic component, A method of manufacturing an optoelectronic component, A method of operating an optoelectronic component
04/03/2014DE102012109271A1 Optoelektronische Bauelementevorrichtung, Verfahren zum Herstellen einer optoelektronischen Bauelementevorrichtung und ein Verfahren zum Betreiben einer optoelektronischen Bauelementevorrichtung Optoelectronic Devices device, method for manufacturing an optoelectronic components apparatus and method for operating an opto-electronic device components
04/03/2014DE102012109216A1 Optoelektronische Baugruppe und Verfahren zum Betreiben einer optoelektronischen Baugruppe The optoelectronic assembly and method of operating an optoelectronic assembly
04/03/2014DE102012019391A1 Leitungshalbleitergehäuse mit redundanter Funktionalität Line semiconductor package with redundant functionality
04/03/2014DE102008051443B4 Halbleitermodul und Herstellungsverfahren hierfür Semiconductor module, and manufacturing method thereof
04/02/2014EP2713397A2 Optical arrangement and illumination device with an optical arrangement
04/02/2014EP2713396A1 Overlay circuit structure for interconnecting semiconductor light emitting devices
04/02/2014EP2713394A1 3 level power converter half bridge
04/02/2014CN203521459U Light-emitting assembly and light-emitting device
04/02/2014CN203521408U LED light source based on silver-plated aluminum substrate
04/02/2014CN203521407U Power semiconductor module with at least one stress-reducing adaptation element
04/02/2014CN203521406U Multi-chip overlapping and packing structure
04/02/2014CN203517379U Lamp bulb based on inversely-installed LED chips and transparent ceramic substrates
04/02/2014CN103700753A 360-degree luminous flexible LED (Light-emitting Diode) light bar
04/02/2014CN103700696A Uniformly radiating GaN tube core adopting tube series connection structure
04/02/2014CN103700655A Chip LED (Light-Emitting Diode)
04/02/2014CN103700654A LED (Light-Emitting Diode) based on COB (Chip On Board) package and manufacturing method thereof
04/02/2014CN103700653A LED (Light-Emitting Diode) light source packaging structure
04/02/2014CN103700652A Spiral LED package lamp filament
04/02/2014CN103700651A High-color rendering LED lamp filament
04/02/2014CN103700633A 半导体封装件 Semiconductor package
04/02/2014CN102437219B Novel crystalline silicon solar module structure
04/02/2014CN102195113B Impedance transformer, integrated circuit device, amplifier, and communicator module
04/02/2014CN102194949B Light emitting device
04/02/2014CN101697367B Method for preparing LED by using transparent ceramics
04/01/2014US8689031 Semiconductor device and power supply control method of the semiconductor device
04/01/2014US8686572 Apparatus for stacking integrated circuits
04/01/2014US8686549 Reconfigurable elements
03/2014
03/27/2014WO2014046058A1 Power module semiconductor device and inverter device, power module semiconductor device producing method, and mold
03/27/2014WO2014046052A1 Chip support substrate, method for supporting chip, three-dimensional integrated circuit, assembly device, and method for manufacturing three-dimensional integrated circuit
03/27/2014WO2014045842A1 Semiconductor device
03/27/2014WO2014045734A1 Semiconductor module
03/27/2014WO2014045518A1 Antenna, transmitting apparatus, receiving apparatus, three-dimensional integrated circuit, and non-contact communication system
03/27/2014WO2014045435A1 Method for producing semiconductor device, and semiconductor device
03/27/2014WO2014045349A1 Semiconductor module
03/27/2014WO2014045219A1 Light source
03/27/2014WO2014044638A1 Optoelectronic component
03/27/2014WO2014044463A1 Device having at least two wafers for detecting electromagnetic radiation and method for producing said device
03/27/2014WO2014011579A3 Hybrid computing module
03/27/2014US20140087492 Exclusion Zone for Stress-Sensitive Circuit Design
03/27/2014US20140084997 Transmit/receive switch with series, doubly-floating device and switched bias voltage
03/27/2014US20140084488 Multi-chip semiconductor device
03/27/2014US20140084477 Noise attenuation wall
03/27/2014US20140084311 Light-emitting device
1 ... 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 ... 409