Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
04/2014
04/17/2014WO2014056866A1 Large area led-lighting device
04/17/2014WO2014056762A2 Method for producing an optoelectronic semiconductor component and optoelectronic semiconductor component
04/17/2014WO2014031547A3 Method of temporarily or permanently attaching microelectronic devices or interposers to substrate for mounting, handling or testing and components useful therefor
04/17/2014US20140106508 Structures embedded within core material and methods of manufacturing thereof
04/17/2014US20140104968 Metallization scheme for integrated circuit
04/17/2014US20140104471 Semiconductor module, mos type solid-state image pickup device, camera and manufacturing method of camera
04/17/2014US20140103544 Semiconductor device
04/17/2014US20140103543 Semiconductor device
04/17/2014US20140103502 Semiconductor device
04/17/2014US20140103494 Nearly Buffer Zone Free Layout Methodology
04/17/2014US20140103371 Lead frame for light emitting device package, light emitting device package, and illumination apparatus employing the light emitting device package
04/17/2014DE112012002841T5 Invertierte metamorphe Solarzelle mit Mehrfachübergängen (IMM-Solarzelle) und zugehöriges Herstellungsverfahren Inverted metamorphic solar cell with multiple transitions (IMM solar cell) and manufacturing method thereof
04/17/2014DE112012002633T5 System und Verfahren zum Bearbeiten von horizontal ausgerichteten Nanofasern aus Graphit in einem in 3D Chip-Stapeln verwendeten Material für eine thermische Grenzfläche System and method for processing horizontally oriented graphite nanofibers in a material used in 3D Chip Stack for a thermal interface
04/17/2014DE102013220846A1 Energieversorgungsmodul Power supply module
04/17/2014DE102013111225A1 Halbleitervorrichtung mit Abtastfunktionalität A semiconductor device with scanning functionality
04/17/2014DE102013103580A1 Dreidimensional gestapelte Gehäuseanordnung und Verfahren zum Herstellen derselben Three-dimensional stacked housing assembly and method of making same
04/17/2014DE102012218932A1 Electronic component for heating electronic power components, has electronic components connected with cooling body by using connector, and heat transfer element arranged between electronic components and cooling body
04/17/2014DE102012218561A1 Electronic module of multiple modules for use in tetrahedral coolant container, has metal layer that comprises edge region which is directly connected to support
04/17/2014DE102012218538A1 Verfahren zur Herstellung einer Lichterzeugungseinheit A method for manufacturing a light generating unit
04/17/2014DE102012217105A1 Elektrische Schaltung und Verfahren zum Herstellen einer elektrischen Schaltung Electrical circuit and method for establishing an electrical circuit
04/17/2014DE102012109177A1 Optoelektronisches Halbleiterbauelement Optoelectronic semiconductor component
04/17/2014DE102012109111A1 Optische Anordnung und Beleuchtungsvorrichtung mit optischer Anordnung Optical assembly and illumination device with optical alignment
04/17/2014DE102007017461B4 Vorrichtung mit einer elektrischen Einrichtung und einem Modul zur Energieversorgung der elektrischen Einrichtung Device with an electrical device and a module for the energy supply of the electrical device
04/16/2014EP2720267A1 Semiconductor storage device and method for producing the same
04/16/2014EP2720266A2 Luminescence device
04/16/2014EP2720265A1 Cooling body for light-emitting diode array
04/16/2014EP2720263A1 Semiconductor device
04/16/2014EP2718971A1 Diode lighting arrangement
04/16/2014EP2718970A2 Led array comprising scattering portions on the leds and method of manufacturing the same
04/16/2014CN203553220U LED nixie tube
04/16/2014CN203553218U Silica gel lens structure of LED module with high efficiency and wide optical angle
04/16/2014CN203553216U Scattering type LED light-emitting chip structure
04/16/2014CN203553215U Uniform light mixing color temperature adjustable type chip carrier
04/16/2014CN203553214U LED filament
04/16/2014CN203553209U Novel LED packaging body
04/16/2014CN203553176U Multi-chip diode
04/16/2014CN203553168U Wafer inverted integrated LED display package module
04/16/2014CN203553167U Airtight encapsulation structure of Hall hybrid integrated circuit
04/16/2014CN203553166U Novel LED light source
04/16/2014CN203553165U Improved LED silica gel luminous chip structure
04/16/2014CN203553164U High color rendering led filament
04/16/2014CN203553163U Improved LED silica gel chip packaging structure
04/16/2014CN203553162U High luminous efficiency high-power integrated LED with uniform light spot
04/16/2014CN203553161U Upside-down mounting LED lamp strip
04/16/2014CN203553160U Forward mounting LED lamp strip
04/16/2014CN203553159U High-colour-rendering-index LED (light-emitting diode) lamp
04/16/2014CN203553158U Self-heat-dissipation light emitting diode (LED) light source
04/16/2014CN203553157U Stack-up assembled power modules
04/16/2014CN203553150U Integrated circuit with multichip assembly
04/16/2014CN103733335A LED mixing chamber with reflective walls formed in slots
04/16/2014CN103733334A Connecting element for a multi-chip module, and multi-chip module
04/16/2014CN103733333A Semiconductor device and method for producing semiconductor device
04/16/2014CN103730559A Method for arranging LED arrays and LED arrays arranged on PCB
04/16/2014CN103730457A Semiconductor storage device and method for producing the same
04/16/2014CN103730456A High-pressure-resistant photoelectric coupler
04/16/2014CN103730455A Stacked chip image sensor with light-sensitive circuit elements on the bottom chip
04/16/2014CN103730454A LED with functions of adjusting color temperature and improving color rendering
04/16/2014CN103730453A Semiconductor device having sensing functionality
04/16/2014CN103730452A Organic light-emitting device and dimming method
04/16/2014CN103730451A Multi-chip packaging body and packaging method
04/16/2014CN103730443A Area array quad flat no lead package (AAQFN) IC chip package in package (PiP) piece with solder balls and production method
04/16/2014CN103730442A Area array quad flat no lead package (AAQFN) package body package in package (PiP) piece with solder balls and production method
04/16/2014CN103730439A IC power supply chip
04/16/2014CN103727438A LED lamp and manufacturing method
04/16/2014CN102468284B Stacked semiconductor device and method for manufacturing same
04/16/2014CN102290504B Chip-on-board (COB) packaged light-emitting diode (LED) module based on high-thermal-conductivity substrate flip-chip bonding technique and production method
04/16/2014CN102263085B Packaging structure and process
04/16/2014CN102255035B Multi-LED chip packaging structure on substrate
04/16/2014CN102237343B Semiconductor package realizing connection by connecting sheets and manufacturing method for semiconductor package
04/16/2014CN102203942B Lighting device using solid state light emitting devices having a transparent heat sink
04/16/2014CN102194812B Light-emitting diode (LED) packaging piece and lamp thereof
04/16/2014CN101127344B Integrated circuit (IC) package and stacking IC packages device and manufacture method
04/15/2014US8698295 Super high-density module with integrated wafer level packages
04/15/2014US8698288 Flexible substrate with crimping interconnection
04/15/2014US8698253 Semiconductor device with STI and method for manufacturing the semiconductor device
04/15/2014US8697492 No flow underfill
04/10/2014WO2014055777A1 Electrostatic protection for stacked multi-chip integrated circuits
04/10/2014WO2014054609A1 Semiconductor circuit board, semiconductor device using same, and method for producing semiconductor circuit board
04/10/2014WO2014054451A1 Semiconductor device and method for manufacturing same
04/10/2014WO2014054212A1 Semiconductor device and manufacturing method therefor
04/10/2014WO2014053951A1 Wavelength converting element comprising ceramic capsule
04/10/2014WO2014053445A1 Method for producing a light-emitting diode display and light-emitting diode display
04/10/2014WO2014020479A3 Post-cmos processing and 3d integration based on dry-film lithography
04/10/2014US20140099753 Techniques for packaging multiple device components
04/10/2014US20140098538 Cooling of semiconductor devices
04/10/2014US20140097892 Double patterning compatible colorless m1 route
04/10/2014US20140097891 Reconfiguring through silicon vias in stacked multi-die packages
04/10/2014US20140097547 Semiconductor device
04/10/2014US20140097544 Side Stack Interconnection for Integrated Circuits and The Like
04/10/2014US20140097535 Stacked multi-chip integrated circuit package
04/10/2014US20140097533 Pop Package Structure
04/10/2014US20140097530 Integrated circuit package
04/10/2014US20140097451 Proximity sensor and circuit layout method thereof
04/10/2014DE102013111157A1 Halbleiter-Package und Verfahren zu dessen Herstellung The semiconductor package and method for its production
04/10/2014DE102013015960A1 Power module for motor cars, has electrical terminals arranged on upper surface of semiconductor chip, which is provided under carrier and embedded into cavity, and carrier provided with circuit board
04/10/2014DE102012224432A1 Electric circuit has contact structure provided with contact portion that is formed on front side of protective layer facing away from front side of solar cell
04/10/2014DE102012218457A1 Optoelektronisches bauelement und verfahren zu seiner herstellung Optoelectronic component and process for its preparation
04/10/2014DE102012218413A1 Lighting device i.e. LED lamp, has carrier supporting semiconductor light source, and semiconductor light source arranged with one of metallization regions, where additive is added to device for increasing thermal conductivity of device
04/10/2014DE102011076324B4 Leistungselektronisches System mit Verbindungseinrichtung erster und zweiter Subsysteme Power electronic system with connection means, first and second subsystems
04/10/2014DE102011076323B4 Leistungselektronisches System mit erstem und zweitem Subsystem Electronic power system having first and second subsystem
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