Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
11/1996
11/05/1996US5572068 Integrated double-chip semiconductor package and method for fabricating same
11/05/1996US5571754 Method of fabrication of endcap chip with conductive, monolithic L-connect for multichip stack
11/05/1996US5571741 Membrane dielectric isolation IC fabrication
11/05/1996US5570505 Method of manufacturing a circuit module
11/05/1996CA2055802C Cooling structure for electronics devices
10/1996
10/31/1996WO1996034413A1 Encapsulation of transmitter and receiver modules
10/31/1996WO1996034411A1 Chip cover
10/31/1996WO1996034409A1 Chip cover
10/31/1996WO1996027210A3 Electronic component comprising a thin-film structure with passive elements
10/31/1996CA2216903A1 Encapsulation of transmitter and receiver modules
10/30/1996EP0740343A2 Structure of chip on chip mounting preventing crosstalk noise
10/30/1996EP0740338A2 Composite integrated circuit device
10/29/1996US5570274 High density multichip module packaging structure
10/29/1996US5570273 Surface mountable integrated circuit package with low-profile detachable module
10/24/1996WO1996033516A1 Organic light-emitting devices
10/23/1996EP0739043A2 Light source and technique for mounting light emitting diodes
10/23/1996EP0739042A1 Method of fabrication of a solar module
10/22/1996US5568617 Processor element having a plurality of processors which communicate with each other and selectively use a common bus
10/22/1996US5568363 Surface mount components and semifinished products thereof
10/22/1996US5568356 Stacked module assembly including electrically interconnected switching module and plural electronic modules
10/22/1996US5567657 Fabrication and structures of two-sided molded circuit modules with flexible interconnect layers
10/22/1996US5567654 Method and workpiece for connecting a thin layer to a monolithic electronic module's surface and associated module packaging
10/22/1996US5567653 Process for aligning etch masks on an integrated circuit surface using electromagnetic energy
10/17/1996WO1996032746A1 Integrated circuit packages
10/17/1996WO1996032745A1 Chip stack and method of making same
10/17/1996DE19522173C1 Power semiconductor module
10/17/1996DE19513678A1 IR detector appts. for earth observation and earth pattern recognition
10/17/1996DE19511775C1 Trägermodul, insb. zum Einbau in einen kartenförmigen Datenträger, mit Schutz gegen die Untersuchung geheimer Bestandteile Carrier module, esp. For installation in a card-shaped disk with protection against the investigation secret ingredients
10/16/1996EP0738008A2 Semiconductor power module
10/16/1996CN1133498A Installation for circuit elements
10/16/1996CN1133493A Silicon semiconductor bridge rectifier with base plate structure
10/15/1996US5566051 Ultra high density integrated circuit packages method and apparatus
10/15/1996US5565706 LSI package board
10/15/1996US5565705 Electronic module for removing heat from a semiconductor die
10/15/1996US5564819 LED lamp and arrangement for mounting LED lamps on a substrate
10/15/1996US5564617 Method and apparatus for assembling multichip modules
10/09/1996EP0736903A2 Three-dimensional multi-chip module having stacked semiconductor chips and process of fabrication thereof
10/09/1996EP0736899A2 Method of mounting semiconductor chips in an image scanner
10/08/1996US5563447 High power semiconductor switch module
10/08/1996US5563414 X-ray image sensor
10/08/1996US5563380 Apparatus for mounting integrated circuit chips on a Mini-Board
10/08/1996US5563086 Integrated memory cube, structure and fabrication
10/08/1996US5563084 Method of making a three-dimensional integrated circuit
10/08/1996US5563076 Process for adjusting heights of plural semiconductor devices on a circuit board
10/03/1996WO1996031101A1 A method to prevent intrusions into electronic circuitry
10/03/1996WO1996031100A1 Package of electronic device
10/03/1996WO1996030944A2 Support module
10/03/1996WO1996030942A1 Components for housing an integrated circuit device
10/02/1996EP0734586A1 Method for fabricating self-assembling microstructures
10/02/1996DE19608898A1 Variable colour LED indication device
10/01/1996US5561622 Integrated memory cube structure
10/01/1996US5561593 Z-interface-board
10/01/1996US5561592 Hybrid integrated circuit module
10/01/1996US5561591 Multi-signal rail assembly with impedance control for a three-dimensional high density integrated circuit package
09/1996
09/26/1996WO1996022669A3 Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages
09/25/1996EP0734077A1 Multi-layer type light emitting device
09/25/1996EP0734066A1 Electronic power module
09/24/1996US5559374 Hybrid integrated circuit
09/24/1996US5559371 Arrangement for premounting disk-shaped cell semiconductors contactable by pressure
09/24/1996US5559305 Semiconductor package having adjacently arranged semiconductor chips
09/24/1996US5558155 Cooling apparatus and assembling method thereof
09/22/1996CA2172206A1 Electronic power module
09/19/1996WO1996028860A1 A package housing multiple semiconductor dies
09/18/1996EP0732107A2 Circuit substrate shielding device
09/17/1996US5557502 Structure of a thermally and electrically enhanced plastic ball grid array package
09/17/1996US5557114 Optical fet
09/17/1996US5556811 Method of optimizing operating parameters of an integrated circuit package having a voltage regulator mounted thereon
09/11/1996CN1130958A 多芯片模块 A multi-chip module
09/11/1996CN1130822A Monolithic integrated circuit device having microwave power amplifier
09/10/1996US5554886 Lead frame and semiconductor package with such lead frame
09/09/1996CA2171244A1 Variable color led device and led color control device
09/06/1996WO1996027280A1 Thermally and electrically enhanced ball grid package
09/06/1996WO1996027210A2 Electronic component comprising a thin-film structure with passive elements
09/06/1996WO1996027209A1 Arrangement of electronic components on a carrier strip
09/05/1996DE19507132A1 Anordnung von elektronischen Bauelementen auf einem Trägerstreifen Arrangement of electronic components on a carrier strip
09/04/1996EP0730311A2 Wafer bonding of light emitting diode layers
09/04/1996EP0729652A1 Contact structure for interconnections, interposer, semiconductor assembly and method
09/04/1996EP0729644A1 Multi-chip electronic package module utilizing an adhesive sheet
09/04/1996CN1130441A Integrated circuit device
09/03/1996US5552966 Semiconductor device having an interconnecting circuit board and method for manufacturing same
09/03/1996US5552963 Bus communication system for stacked high density integrated circuit packages
09/03/1996US5552637 Semiconductor device
09/03/1996US5552633 Three-dimensional multimodule HDI arrays with heat spreading
08/1996
08/28/1996EP0729184A2 Semiconductor package stack module and method of producing the same
08/28/1996EP0729183A2 Thin packaging of multi-chip modules with enhanced thermal/power management
08/28/1996EP0729180A2 Packaging multi-chip modules without wirebond interconnection
08/28/1996EP0729179A1 Pressure contact housing for semiconductor component
08/28/1996EP0582704B1 Power semiconductor valve device for outdoor location
08/27/1996US5550711 Ultra high density integrated circuit packages
08/27/1996US5549747 Method of producing sheets of crystalline material and devices made therefrom
08/25/1996CA2166925A1 Thin packaging of multi-chip modules with enhanced thermal/power management
08/22/1996WO1996025839A1 Multiple chip module mounting assembly and computer using same
08/21/1996EP0727830A2 Wafer bonding of light emitting diode layers
08/21/1996EP0727829A2 Wafer bonding of light emitting diode layers
08/21/1996EP0727819A2 Stucked arranged semiconductor device and manufacturing method for the same
08/20/1996US5548118 Hybrid integrated circuit
08/20/1996US5547906 Methods for producing integrated circuit devices
08/14/1996EP0726642A1 High frequency surface mount transformer-diode power module
08/14/1996EP0725981A1 Component stacking in multi-chip semiconductor packages
08/14/1996EP0725939A1 Head-mounted display system
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