Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
06/1995
06/28/1995EP0660406A2 Manufacture of semiconductor devices and novel lead frame assembly
06/22/1995WO1995017005A1 Method for fabricating self-assembling microstructures
06/22/1995DE4417164C1 High voltage tripping diode used as stationary spark voltage distributor
06/21/1995EP0658937A1 Vertical IC chip stack with discrete chip carriers formed from dielectric tape
06/21/1995EP0658655A1 Illuminated means
06/21/1995CN1029056C Cooling apparatus for electronic elements
06/20/1995US5426566 Multichip integrated circuit packages and systems
06/20/1995US5426563 Three-dimensional multichip module
06/20/1995US5426072 Process of manufacturing a three dimensional integrated circuit from stacked SOI wafers using a temporary silicon substrate
06/14/1995EP0657797A2 Clock distribution system for synchronous circuit assemblies
06/13/1995US5424920 Non-conductive end layer for integrated stack of IC chips
06/13/1995US5424917 Semiconductor device and method for mounting semiconductor wafer
06/13/1995US5424594 Vehicle alternator output rectifier instrument capable of high temperature operation
06/13/1995US5424580 Electro-mechanical assembly of high power and low power IC packages with a shared heat sink
06/13/1995US5424579 Semiconductor device having low floating inductance
06/13/1995US5424573 Semiconductor package having optical interconnection access
06/13/1995US5423119 Method for manufacturing a hybrid circuit charge-coupled device image sensor
06/07/1995EP0656658A1 High density memory structure
06/07/1995EP0656150A1 Metal electronic package incorporating a multi-chip module
06/06/1995US5422515 Semiconductor module including wiring structures each having different current capacity
06/06/1995US5422514 Packaging and interconnect system for integrated circuits
06/06/1995US5422435 Circuit assembly
06/06/1995US5421079 High density, high performance memory circuit package
06/01/1995DE4410947C1 Vertical integration semiconductor element
05/1995
05/30/1995US5420754 Stacked board assembly for computing machines, including routing boards
05/30/1995US5420751 Ultra high density modular integrated circuit package
05/30/1995US5419806 Method for manufacturing a three-dimensional circuit apparatus
05/26/1995WO1995014314A1 Contact structure for interconnections, interposer, semiconductor assembly and method
05/26/1995WO1995014309A1 Multi-chip electronic package module utilizing an adhesive sheet
05/24/1995EP0654821A2 Electronic device having co-planar heatsink and electrical contacts
05/24/1995EP0654178A1 Arrangement for the preassembled construction of pressure-contactable disc-cell semiconductors
05/23/1995US5418384 Light-source device including a linear array of LEDs
05/17/1995EP0653905A1 Direct chip attach module
05/17/1995EP0653586A1 Multiple light emitting diode module
05/17/1995EP0653104A1 Chip module
05/10/1995EP0652630A2 Semiconductor stack
05/10/1995CN1102467A Indicating lamp of light-emitting diodo (LED)
05/09/1995US5414637 Intra-module spare routing for high density electronic packages
05/09/1995US5414616 Inverter with reduced wiring inductance and increased current balance between semiconductor switching elements
05/02/1995US5412539 Multichip module with a mandrel-produced interconnecting decal
04/1995
04/27/1995WO1995011523A1 A thin multichip module
04/27/1995DE4335822A1 Electronic module with IC
04/26/1995EP0649590A1 Component module
04/26/1995EP0649565A1 Fitting unit for multilayer hybrid circuit with power components
04/25/1995US5410453 Lighting device used in an exit sign
04/25/1995US5410451 Location and standoff pins for chip on tape
04/25/1995US5410450 Internal wiring structure of a semiconductor device
04/25/1995US5410449 Heatsink conductor solder pad
04/25/1995US5410107 Electrical interconnection medium
04/19/1995EP0649215A1 Semiconductor apparatus
04/19/1995EP0649171A2 Multichip module with a mandrel-produced interconnecting decal
04/18/1995US5408383 Container for electronic devices having a plurality of circuit boards
04/18/1995US5408128 High power semiconductor device module with low thermal resistance and simplified manufacturing
04/18/1995US5408126 Manufacture of semiconductor devices and novel lead frame assembly
04/18/1995US5408123 Functional chip to be used while stacked on another chip and stack structure formed by the same
04/12/1995EP0647357A1 Semiconductor chip encapsulation method, device produced by this method and its application to three dimensional chip interconnection
04/11/1995US5406543 Optical head with semiconductor laser
04/11/1995US5406027 Mounting structure and electronic device employing the same
04/06/1995WO1995009438A1 Three-dimensional processor using transferred thin film circuits
04/06/1995CA2173123A1 Three-dimensional processor using transferred thin film circuits
04/05/1995EP0646963A1 Multi-chip module and manufacturing method thereof
04/05/1995EP0646958A2 Semiconductor package and module and method for fabricating
04/04/1995US5404282 Multiple light emitting diode module
04/04/1995US5403784 Process for manufacturing a stacked multiple leadframe semiconductor package using an alignment template
04/04/1995US5403782 Surface mountable integrated circuit package with integrated battery mount
04/04/1995US5403729 Fabricating a semiconductor with an insulative coating
03/1995
03/29/1995EP0645827A2 Optocoupler and process of manufacturing the same
03/29/1995EP0645816A1 Semiconductor device comprising a plurality of semiconductor elements
03/29/1995EP0645815A2 High power semiconductor switch module
03/29/1995EP0645814A2 Semiconductor power switching device module
03/28/1995US5401688 Semiconductor device of multichip module-type
03/28/1995US5401672 Process of bonding semiconductor wafers having conductive semiconductor material extending through each wafer at the bond areas
03/23/1995WO1995008189A1 Multi-chip module
03/22/1995EP0644548A2 Integrated memory cube, structure and fabrication
03/22/1995EP0644547A2 Integrated multichip memory module, structure and fabrication
03/22/1995EP0630521A4 Three dimensional, multi-chip module.
03/21/1995US5400218 Device for the 3D encapsulation of semiconductor chips
03/15/1995EP0643422A1 Method and system for protecting integrated circuits
03/15/1995EP0642699A1 Process for the manufacture of a solid-state device including at least one chip, and corresponding device
03/14/1995US5398169 Microelectronic package comprising metal housing grounded to board edge
03/14/1995US5398160 Compact power module with a heat spreader
03/14/1995US5397916 Semiconductor device including stacked die
03/14/1995US5397747 Vertical chip mount memory package and method
03/14/1995US5397745 Method of making electronic power device realized by a series of elementary semiconductor components connected in parallel
03/08/1995EP0642178A2 Semiconductor device for converting light and radiations into electricity
03/08/1995EP0642166A2 On circuit board mounted multichip module
03/08/1995EP0642164A2 Stackable vertical thin package/plastic molded lead-on-chip memory cube
03/08/1995EP0642163A1 Three dimensional electronic components assembly method by means of microwire loops and solder elements
03/08/1995EP0641485A1 Membrane dielectric isolation ic fabrication
03/07/1995US5396433 Apparatus and method for assembling and checking microwave monolithic integrated circuit (MMIC) module
03/07/1995US5396102 Semiconductor device
03/07/1995US5396032 Method and apparatus for providing electrical access to devices in a multi-chip module
03/07/1995US5395800 Method for assembling semiconductor devices with lead frame containing common lead arrangement
03/07/1995US5394608 Laminated semiconductor device and fabricating method thereof
03/01/1995EP0609432A4 Power semiconductor packaging.
03/01/1995CN2190823Y Two side integrated rectifier
02/1995
02/28/1995US5394303 Semiconductor device
02/28/1995US5394010 Semiconductor assembly having laminated semiconductor devices
02/23/1995WO1995005677A1 Method for interconnecting semi-conductor pads in three dimensions and component thus obtained
02/23/1995WO1995005676A1 Stack of ic chips as substitute for single ic chip
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