| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 10/18/1994 | US5356838 Stacked semiconductor chips |
| 10/13/1994 | WO1994023447A1 Warp-resistent ultra-thin integrated circuit package fabrication method |
| 10/12/1994 | EP0619608A2 Circuit board for optical devices |
| 10/12/1994 | CN2179635Y Pressure connecting 3-phase semi-bridge rotary commutating module |
| 10/12/1994 | CN1093506A Inverter device |
| 10/11/1994 | US5354695 Membrane dielectric isolation IC fabrication |
| 10/11/1994 | US5353498 Method for fabricating an integrated circuit module |
| 10/04/1994 | US5353196 Method of assembling electrical packaging structure and liquid crystal display device having the same |
| 10/04/1994 | US5353194 Modular power circuit assembly |
| 10/04/1994 | US5352998 Microwave integrated circuit having a passive circuit substrate mounted on a semiconductor circuit substrate |
| 10/04/1994 | US5352632 Multichip packaged semiconductor device and method for manufacturing the same |
| 09/28/1994 | EP0617467A2 High frequency module and method of producing the same |
| 09/27/1994 | US5350946 Semiconductor device with correct case placement feature |
| 09/27/1994 | US5350916 Optoelectronic device and method of manufacturing same with an electrically insulating medium having a strip-shaped flexible foil |
| 09/27/1994 | CA2011647C Rectifier structure |
| 09/21/1994 | EP0616376A1 Wafer bonding of light emitting diode layers |
| 09/21/1994 | EP0396641B1 Acceleration-resistant packaging for integrated circuits and process for manufacturing it |
| 09/20/1994 | US5349509 Indicator element |
| 09/20/1994 | US5349233 Lead frame and semiconductor module using the same having first and second islands and three distinct pluralities of leads and semiconductor module using the lead frame |
| 09/20/1994 | US5349230 Diode circuit for high speed switching transistor |
| 09/14/1994 | EP0487556B1 Arrangement of a valve stack for high voltage direct current in a valve hall |
| 09/13/1994 | US5347429 Plastic-molded-type semiconductor device |
| 09/13/1994 | US5347428 Module comprising IC memory stack dedicated to and structurally combined with an IC microprocessor chip |
| 09/13/1994 | US5347160 Power semiconductor integrated circuit package |
| 09/13/1994 | US5347159 Semiconductor chip assemblies with face-up mounting and rear-surface connection to substrate |
| 09/13/1994 | US5347158 Semiconductor device having a particular terminal arrangement |
| 09/13/1994 | US5346402 Electronic circuit device and manufacturing method thereof |
| 09/07/1994 | EP0614220A2 Multichip module |
| 09/07/1994 | EP0614190A1 Semiconductor memory module and component |
| 09/07/1994 | CN1091869A Inverter apparatus for electric rolling stock |
| 09/07/1994 | CN1091867A Inverter apparatus |
| 09/06/1994 | US5345365 Interconnection system for high performance electronic hybrids |
| 09/06/1994 | US5345107 Cooling apparatus for electronic device |
| 09/06/1994 | US5344497 Line-focus photovoltaic module using stacked tandem-cells |
| 08/30/1994 | US5343366 Packages for stacked integrated circuit chip cubes |
| 08/30/1994 | US5343075 Composite stacked semiconductor device with contact plates |
| 08/25/1994 | DE4314913C1 Method for producing a semiconductor component having a contact structure for vertical contact-making with other semiconductor components |
| 08/25/1994 | DE4314907C1 Method for producing semiconductor components making electrically conducting contact with one another vertically |
| 08/17/1994 | EP0611198A1 Cooling device for electrical power components |
| 08/17/1994 | EP0611129A2 Embedded substrate for integrated circuit modules |
| 08/17/1994 | EP0610709A1 Process of manufacturing tri-dimensional circuit devices |
| 08/17/1994 | EP0610631A1 Electrical connector |
| 08/16/1994 | US5339218 Surface mount device |
| 08/16/1994 | US5337467 Method of producing wire-bonded substrate assembly |
| 08/10/1994 | EP0609528A1 Low inductance semiconductor package |
| 08/10/1994 | EP0609432A1 Power semiconductor packaging |
| 08/09/1994 | US5337217 Integrated circuit package for an image sensor |
| 08/04/1994 | WO1994017557A1 Thermally matched readout/detector assembly and method for fabricating same |
| 08/04/1994 | WO1994017553A1 Three dimensional integrated circuit and method of fabricating same |
| 08/04/1994 | WO1994017551A1 Intermediate-temperature diffusion welding |
| 08/04/1994 | WO1994017549A1 Off-chip conductor structure and fabrication method for large integrated microcircuits |
| 08/04/1994 | WO1994017427A1 Sensor for detecting the intensity and angle of incidence of solar radiation |
| 08/03/1994 | EP0608440A1 Semiconductor device having a plurality of chips having identical circuit arrangements sealed in package |
| 08/02/1994 | US5335361 Integrated circuit module with devices interconnected by electromagnetic waves |
| 08/02/1994 | US5334875 Stacked semiconductor memory device and semiconductor memory module containing the same |
| 07/27/1994 | EP0593666A4 Fabricating electronic circuitry unit containing stacked ic layers having lead rerouting |
| 07/26/1994 | US5332922 Multi-chip semiconductor package |
| 07/26/1994 | US5332921 Resin-seal type semiconductor device |
| 07/21/1994 | WO1994011929A3 Optoelectronic devices |
| 07/19/1994 | US5331231 Rectifier device for three-phase generators in vehicles |
| 07/19/1994 | US5331149 Eye tracking system having an array of photodetectors aligned respectively with an array of pixels |
| 07/14/1994 | DE4300516A1 Power semiconductor module with insulating substrate |
| 07/13/1994 | EP0605987A2 Surface mountable integrated circuit package with integrated battery mount |
| 07/13/1994 | EP0605982A2 Multi-chip module board |
| 07/13/1994 | EP0605712A1 Packaging electrical components |
| 07/13/1994 | EP0308465B1 Detector buffer board |
| 07/13/1994 | CN2171922Y Scintillation luminous diode package |
| 07/12/1994 | US5329170 Balanced circuitry for reducing inductive noise of external chip interconnections |
| 07/12/1994 | US5329160 Semiconductor package with metalized portions |
| 07/12/1994 | US5329131 Opto-electronic coupler having improved moisture protective housing |
| 07/12/1994 | US5328549 Method of producing sheets of crystalline material and devices made therefrom |
| 07/12/1994 | CA2003229C Method for mounting an electronic component and memory card using same |
| 07/07/1994 | WO1994015434A1 Pixel, video display screen and power delivery |
| 07/05/1994 | US5327327 Three dimensional assembly of integrated circuit chips |
| 07/05/1994 | US5327325 Three-dimensional integrated circuit package |
| 07/05/1994 | US5327010 IC card having adhesion-preventing sheets |
| 06/30/1994 | DE4342818A1 Zusammengesetztes elektronisches Bauteil The composite electronic component |
| 06/29/1994 | EP0603973A2 Method of manufacturing a semiconductor device provided with a number of pn junctions separated each time by depression, and semiconductor device provided with a number of pn junctions separated each time by a depression. |
| 06/28/1994 | US5325265 High performance integrated circuit chip package |
| 06/28/1994 | US5324962 Multi-color semiconductor light emitting device |
| 06/28/1994 | US5324936 Hybrid optical/electrical circuit module with thermal insulation |
| 06/28/1994 | US5324687 Method for thinning of integrated circuit chips for lightweight packaged electronic systems |
| 06/28/1994 | US5323532 Method for providing novel hybrid circuit assembly carrier bracket |
| 06/23/1994 | WO1994014227A1 High power laminated bus assembly for an electrical switching converter |
| 06/22/1994 | EP0602338A1 Semiconductor devices and electronic system incorporating them |
| 06/21/1994 | US5323060 Multichip module having a stacked chip arrangement |
| 06/21/1994 | US5322572 Monolithic tandem solar cell |
| 06/21/1994 | US5321884 Multilayered flexible circuit package |
| 06/16/1994 | DE4242098A1 Electroforming of stacked thyristor diodes for long-term reliability - involves application of excessive current pulse to one chip of stack which has weak point with e.g. uncompensated surface charges |
| 06/15/1994 | EP0596075A4 Non-conductive end layer for integrated stack of ic chips |
| 06/14/1994 | US5321299 Hybrid integrated circuit device |
| 06/09/1994 | WO1994013121A1 Module comprising ic memory stack dedicated to and structurally combined with an ic microprocessor |
| 06/08/1994 | EP0600488A2 Lead frame capacitor and capacitively-coupled isolator circuit using same |
| 06/08/1994 | CN1024957C Apparatus for providing electrical conduits in compact arrays of electronic circuitry utilizing cooling devices |
| 06/07/1994 | US5319243 Electronic assembly with first and second substrates |
| 06/07/1994 | US5319182 Optical information detecting apparatus |
| 06/01/1994 | EP0598914A1 Three-dimensional printed circuit board, electronic circuit package using this board, and method for manufacturing this board |
| 05/31/1994 | US5317236 Single crystal silicon arrayed devices for display panels |
| 05/31/1994 | US5317176 Power transistor having multifinger contacts |
| 05/26/1994 | WO1994011929A2 Optoelectronic devices |