| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 08/12/1992 | EP0498700A1 Method of manufacturing an opto-electronic device |
| 08/12/1992 | EP0498446A2 Multichip packaged semiconductor device and method for manufacturing the same |
| 08/12/1992 | EP0498329A1 High tension wave-trap diode |
| 08/11/1992 | US5138438 Lead connections means for stacked tab packaged IC chips |
| 08/11/1992 | US5138436 Interconnect package having means for waveguide transmission of rf signals |
| 08/11/1992 | US5138433 Multi-chip package type semiconductor device |
| 08/11/1992 | US5138210 Rotatable rectifier assembly |
| 08/06/1992 | WO1992013363A2 Light emitting diode bars and arrays and method of making same |
| 08/04/1992 | US5135878 Diffusion barrier of TA-SI-N; reliability |
| 08/04/1992 | US5135556 Method for making fused high density multi-layer integrated circuit module |
| 07/29/1992 | EP0496491A1 Leadless chip resistor capacitor carrier for hybrid circuits and a method of making the same |
| 07/28/1992 | US5134463 Soldering semiconductor chip to electrode |
| 07/28/1992 | CA1305777C Circuit arrangement having a plurality of electrical elements to be cooled |
| 07/23/1992 | WO1992012453A1 Single crystal silicon arrayed devices for display panels |
| 07/23/1992 | WO1992003848A3 Stacking of integrated circuits |
| 07/22/1992 | EP0495629A1 Vertical lead-on-chip package |
| 07/22/1992 | EP0266412B1 Surface mountable diode |
| 07/22/1992 | CN2110928U Semiconductor illuminator |
| 07/21/1992 | US5132879 Secondary board for mounting of components having differing bonding requirements |
| 07/15/1992 | EP0494251A1 Hybrid module electronics package |
| 07/14/1992 | US5130894 Three-dimensional circuit modules |
| 07/14/1992 | US5130784 Semiconductor device including a metallic conductor for preventing arcing upon failure |
| 07/14/1992 | US5130761 Led array with reflector and printed circuit board |
| 07/08/1992 | EP0493876A2 Reducing circuit path crossovers in stacked multiprocessor board arrays |
| 07/07/1992 | US5128831 High-density electronic package comprising stacked sub-modules which are electrically interconnected by solder-filled vias |
| 07/07/1992 | US5128749 Fused high density multi-layer integrated circuit module |
| 07/01/1992 | EP0493015A2 LED array type light source |
| 07/01/1992 | EP0492933A2 Multichip module |
| 07/01/1992 | EP0492558A2 Semiconductor device comprising a high speed switching bipolar transistor |
| 06/30/1992 | US5127008 Integrated circuit driver inhibit control test method |
| 06/30/1992 | US5126823 Lead frame having at least two islands and resin molded semiconductor device using it |
| 06/30/1992 | US5125153 Method of making a hybrid electronic array |
| 06/25/1992 | WO1992010853A1 Method and device for three-dimensionally interconnecting integrated circuits |
| 06/24/1992 | EP0491262A2 Semiconductor module |
| 06/24/1992 | EP0491161A1 Interconnect package for circuitry components |
| 06/23/1992 | US5124782 Integrated circuit package with molded cell |
| 06/23/1992 | US5124603 Rotating rectifier assembly |
| 06/23/1992 | US5123968 Tandem photovoltaic solar cell with III-V diffused junction booster cell |
| 06/17/1992 | EP0490739A1 Interconnection method and device for three-dimensional integrated circuits |
| 06/17/1992 | EP0490499A1 Integrated circuit package with molded battery cell |
| 06/17/1992 | CN2107717U Band light testing semiconductor luminophor |
| 06/16/1992 | US5123074 Substrate for mounting optical components and electric circuit components thereon and method for making same |
| 06/10/1992 | EP0489643A1 Solid state memory modules and memory devices having such modules |
| 06/09/1992 | US5121293 Method and apparatus for interconnecting devices using tab in board technology |
| 06/09/1992 | US5121188 Laser module assembly |
| 06/09/1992 | US5120925 Methods for device transplantation |
| 06/04/1992 | DE4038168A1 Multi-chip module with drawn-out terminal contacts - has chip(s) deposited on semiconductor substrate, which carries wiring plane(s) for chip contacting |
| 06/03/1992 | EP0488319A1 Multichip module |
| 06/03/1992 | EP0488193A1 Hermetic modular package |
| 06/03/1992 | EP0487556A1 Arrangement of a valve stack for high voltage direct current in a valve hall. |
| 06/02/1992 | US5119286 Modular circuit board |
| 06/02/1992 | US5119175 High power density solid-state, insulating coolant module |
| 06/02/1992 | US5119174 Light emitting diode display with PCB base |
| 06/02/1992 | US5118361 Terrestrial concentrator solar cell module |
| 05/31/1992 | CA2054369A1 Hermetic modular package |
| 05/29/1992 | WO1992009099A1 Method of manufacturing semiconductor elements, in particular diodes |
| 05/27/1992 | EP0486829A2 Semiconductor device and semiconductor device packaging system |
| 05/26/1992 | CA1301949C Device for interconnection and protection of a bare microwave componentchip |
| 05/21/1992 | DE4036222A1 Verfahren zur herstellung von halbleiterelementen, insbesondere von dioden A process for the production of semiconductor elements, in particular diodes |
| 05/20/1992 | EP0486273A1 Package for microwave IC |
| 05/19/1992 | US5115300 High-power semiconductor device |
| 05/19/1992 | US5115298 Packaged integrated circuit with encapsulated electronic devices |
| 05/17/1992 | CA2054089A1 Interconnect package for circuitry components |
| 05/14/1992 | WO1992008244A1 Distributed light emitting diode flat-screen display for use in televisions and a method of manufacturing thereof |
| 05/12/1992 | US5113466 Molded optical packaging arrangement |
| 05/12/1992 | US5113404 Silicon-based optical subassembly |
| 05/12/1992 | US5113314 High-speed, high-density chip mounting |
| 05/06/1992 | EP0484257A1 Molded package for integrated circuit comprising a device for reducing the dynamic impedance |
| 05/06/1992 | EP0484062A1 A semiconductor device comprising two integrated circuit packages |
| 05/05/1992 | US5111278 Three-dimensional multichip module systems |
| 05/05/1992 | CA1299914C Hot melt ink supply system |
| 04/28/1992 | US5109455 Optic interface hybrid |
| 04/28/1992 | US5109318 Pluggable electronic circuit package assembly with snap together heat sink housing |
| 04/28/1992 | US5107586 Method for interconnecting a stack of integrated circuits at a very high density |
| 04/22/1992 | EP0481552A1 Infrared detector devices |
| 04/22/1992 | EP0476136A4 Three-dimensional electronic unit and method of construction |
| 04/16/1992 | WO1992006496A1 Multi-film hybrid circuit with power components |
| 04/16/1992 | DE4032370A1 Compact IC or IC module circuit configuration - uses Kautz cells accommodating rotation of identical IC or IC modules about symmetry axis |
| 04/15/1992 | EP0480372A1 Semiconductor rectifying device and full-wave rectifier fabricated using the same |
| 04/14/1992 | US5105261 Semiconductor device package having particular lead structure for mounting multiple circuit boards |
| 04/14/1992 | US5104820 Method of fabricating electronic circuitry unit containing stacked IC layers having lead rerouting |
| 04/09/1992 | DE4131570A1 Rectifier bridge for vehicle alternator - has identical phase conductor connections provided for 2 diode sets on respective plates |
| 04/09/1992 | DE4031814A1 Power semiconductor package with semiconductor support - has metal core with insulated conductor track structures for semiconductor coupling |
| 04/09/1992 | DE4031733A1 Mehrlagenhybride mit leistungsbauelementen Multi-layer hybrid with power devices |
| 04/08/1992 | EP0479205A2 Electronic circuit and method of making same |
| 04/08/1992 | EP0478879A2 A system of interconnecting electrical elements having differing bonding requirements for mounting said elements to a printed circuit board |
| 04/08/1992 | EP0404766B1 Arrangement for detachable fastening modules to a module support |
| 04/07/1992 | US5103289 Dual sip package structures |
| 04/07/1992 | US5103282 Semiconductor integrated circuit device having a gate array with a ram and by-pass signal lines which interconnect a logic section and i/o unit circuit of the gate array |
| 04/07/1992 | US5103247 Semiconductor device |
| 04/07/1992 | US5102831 Method of manufacturing multi-chip package |
| 04/07/1992 | US5102824 Method of manufacturing a distributed light emitting diode flat-screen display for use in televisions |
| 04/01/1992 | EP0478426A1 Method of fabrication for a hybrid module |
| 04/01/1992 | EP0478188A2 Integrated circuit package and compact assemblies thereof |
| 04/01/1992 | EP0478121A2 Signal routing in a stacked array of multiprocessor boards |
| 04/01/1992 | EP0477502A1 Electronic circuit |
| 04/01/1992 | EP0329722B1 Rectifier device |
| 03/31/1992 | US5101244 Semiconductor schottky device with pn regions |
| 03/31/1992 | CA1298392C Resin sealed semiconductor device and a method for making the same |
| 03/31/1992 | CA1298377C Miniature device for connecting electrical conductors carrying very high intensity currents |